HA-2620, HA-2625 Data Sheet November 1999 100MHz, High Input Impedance, Very Wideband, Uncompensated Operational Amplifiers HA-2620/2625 are bipolar operational amplifiers that feature very high input impedance (500MΩ, HA-2620) coupled with wideband AC performance. The high resistance of the input stage is complemented by low offset voltage (0.5mV, HA-2620) and low bias and offset current (1nA, HA-2620) to facilitate accurate signal processing. Input offset can be reduced further by means of an external nulling potentiometer. The 100MHz gain bandwidth product (HA-2620/2625 are stable for closed loop gains greater than 5), 35V/µs slew rate and 150kV/V open loop gain enables HA-2620/2625 to perform high gain amplification of very fast, wideband signals. These dynamic characteristics, coupled with fast settling times, make these amplifiers ideally suited to pulse amplification designs as well as high frequency (e.g., video) applications. The frequency response of the amplifier can be tailored to exact design requirements by means of an external bandwidth control capacitor connected from the Comp pin to GND. In addition to its application in pulse and video amplifier designs, HA-2620/2625 is particularly suited to other high performance designs such as high-gain low distortion audio amplifiers, high-Q and wideband active filters and highspeed comparators. For more information, please refer to Application Notes AN509, AN519 and AN546. The HA-2620 is offered as /883 Military Grade. MIL-STD883 data sheet is available upon request. Intersil AnswerFAX (321-724-7800) Document #3701. Ordering Information PART NUMBER (BRAND) TEMP. RANGE (oC) PACKAGE PKG. NO. HA2-2620-2 -55 to 125 8 Pin Metal Can T8.C HA2-2625-5 0 to 75 8 Pin Metal Can T8.C HA3-2625-5 0 to 75 8 Ld PDIP E8.3 HA9P2625-5 (H26255) 0 to 75 8 Ld SOIC M8.15 HA9P2625-9 (H26259) -40 to 85 File Number 2903.4 Features • Gain Bandwidth Product (AV ≥ 5) . . . . . . . . . . . . . 100MHz • High Input Impedance . . . . . . . . . . . . . . . . . . . . . 500MΩ • Low Input Bias Current . . . . . . . . . . . . . . . . . . . . . . . . 1nA • Low Input Offset Current . . . . . . . . . . . . . . . . . . . . . . 1nA • Low Input Offset Voltage . . . . . . . . . . . . . . . . . . . . 0.5mV • High Gain . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150kV/V • Slew Rate . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35V/µs • Output Short Circuit Protection • Compensation Pin for Unity Gain Capability Applications • Video and RF Amplifier • Pulse Amplifier • Audio Amplifiers and Filters • High-Q Active Filters • High Speed Comparators • Low Distortion Oscillator Pinouts HA-2625 (PDIP, SOIC) TOP VIEW 8 COMP 7 V+ 3 6 OUT 4 5 BAL BAL 1 -IN 2 +IN V- + HA-2620, HA-2625 (METAL CAN) TOP VIEW COMP 8 Ld SOIC 8 M8.15 BAL 1 -IN + 2 +IN 7 V+ 6 OUT 5 BAL 3 4 V- 1 CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. 