HA-2505 Data Sheet 12MHz, High Input Impedance, Operational Amplifier May 1999 • Slew Rate . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30V/µs This dielectrically isolated amplifier is ideally suited for applications such as data acquisition, RF, video, and pulse conditioning circuits. Slew rates of ±30V/µs and 330ns (0.1%) settling time make this device an excellent component in fast, accurate data acquisition and pulse amplification designs. 12MHz small signal bandwidth and 500kHz power bandwidth make this device well suited to RF and video applications. With 2mV typical offset voltage plus offset trim capability and 10nA offset current, HA-2505 is particularly useful in signal conditioning designs. The gain and offset voltage figures of the HA-2505 are optimized by internal component value changes while the similar design of the HA-2515 is maximized for slew rate. • Fast Settling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 330ns • Full Power Bandwidth . . . . . . . . . . . . . . . . . . . . . . 500kHz • Gain Bandwidth . . . . . . . . . . . . . . . . . . . . . . . . . . . 12MHz • High Input Impedance . . . . . . . . . . . . . . . . . . . . . . 50MΩ • Low Offset Current . . . . . . . . . . . . . . . . . . . . . . . . . . 10nA • Internally Compensated For Unity Gain Stability Applications • Data Acquisition Systems • RF Amplifiers • Video Amplifiers • Signal Generators Pinout HA-2505 (PDIP) TOP VIEW MIL-STD-883 product and data sheets are available upon request. Ordering Information HA3-2505-5 TEMP RANGE (oC) 0 to 75 PACKAGE 8 Ld PDIP 1 2890.5 Features HA-2505 is an operational amplifier whose design is optimized to deliver excellent slew rate, bandwidth, and settling time specifications. The outstanding dynamic features of this internally compensated device are complemented with low offset voltage and offset current. PART NUMBER File Number PKG. NO. E8.3 BAL 1 -IN 2 +IN 3 V- 4 + 8 COMP 7 V+ 6 OUT 5 BAL CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. 1-888-INTERSIL or 321-724-7143 | Copyright © Intersil Corporation 1999 HA-2505 Schematic BAL BAL V+ R6 R9 200 200 R5 200 Q1 R7 R10 1.8K 1.8K R1 4K Q2 Q6 Q5 R3 960 Q7 R11 2K Q8 R2 2K Q3 R8 200 Q9 Q10 R13 30 Q12 Q15 R4 11.13K Q37 Q35 R25 Q29 Q30 Q34 Q32 Q36 Q39 800 R19 6.3K R26 Q28 R23 3.3K Q27 R22 1.12K R20 3.3K R14 30 Q18 Q19 Q13 Q25 Q26 Q31 Q33 Q17 Q40 Q38 800 + INPUT OUTPUT Q14 Q4 COMP Q16 Q11 C1 10pF C2 10.6pF R12 1.1K Q23 Q22 Q24 R18 1.48K R17 1.48K R16 1.48K Q20 Q21 R15 740 V- - INPUT 2 HA-2505 Absolute Maximum Ratings Thermal Information Supply Voltage Between V+ and V- Terminals. . . . . . . . . . . . . . 40V Differential Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15V Peak Output Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50mA Thermal Resistance (Typical, Note 1) θJA (oC/W) PDIP Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96 Maximum Junction Temperature (Plastic Package) . . . . . . . . 150oC Maximum Storage Temperature Range . . . . . . . . . -65oC to 150oC Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . 