Various

CHIP DIODES
August, 2013 - Revised April, 2014
Select Diodes
Changes to Die Manufacturing Location, Assembly Location and Materials
In order to meet the increasing demand for several diode products, Bourns proposes to implement the
following changes:
1. Qualification of an alternate silicon manufacturing location
2. Qualification of an alternate assembly location
3. Qualification of Cu wire bonding (in addition to Au)
Not all these changes are applicable to every product; please refer to the table below:
Alternate Assembly
Location
Cu Wire Bonding
CD143A-SR05LC
yes
yes
CD143A-SR2.8
yes
yes
CD143A-SR3.3
yes
yes
Bourns Part Number
Alternate Silicon
Manufacturing Location
CDDFN10-0506N
yes
CDDFN10-0524P
yes
CDDFN2-T5.0LC
yes
CDDFN6-0504P
yes
CDMSP10-0504M
yes
CDSC706-0504C
yes
yes
yes
CDSC706-T05CC
yes
CDSOD323-T05M
yes
yes
CDSOT23-0502B
yes
yes
CDSOT23-0502U
yes
yes
CDSOT236-0502
yes
yes
CDSOT236-0504C
yes
yes
CDSOT236-0504LC
yes
yes
CDSOT563-0502
yes
CDNBS08-SLVU2.8-4
yes
yes
yes
Impact on Form, Fit, Function and Reliability:
The above changes do not affect any of the electrical or mechanical parameters of the products. Form, fit,
function and reliability are not impacted. Part markings and labeling are unchanged.
ESD1315
Select Diodes - Changes to Die Manufacturing Location, Assembly Location and Materials
August, 2013 - Revised April, 2014
Page 2 of 2
Identification of the Changed Products:
Traceability will be ensured through the lot code/date code.
Implementation Dates:
Samples: Available upon request
First date code using above changes: 1405
First production shipments: February 1, 2014
Summary of Qualification Results (Failing Parts/Tested Parts):
Test Item:
Description:
Standard:
MSL
Moisture Sensitivity
Level
JESD22-A113
J-STD22-020D
Baking:
+125 °C, 24 hrs.
PCT w/pre-con
TCT w/pre-con
Temperature Cycle
Test
THT w/pre-con
Thermal/Humidity
Test
HTST without/pre-con Solderability
High Temperature
Solderability Test
Storage Life
JESD 22-A102-C
JESD22-A104B
JESD 22-A101-B
JESD22-A103B
+121 °C, 100 % RH
2atm, 168 hrs.
-65 °C / +150 °C,
500 cycles
+85 °C, 85 % RH,
1000 hrs.
Pressure Cooker Test
JESD22-B102E
Reflow Temp.:
+260 °C -5/+0 °C,
3 times
Test Conditions:
(1) MSL 3,
Moisture Soak:
+60 °C / 60 % RH,
40 hrs.
(2) MSL 3,
Moisture Soak:
+30 °C / 60 % RH,
192 hrs.
+150 °C, 1000 hrs.
Steam Aging:
93 °C (-5/+3 °C) / 8 hrs.
Flux: +245 °C / 5 sec.
(3) MSL 1,
Moisture Soak:
+85 °C / 85 % RH,
168 hrs.
CDSOT236-0502
CD143A-SR05LC
CDDFN10-0524P
CDMSP10-0504M
CDSOT236-0504LC
CDDFN10-0506N
CDSOT23-0502U
CDSOT23-0502B
CDSC706-T05CC
CDSOD323-T05M
CDDFN2-T5.0LC
CDSC706-0504C
CDSOT236-0504C
CDSOT563-0502
CDNBS08-SLVU2.8-4
MSL3 - 0/66 (2)
MSL3 - 0/66 (1)
MSL3 - 0/231 (1)
MSL3 - 0/66 (1)
MSL3 - 0/66 (1)
MSL3 - 0/66 (1)
MSL3 - 0/66 (1)
MSL3 - 0/66 (1)
MSL3 - 0/66 (2)
MSL3 - 0/66 (1)
MSL3 - 0/231 (3)
MSL3 - 0/66 (1)
MSL3 - 0/66 (1)
MSL3 - 0/66 (1)
MSL3 - 0/66 (2)
0/22
0/22
0/77
0/22
0/22
0/22
0/22
0/22
0/22
0/22
0/77
0/22
0/22
0/22
0/22
0/22
0/22
0/77
0/22
0/22
0/22
0/22
0/22
0/22
0/22
0/77
0/22
0/22
0/22
0/22
0/22
0/22
0/77
0/22
0/22
0/22
0/22
0/22
0/22
0/22
0/77
0/22
0/22
0/22
0/22
0/22
0/22
0/77
0/22
0/22
0/22
0/22
0/22
0/22
0/22
0/77
0/22
0/22
0/22
0/22
N/A
0/5
N/A
N/A
N/A
N/A
0/5
0/5
0/5
0/5
0/5
0/5
N/A
0/5
0/5
If you have any questions or need additional information, please feel free to contact Customer Service/Inside
Sales.