1-888-INTERSIL or 321-724-7143 | Copyright © Intersil Corporation 1999 HA-2620, HA-2625 Absolute Maximum Ratings Thermal Information Supply Voltage (Between V+ and V- Terminals) . . . . . . . . . . . . 45V Differential Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12V Peak Output Current . . . . . . . . . . . . . . . Full Short Circuit Protection Thermal Resistance (Typical, Note 1) θJA (oC/W) θJC (oC/W) PDIP Package . . . . . . . . . . . . . . . . . . . 117 N/A SOIC Package . . . . . . . . . . . . . . . . . . . 165 N/A Metal Can Package . . . . . . . . . . . . . . . 165 80 Maximum Junction Temperature (Hermetic Package) . . . . . . . .175oC Maximum Junction Temperature (Plastic Package) . . . . . . . .150oC Maximum Storage Temperature Range . . . . . . . . . . -65oC to 150oC Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . 300oC (SOIC - Lead Tips Only) Operating Conditions Temperature Range HA-2620-2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -55oC to 125oC HA-2625-5 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0oC to 75oC HA-2625-9 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40oC to 85oC CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. NOTE: 1. θJA is measured with the component mounted on an evaluation PC board in free air. VSUPPLY = ±15V, Unless Otherwise Specified Electrical Specifications PARAMETER HA-2620-2 HA-2625-5, -9 TEMP. (oC) MIN TYP MAX MIN TYP MAX UNITS 25 - 0.5 4 - 3 5 mV INPUT CHARACTERISTICS Offset Voltage (Note 3) Full - 2 6 - - 7 mV Average Offset Voltage Drift Full - 5 - - 5 - µV/oC Bias Current 25 - 1 15 - 5 25 nA Full - 10 35 - - 40 nA 1 15 - 5 25 nA Offset Current 25 Full - 5 35 - - 40 nA Differential Input Resistance (Note 2) 25 65 500 - 40 300 - MΩ Input Noise Voltage Density (f = 1kHz) 25 - 11 - - 11 - nV/√Hz Input Noise Current Density (f = 1kHz) 25 - 0.16 - - 0.16 - pA/√Hz Common Mode Range Full ±11 ±12 - ±11 ±12 - V 25 100 150 - 80 150 - kV/V TRANSFER CHARACTERISTICS Large Signal Voltage Gain (Notes 4, 5) Full 70 - - 70 - - kV/V Common Mode Rejection Ratio (Note 6) Full 80 100 - 74 100 - dB Minimum Stable Gain 25 5 - - 5 - - V/V Gain Bandwidth Product (Notes 4, 7, 8) 25 - 100 - - 100 - MHz Output Voltage Swing (Note 4) Full ±10 ±12 - ±10 ±12 - V Output Current (Note 5) 25 ±15 ±22 - ±10 ±18 - mA Full Power Bandwidth (Notes 4, 5, 9, 13) 25 400 600 - 320 600 - kHz Rise Time (Notes 4, 9, 10) 25 - 17 45 - 17 45 ns Slew Rate (Notes 4, 9, 10, 12) 25 ±25 ±35 - ±20 ±35 - V/µs OUTPUT CHARACTERISTICS TRANSIENT RESPONSE (Note 8) 2 HA-2620, HA-2625 VSUPPLY = ±15V, Unless Otherwise Specified (Continued) Electrical Specifications TEMP. (oC) PARAMETER HA-2620-2 MIN HA-2625-5, -9 TYP MAX MIN TYP MAX UNITS POWER SUPPLY CHARACTERISTICS Supply Current 25 - 3 3.7 - 3 4 mA Power Supply Rejection Ratio (Note 11) Full 80 90 - 74 90 - dB NOTES: 2. This parameter value guaranteed by design calculations. 3. Offset may be externally adjusted to zero. 4. RL = 2kΩ. 5. VOUT = ±10V. 6. VCM = ±10V. 7. VOUT < 90mV. 8. 40dB Gain. 9. See Transient Response Test Circuits and Waveforms. 