RoHS Compliant Solder Reflow Profile - SMD Trimpot® Products Process Description Materials 1. Apply solder paste to test board (8 - 10 mil thick) Temperature Time Interval • Sn 96.5 / Ag 3.0 / Cu 0.5 Room temperature Alloy water soluble or no clean solder paste (see note 1) • single sided epoxy glass (G10) (UL approved) • PC board approx. 4x4x.06 in. 2. Place test units onto board 6 units/board 3. Ramp up Convection oven A) Acceptable (see Figure 1) (1) The solder connection wetting angle (solder to component and solder to PCB termination) does not exceed 90 °. (see note 2) 2.5 °C ± 0.5 °/sec. 4. Preheat (TS) 150 °C to 190 °C 90 ± 30 sec. 5. Time above liquidus (TL) 220 °C 60-90 sec. 6. Peak temperature (TP) 250 °C +0 °/-5 ° 10-20 sec. within 5 °C of peak 7. Ramp down 8. Cleaning water clean profile High pressure deionized water 60 PSI max. B) Unacceptable (see Figure 2) (1) Solder connection wetting angle exceeding 90 °. (2) Incomplete reflow of solder paste. (3) Dewetting. 3 °C ± 0.5 °C/sec. If unacceptable, determine cause and correct prior to next run. 72 °F to 160 °F (22 °C to 71 °C) As required NOTES: 1. Parts are not hermetically sealed. The seal is to withstand temporary exposure to board processing. 2. Recommended to be cooled to room temperature prior to board wash but must be below 40 °C. Refer to ref. temperature profile. Temperature at lead/pad junction with “K” type thermocouple. (Derived using 6-zone Convection Oven) 3. Units that are board mounted for environmental testing must see a peak temperature in the reflow zone, as specified. This is to ensure that all test units will see “worst case conditions”. tp TP CRITICAL ZONE T L TO TP RAMP-UP TL tL Temperature (2) Solder balls that do not violate minimum electrical clearances and are attached (soldered) to a metal surface. Room temperature (see note 2) Temperature of Lead/Pad Junction 4. Ramp down rate to be measured from 250 °C to room temperature. TS MAX. RAMP-DOWN TS MIN. Inspect solder joint to determine if solder joint is acceptable (i.e. exhibits wetting of joint’s surface). Use the following criteria (ref. acceptability of printed board assemblies, IPC-A-610): 5. Process Description 8 does not apply to open frame trimmers. ts PREHEAT 6. Allow 3-6 inches minimum distance between the nozzle head and the device. TROOM 8 MINS./248.9 °C t 25 *C TO PEAK Time 90 ° 90 ° FIGURE 1 - ACCEPTABLE 90 ° or < 90 ° > 90 ° < 90 ° FIGURE 2 - UNACCEPTABLE > 90 ° REV. 02/13 Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications.