CHIP DIODES August, 2013 - Revised April, 2014 Select Diodes Changes to Die Manufacturing Location, Assembly Location and Materials In order to meet the increasing demand for several diode products, Bourns proposes to implement the following changes: 1. Qualification of an alternate silicon manufacturing location 2. Qualification of an alternate assembly location 3. Qualification of Cu wire bonding (in addition to Au) Not all these changes are applicable to every product; please refer to the table below: Alternate Assembly Location Cu Wire Bonding CD143A-SR05LC yes yes CD143A-SR2.8 yes yes CD143A-SR3.3 yes yes Bourns Part Number Alternate Silicon Manufacturing Location CDDFN10-0506N yes CDDFN10-0524P yes CDDFN2-T5.0LC yes CDDFN6-0504P yes CDMSP10-0504M yes CDSC706-0504C yes yes yes CDSC706-T05CC yes CDSOD323-T05M yes yes CDSOT23-0502B yes yes CDSOT23-0502U yes yes CDSOT236-0502 yes yes CDSOT236-0504C yes yes CDSOT236-0504LC yes yes CDSOT563-0502 yes CDNBS08-SLVU2.8-4 yes yes yes Impact on Form, Fit, Function and Reliability: The above changes do not affect any of the electrical or mechanical parameters of the products. Form, fit, function and reliability are not impacted. Part markings and labeling are unchanged. ESD1315 Select Diodes - Changes to Die Manufacturing Location, Assembly Location and Materials August, 2013 - Revised April, 2014 Page 2 of 2 Identification of the Changed Products: Traceability will be ensured through the lot code/date code. Implementation Dates: Samples: Available upon request First date code using above changes: 1405 First production shipments: February 1, 2014 Summary of Qualification Results (Failing Parts/Tested Parts): Test Item: Description: Standard: MSL Moisture Sensitivity Level JESD22-A113 J-STD22-020D Baking: +125 °C, 24 hrs. PCT w/pre-con TCT w/pre-con Temperature Cycle Test THT w/pre-con Thermal/Humidity Test HTST without/pre-con Solderability High Temperature Solderability Test Storage Life JESD 22-A102-C JESD22-A104B JESD 22-A101-B JESD22-A103B +121 °C, 100 % RH 2atm, 168 hrs. -65 °C / +150 °C, 500 cycles +85 °C, 85 % RH, 1000 hrs. Pressure Cooker Test JESD22-B102E Reflow Temp.: +260 °C -5/+0 °C, 3 times Test Conditions: (1) MSL 3, Moisture Soak: +60 °C / 60 % RH, 40 hrs. (2) MSL 3, Moisture Soak: +30 °C / 60 % RH, 192 hrs. +150 °C, 1000 hrs. Steam Aging: 93 °C (-5/+3 °C) / 8 hrs. Flux: +245 °C / 5 sec. (3) MSL 1, Moisture Soak: +85 °C / 85 % RH, 168 hrs. CDSOT236-0502 CD143A-SR05LC CDDFN10-0524P CDMSP10-0504M CDSOT236-0504LC CDDFN10-0506N CDSOT23-0502U CDSOT23-0502B CDSC706-T05CC CDSOD323-T05M CDDFN2-T5.0LC CDSC706-0504C CDSOT236-0504C CDSOT563-0502 CDNBS08-SLVU2.8-4 MSL3 - 0/66 (2) MSL3 - 0/66 (1) MSL3 - 0/231 (1) MSL3 - 0/66 (1) MSL3 - 0/66 (1) MSL3 - 0/66 (1) MSL3 - 0/66 (1) MSL3 - 0/66 (1) MSL3 - 0/66 (2) MSL3 - 0/66 (1) MSL3 - 0/231 (3) MSL3 - 0/66 (1) MSL3 - 0/66 (1) MSL3 - 0/66 (1) MSL3 - 0/66 (2) 0/22 0/22 0/77 0/22 0/22 0/22 0/22 0/22 0/22 0/22 0/77 0/22 0/22 0/22 0/22 0/22 0/22 0/77 0/22 0/22 0/22 0/22 0/22 0/22 0/22 0/77 0/22 0/22 0/22 0/22 0/22 0/22 0/77 0/22 0/22 0/22 0/22 0/22 0/22 0/22 0/77 0/22 0/22 0/22 0/22 0/22 0/22 0/77 0/22 0/22 0/22 0/22 0/22 0/22 0/22 0/77 0/22 0/22 0/22 0/22 N/A 0/5 N/A N/A N/A N/A 0/5 0/5 0/5 0/5 0/5 0/5 N/A 0/5 0/5 If you have any questions or need additional information, please feel free to contact Customer Service/Inside Sales.