MATERIAL DECLARATION SHEET ESD Suppressing Device Material Number CD143A-SR2.8 Product Line Semiconductor Products Compliance Date RoHS Compliant 2013/8/2 Yes MSL 3 if applicable Materials Mass % 0.00035 Homogeneous Material\ Substances Silicon 7440-21-3 100.00% Material Mass % of total unit wt. 3.16% 0.00003 Nickel 7440-02-0 0.80% 0.28% 0.00005 0.000003 0.00367 0.00004 Tin Phosphorus Copper Silver 7440-31-5 7723-14-0 7440-50-8 7440-22-4 1.20% 0.07% 96.93% 1.00% 0.42% 0.02% 33.15% 0.34% 0.00015 Silicon dioxide 14808-60-7 43.60% 1.35% 0.00009 Epoxy resin Aromatic Amine Epoxy resin modifier Proprietary 25.64% 0.79% Proprietary 15.38% 0.47% Proprietary 15.38% 0.47% 0.000001 Palladium 7440-05-3 2.00% 0.005% 0.00003 0.00519 Copper Silica 98.00% 80.00% 0.245% 46.83% 0.00065 Epoxy Resin 10.00% 5.85% 0.00063 Phenolic Resin 7440-50-8 60676-86-0 Trade Secret Trade Secret 9.70% 5.68% 0.00002 Carbon Black 1333-86-4 0.30% 0.18% No. Construction Element(subpart) Homogeneous Material Material weight [g] 1 Wafer Silicon 2 3 Lead frame Epoxy Copper Alloy Polymer 0.00005 0.00005 4 5 Cu wire Mold Compound Headquarters Riverside CA Noble metal Polymer CASRN Subpart mass of total wt. (%) 3.16% 34.21% 3.08% 0.25% 58.54% www.bourns.com page 1 of 2 CASRN: CAS Registry Number® is a Registered Trademark of the American Chemical Society MATERIAL DECLARATION SHEET 6 Plating plating Total weight This Document was updated on: 0.00008 Tin 7440-31-5 99.90% 0.759% 0.0000001 Misc., not to declare N/A 0.10% 0.001% 0.76% 0.0110803g 2013/8/2 Important remarks: 1. It is the responsibility of the user to verify they are accessing the latest version. Headquarters Riverside CA www.bourns.com page 2 of 2 CASRN: CAS Registry Number® is a Registered Trademark of the American Chemical Society