300oC Operating Conditions Temperature Range HA-2505-5 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0oC to 75oC CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. NOTE: 1. θJA is measured with the component mounted on an evaluation PC board in free air. VS = ±15V Electrical Specifications HA-2505-5 TEMP (oC) MIN TYP MAX UNITS Offset Voltage 25 - 4 8 mV Full - - 10 mV Offset Voltage Average Drift Full - 20 - µV/oC 25 - 125 250 nA Full - - 500 nA 25 - 20 50 nA Full - - 100 nA PARAMETER INPUT CHARACTERISTICS Bias Current Offset Current Input Resistance (Note 2) 25 20 50 - MΩ Common Mode Range Full ±10 - - V Large Signal Voltage Gain (Notes 3, 6) 25 15 25 - kV/V Full 10 - - kV/V Common Mode Rejection Ratio (Note 4) Full 74 90 - dB Gain Bandwidth Product (Note 5) 25 - 12 - MHz Output Voltage Swing (Note 3) Full ±10 ±12 - V Output Current (Note 6) 25 ±10 ±20 - mA Full Power Bandwidth (Notes 6, 11) 25 300 500 - kHz Rise Time (Notes 3, 7, 8, 9) 25 - 25 50 ns Overshoot (Notes 3, 7, 8, 9) 25 - 25 50 % Slew Rate (Notes 3, 7, 9, 12) 25 ±20 ±30 - V/µs Settling Time to 0.1% (Notes 3, 7, 9, 12) 25 - 0.33 - µs Supply Current 25 - 4 6 mA PSRR (Note 10) Full 74 90 - dB TRANSFER CHARACTERISTICS OUTPUT CHARACTERISTICS TRANSIENT RESPONSE POWER SUPPLY CHARACTERISTICS NOTES: 2. This parameter value is based on design calculations. 3. RL = 2kΩ. 8. VO = ±200mV. 9. See Transient Response Test Circuits and Waveforms. 4. VCM = ±10V. 10. ∆V = ±5V. 5. AV > 10. 11. Full Power Bandwidth guaranteed based on slew rate measurement using: FPBW = Slew Rate/2πVPEAK. 6. VO = ±10V. 12. VOUT = ±5V. 7. CL = 50pF. 3 HA-2505 Test Circuits and Waveforms +200mV +5V INPUT INPUT 0mV -5V +5V OVERSHOOT 75% OUTPUT -5V +200mV 90% ∆V 25% ERROR BAND ±10mV FROM FINAL VALUE SLEW RATE = ∆V/∆t ∆t OUTPUT 10% 0mV RISE TIME SETTLING TIME NOTE: Measured on both positive and negative transitions from 0V to +200mV and 0V to -200mV at the output. FIGURE 1. SLEW RATE AND SETTLING TIME FIGURE 2. TRANSIENT RESPONSE + IN OUT 2kΩ 50pF RL = 2kΩ, CL = 50pF Upper Trace: Input Lower Trace: Output FIGURE 3. SLEW RATE AND TRANSIENT RESPONSE Vertical = 5V/Div. Horizontal = 200ns/Div. TA = 25oC, VS = ±15V FIGURE 4. VOLTAGE FOLLOWER PULSE RESPONSE 1µF V+ V+ INPUT 2 3 2kΩ + 7 0.01µF 6 4 OUTPUT 1µF 20kΩ RT 50pF 5kΩ VD G 2N4416 0.01µF 2kΩ 5kΩ S IN OUT BAL COMP V- CC SETTLING TIME TEST POINT CR1 2kΩ CR2 13. AV = -1. 14. Feedback and Summing Resistor Ratios should be 0.1% matched. NOTE: Tested offset adjustment range is |VOS + 1mV| minimum referred to output. Typical ranges are ±6mV with RT = 20kΩ. 15. Clipping Diodes CR1 and CR2 are optional. HP5082-2810 recommended. FIGURE 5. SETTLING TIME TEST CIRCUIT 4 FIGURE 6. SUGGESTED VOS ADJUSTMENT AND COMPENSATION HOOK UP HA-2505 Typical Performance Curves VS = ±15V, TA = 25oC, Unless Otherwise Specified 100 EQUIVALENT INPUT NOISE (µVRMS) 100 80 BIAS CURRENT 40 20 OFFSET CURRENT 0 -20 -40 -50 -25 0 25 50 TEMPERATURE (oC) 75 100 OPEN LOOP VOLTAGE GAIN (dB) NORMALIZED PARAMETERS REFERRED TO VALUES AT 25oC 1kHz 10kHz 100kHz 1MHz FIGURE 8. EQUIVALENT INPUT NOISE vs BANDWIDTH (WITH 10Hz HIGH PASS FILTER) 1.0 BANDWIDTH SLEW RATE 0.9 75 100 125 FIGURE 9. NORMALIZED AC PARAMETERS vs TEMPERATURE 120 0 100 30 80 GAIN 60 PHASE 60 90 40 120 20 150 0 180 -20 10 0.8 0 25 50 TEMPERATURE (oC) THERMAL NOISE OF 10K RESISTOR FREQUENCY (Hz) 1.1 -25 1.0 0.1 100Hz 125 FIGURE 7. INPUT BIAS AND OFFSET CURRENT vs TEMPERATURE -50 10K SOURCE RESISTANCE 0 SOURCE RESISTANCE 10 100 1K 10K 100K FREQUENCY (Hz) 1M 10M PHASE (DEGREES) CURRENT (nA) 60 100M FIGURE 10. OPEN