MATERIAL DECLARATION ESD Suppressing Device Material Number CD143A-SR3.3 Product Line Semiconductor Products Compliance Date RoHS Compliant 2013/8/2 Yes MSL 3 No. Construction Element(subpart) Homogeneous Material Material weight [g] Homogeneous Material\ Substances 1 Wafer Silicon 0.0003500 Silicon 0.0000303 0.0000455 0.0000027 0.0036736 0.0000379 0.0001488 0.0000875 2 Lead frame Copper Alloy 3 Epoxy Polymer Material s Mass % Material Mass % of total unit wt. 7440-21-3 100.00% 3.16% Nickel 7440-02-0 0.80% 0.28% Tin Phosphorus Copper Silver Silicon dioxide Epoxy resin Aromatic Amine Epoxy resin modifier 7440-31-5 7723-14-0 7440-50-8 7440-22-4 14808-60-7 Proprietary 1.20% 0.07% 96.93% 1.00% 43.60% 25.64% 0.42% 0.02% 33.15% 0.34% 1.35% 0.79% Proprietary 15.38% 0.47% Proprietary 15.38% 0.47% 0.0000006 Palladium 7440-05-3 2.00% 0.005% 0.0000274 0.0051888 0.0006486 0.0006291 Copper Silica Epoxy Resin Phenolic Resin 7440-50-8 60676-86-0 Trade Secret Trade Secret 98.00% 80.00% 10.00% 9.70% 0.245% 46.83% 5.85% 5.68% 0.0000195 Carbon Black 1333-86-4 0.30% 0.18% 0.0000525 0.0000525 4 Cu wire Noble metal 5 Mold Compound Polymer Headquarters Riverside CA CASRN if applicable www.bourns.com CASRN: CAS Registry Number® is a Registered Trademark of the American Chemical Society Subpart mass of total wt. (%) 3.16% 34.21% 3.08% 0.25% 58.54% page 1 of 2 MATERIAL DECLARATION 6 Plating plating Total weight This Document was updated on: 0.0000849 Tin 7440-31-5 99.90% 0.759% 0.0000001 Misc., not to declare N/A 0.10% 0.001% 0.76% 0.0110803g 2014/04/16 Important remarks: 1. It is the responsibility of the user to verify they are accessing the latest version. Headquarters Riverside CA www.bourns.com CASRN: CAS Registry Number® is a Registered Trademark of the American Chemical Society page 2 of 2