CO M PL IA NT TISP1120F3D *R oH S DUAL FORWARD-CONDUCTING UNIDIRECTIONAL THYRISTOR OVERVOLTAGE PROTECTOR TISP1120F3D Overvoltage Protector Ion-Implanted Breakdown Region - Precise and Stable Voltage 8-SOIC Package (Top View) Low Voltage Overshoot Under Surge Device Name TISP1120F3D 1 8 G NC 2 7 G NC 3 6 G R 4 5 G T Planar Passivated Junctions - Low Off-State Current <10 µA VDRM V(BO) V V -97 -120 MDXX AEB NC - No internal connection Device Symbol Rated for International Surge Wave Shapes R T IPPSM Wave Shape Standard 2/10 GR-1089-CORE 120 A 8/20 IEC 61000-4-5 70 10/160 TIA-968-A 60 10/700 ITU-T K.20/21/45 50 10/560 TIA-968-A 45 10/1000 GR-1089-CORE 35 G SD1XAAa Description This dual forward-conducting unidirectional overvoltage protector is designed for the overvoltage protection of ICs used for the SLIC (Subscriber Line Interface Circuit) function. The IC line driver section is typically powered with 0 V and a negative supply. The TISP1120F3D limits voltages that exceed these supply rails. High voltages can occur on the line as a result of exposure to lightning strikes and a.c. power surges. Negative transients are initially limited by breakdown clamping until the voltage rises to the breakover level, which causes the device to crowbar. The high crowbar holding current helps prevent d.c. latchup as the current subsides. Positive transients are limited by diode forward conduction. These protectors are designed to suppress and withstand the listed international lightning surges on any terminal pair. This monolithic protection device is fabricated in an ion-implanted planar structure to ensure precise and matched breakover control, and is virtually transparent to the system in normal operation. How to Order Device Package Carrier Order As Marking Code Standard Quantity TISP1120F3D 8-SOIC Embossed Tape Reeled TISP1120F3DR-S 1120F3 2500 *RoHS Directive 2002/95/EC Jan 27 2003 including Annex JULY 2005 – REVISED JANUARY 2007 Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. TISP1120F3D Overvoltage Protector Absolute Maximum Ratings, TA = 25 °C (Unless Otherwise Noted) Rating Repetitive peak off-state voltage Symbol Value Unit VDRM -97 V IPPSM 2 x ±120 2 x ±70 2 x ±60 2 x ±50 2 x ±50 2 x ±45 2 x ±35 A Non-repetitive peak impulse current (see Note 1) 2/10 µs (GR-1089-CORE, 2/10 µs voltage wave shape) 8/20 µs (IEC 61000-4-5, combination wave generator, 1.2/50 µs voltage waveshape) 10/160 µs (TIA-968-A, 10/160 µs voltage wave shape) 5/310 µs (ITU-T K.44, 10/700 µs voltage wave shape used in K.20/21/45) 5/320 µs (TIA-968-A, 9/720 µs voltage waveshape) 10/560 µs (TIA-968-A, 10/560 µs voltage wave shape) 10/1000 µs (GR-1089-CORE, 10/1000 µs voltage wave shape) Non-repetitive peak on-state current, 0 °C < TA < 70 °C 1 s, 50 Hz Initial rate of rise of on-state current, linear current ramp, maximum ramp value < 38 A Junction temperature Storage temperature range NOTE: ITSM 2 x 4.3 A diT/dt 250 A/µs TJ -65 to +150 °C Tstg -65 to +150 °C 1. Initially the device must be in thermal equilibrium with 0 °C < T J < 70 °C. The surge may be repeated after the device returns to its initial conditions. Electrical Characteristics for Terminals T and R, TA = 25 °C (Unless Otherwise Noted) Parameter IDRM Repetitive peak off-state current V(BO) Breakover voltage IH Holding current Test Conditions VD = ±V DRM Min Typ Max TA = 25 °C ±5 TA = 70 °C ±10 dv/dt = -250 V/ms, RSOURCE = 300 Ω ±123 IT = ±5 A, di/dt = ±30 mA/ms Unit µA V mA ±150 Electrical Characteristics for Terminals T and G or R and G, TA = 25 °C (Unless Otherwise Noted) Parameter IDRM Repetitive peak off-state current V(BO) Breakover voltage Test Conditions VD = VDRM Min Typ Max TA = 25 °C -5 TA = 70 °C -10 Unit µA dv/dt = -250 V/ms, RSOURCE = 300 Ω -120 V dv/dt ≤ -1000 V/µs, Linear voltage ramp, Maximum ramp value = -500 V di/dt ≤ -20 A/µs, Linear current ramp, Maximum ramp value = -10 A -130 V V(BO) Impulse breakover voltage I(BO) Breakover current IH Holding current VT On-state voltage IT = -5 A, tw = 100 µs -3 V VF Forward voltage IF = +5 A, tw = 100 µs +3 V VFRM Peak forward recovery voltage dv/dt = -250 V/ms, RSOURCE = 300 Ω -100 IT = -5 A, di/dt = +30 mA/ms -150 dv/dt ≤ +1000 V/µs, Linear voltage ramp, Maximum ramp value = +500 V di/dt ≤ +20 A/µs, Linear current ramp, Maximum ramp value = +10 A Off-state capacitance f = 1 MHz, Vd = 1 V rms mA mA +3.3 dv/dt Critical rate of rise of off-state voltage Linear voltage ramp, maximum ramp value < 0.85VDRM CO -600 V -5 kV/µs VD = -2 V 60 65 VD = -50 V 20 25 pF JULY 2005 – REVISED JANUARY 2007 Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. TISP1120F3D Overvoltage Protector Thermal Characteristics, TA = 25 °C (Unless Otherwise Noted) Parameter RθJA Test Conditions Junction to ambient thermal resistance Min Typ Ptot = 0.8 W 5 cm2 FR4 PCB Max Unit 160 °C/W Parameter Measurement Information +i I PPSM Quadrant I Switching Characteristic ITSM ITRM IT V(BO) VT I(BO) IH V (BR)M V DRM -v I(BR) V (BR) V (BR) I(BR) IDRM VD ID ID VD IDRM +v V DRM V (BR)M IH I(BO) VT V(BO) IT ITRM ITSM Quadrant III Switching Characteristic I PPSM -i Figure 1. Voltage-Current Characteristic for the Terminals T and R All Measurements are Referenced to Terminal R JULY 2005 – REVISED JANUARY 2007 Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. PM-TISP4xxx-001-a TISP1120F3D Overvoltage Protector Parameter Measurement Information (Continued) +i Quadrant I Forward Conduction Characteristic IPPSM IFSM IFRM IF VF V (BR)M VD V DRM -v I(BR) V (BR) +v ID IDRM IH I(BO) V(BO) VT IT ITRM ITSM Quadrant III IPPSM Switching Characteristic -i PM-TISP5xxx-001-a Figure 2. Voltage-Current Characteristic for Terminals T and G or R and G All Measurements are Referenced to Terminal G JULY 2005 – REVISED JANUARY 2007 Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. 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