LOOP FREQUENCY AND PHASE RESPONSE OPEN LOOP VOLTAGE GAIN (dB) BANDWIDTH TO VALUES AT ±15V NORMALIZED PARAMETERS REFERRED 120 1.1 1.0 SLEW RATE 0.9 0.8 10 100 60 40 20 20 300pF 1000pF 0 -20 10 15 SUPPLY VOLTAGE (±V) 0pF 30pF 100pF 80 100 1K 10K 100K FREQUENCY (Hz) 1M 10M 100M NOTE: External compensation components are not required for stability, but may be added to reduce bandwidth if desired. FIGURE 11. NORMALIZED AC PARAMETERS vs SUPPLY VOLTAGE 5 FIGURE 12. OPEN LOOP FREQUENCY RESPONSE FOR VARIOUS VALUES OF CAPACITORS FROM COMPENSATION PIN TO GROUND HA-2505 Typical Performance Curves VS = ±15V, TA = 25oC, Unless Otherwise Specified (Continued) 35 OUTPUT VOLTAGE SWING (VP-P) VSUPPLY = ±20V VSUPPLY = ±15V VSUPPLY = ±10V GAIN (dB) 90 80 -50 -25 0 25 50 75 100 125 VSUPPLY = ±20V 30 25 VSUPPLY = ±15V 20 15 VSUPPLY = ±10V 10 5 0 10K 100K 1MEG 10MEG FREQUENCY (Hz) TEMPERATURE (oC) FIGURE 13. OPEN LOOP VOLTAGE GAIN vs TEMPERATURE FIGURE 14. OUTPUT VOLTAGE SWING vs FREQUENCY SUPPLY CURRENT (mA) 5 VSUPPLY = ±20V VSUPPLY = ±15V VSUPPLY = ±10V 4 3 -50 -25 0 25 50 TEMPERATURE (oC) 75 100 125 FIGURE 15. POWER SUPPLY CURRENT vs TEMPERATURE 6 HA-2505 Die Characteristics SUBSTRATE POTENTIAL (POWERED UP): DIE DIMENSIONS: Unbiased 57 mils x 65 mils x 19 mils 1450µm x 1650µm x 483µm TRANSISTOR COUNT: METALLIZATION: 40 Type: Al, 1% Cu Thickness: 16kÅ ± 2kÅ PROCESS: Bipolar Dielectric Isolation PASSIVATION: Type: Nitride (Si3N4) over Silox (SiO2, 5% Phos.) Silox Thickness: 12kÅ ± 2kÅ Nitride Thickness: 3.5kÅ ± 1.5kÅ Metallization Mask Layout HA-2505 +IN -IN BAL COMP V- V+ BAL 7 OUT HA-2505 Dual-In-Line Plastic Packages (PDIP) E8.3 (JEDEC MS-001-BA ISSUE D) N 8 LEAD DUAL-IN-LINE PLASTIC PACKAGE E1 INDEX AREA 1 2 3 INCHES N/2 -B- -AD E BASE PLANE -C- A2 SEATING PLANE A L D1 e B1 A1 D1 eC B 0.010 (0.25) M C A B S MILLIMETERS SYMBOL MIN MAX MIN MAX NOTES A - 0.210 - 5.33 4 A1 0.015 - 0.39 - 4 A2 0.115 0.195 2.93 4.95 - B 0.014 0.022 0.356 0.558 - C L B1 0.045 0.070 1.15 1.77 8, 10 eA C 0.008 0.014 0.204 C D 0.355 0.400 9.01 D1 0.005 - 0.13 - 5 E 0.300 0.325 7.62 8.25 6 E1 0.240 0.280 6.10 7.11 5 eB NOTES: 1. Controlling Dimensions: INCH. In case of conflict between English and Metric dimensions, the inch dimensions control. 2. Dimensioning and tolerancing per ANSI Y14.5M-1982. 3. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of Publication No. 95. 4. Dimensions A, A1 and L are measured with the package seated in JEDEC seating plane gauge GS-3. 5. D, D1, and E1 dimensions do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.010 inch (0.25mm). 6. E and eA are measured with the leads constrained to be perpendicular to datum -C- . 7. eB and eC are measured at the lead tips with the leads unconstrained. eC must be zero or greater. 8. B1 maximum dimensions do not include dambar protrusions. Dambar protrusions shall not exceed 0.010 inch (0.25mm). 9. N is the maximum number of terminal positions. 10. Corner leads (1, N, N/2 and N/2 + 1) for E8.3, E16.3, E18.3, E28.3, E42.6 will have a B1 dimension of 0.030 - 0.045 inch (0.76 - 1.14mm). e 0.100 BSC eA 0.300 BSC eB - L 0.115 N 8 0.355 10.16 5 2.54 BSC - 7.62 BSC 6 0.430 - 0.150 2.93 10.92 7 3.81 4 8 9 Rev. 0 12/93 All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification. 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