10. AV = 5 (The HA-2620 family is not stable at unity gain without external compensation). 11. ∆VS = ±5V. 12. VOUT = ±5V. Slew Rate 13. Full Power Bandwidth guaranteed by slew rate measurement: FPBW = ----------------------------- . 2πV PEAK Test Circuits and Waveforms ±40mV INPUT 1V INPUT -1V 0V ±200mV 90% OUTPUT 10% 0V RISE TIME +5V 90% OUTPUT 10% -5V ∆V ∆t SLEW RATE = ∆V/∆t NOTE: Measured on both positive and negative transitions from 0V to +200mV and 0V to -200mV at output. TRANSIENT RESPONSE IN SLEW RATE V+ OUT + - 100kΩ 1.6kΩ 50pF 400Ω IN BAL OUT COMP CC V- NOTE: Tested Offset Adjustment is |VOS + 1mV| minimum referred to output. Typical range is ±10mV with RT = 100kΩ. SLEW RATE AND TRANSIENT RESPONSE 3 SUGGESTED VOS ADJUSTMENT AND COMPENSATION HOOK-UP HA-2620, HA-2625 Schematic Diagram COMPENSATION V+ R1 1K BAL R2 4.18K R3 1.56K R4 1.56K R5 600 C2 9pF BAL Q60 Q1 Q40 Q2 Q3 Q61 Q39 Q41 Q38 Q4 Q42 Q37 Q6 Q5 Q7 +INPUT Q11 Q8 Q30 Q31 Q36 Q29 Q28 Q32 Q13 Q33 Q57 Q55 Q25 Q54 Q18 Q45 Q24 Q27 Q15 Q53 R17 30 Q52 R11 4.0K Q19 R19 2.5K R18 30 Q47 Q46 R7 1.35 Q56 OUT Q17 Q12 Q16 Q43 Q44 Q26 Q59 Q58 Q35 Q9 Q10 R6 15 Q22 Q21 RP1 R8 1K Q23 Q48 Q49 Q50 R9 4.5K Q20 R10 2.0K C1 16pF R12 1.6K R13 1.6K R14 1.6K Q51 R15 800 R16 15 V- -INPUT Typical Applications 2.2kΩ 2.2kΩ +15V 2.2kΩ + VIN 3 2 + 7 HA-2620 8 4 6 VOUT +5.0V, 0V 4.25V HA-2600 R1 10kΩ R2 100kΩ 50pF (NOTE) 50pF (NOTE) C 0.01µF 1N916 1N916 VREF + HA-2620 COMP f= -15V OUTPUT FIGURE 1. HIGH INPUT IMPEDANCE COMPARATOR 4 1 4 (R1 + R2) C ~OUTPUT FIGURE 2. FUNCTION GENERATOR HA-2620, HA-2625 Typical Applications (Continued) 5pF 22Ω 2.2kΩ VIN HA- 2620 + VOUT 50pF (NOTE) BW = 1MHz GAIN = 40dB NOTE: A small load capacitance of at least 30pF (including stray capacitance) is recommended to prevent possible high frequency oscillations. FIGURE 3. VIDEO AMPLIFIER Typical Performance Curves VS = ±15V, TA = 25oC, Unless Otherwise Specified 15 EQUIVALENT INPUT NOISE (µV) 100 CURRENT (nA) 10 5 0 OFFSET -5 BIAS -10 -25 0 25 50 75 10kΩ SOURCE RESISTANCE 10 0Ω SOURCE RESISTANCE 1 THERMAL NOISE OF 10K RESISTOR -1 100Hz -15 -50 EQUIVALENT INPUT NOISE vs BANDWIDTH 100 1kHz 10kHz 100kHz 1MHz UPPER 3dB FREQUENCY LOWER 3dB FREQUENCY = 10Hz TEMPERATURE (oC) FIGURE 4. INPUT BIAS CURRENT AND OFFSET CURRENT vs TEMPERATURE 10MHz FIGURE 5. BROADBAND NOISE CHARACTERISTICS 100 80 GAIN 60 60 40 PHASE 100 20 140 0 180 -20 10Hz 100Hz 1kHz 10kHz 100kHz 1MHz 10MHz 100MHz FREQUENCY FIGURE 6. OPEN LOOP FREQUENCY RESPONSE 5 INPUT IMPEDANCE (MΩ) 1000 0 20 PHASE ANGLE (DEGREES) OPEN LOOP VOLTAGE GAIN (dB) 120 800 600 400 200 0 -55 -35 -15 5 25 45 65 85 105 125 TEMPERATURE (oC) FIGURE 7. INPUT IMPEDANCE vs TEMPERATURE, 100Hz HA-2620, HA-2625 Typical Performance Curves VS = ±15V, TA = 25oC, Unless Otherwise Specified (Continued) OPEN LOOP VOLTAGE GAIN (dB) 120 20V PEAK VOLTAGE SWING (±V) 10V 1V ±20V SUPPLY ±15V SUPPLY ±10V SUPPLY 0.1V 100 0pF 10pF 35pF 50pF 80 60 115pF 300pF 1000pF 40 20 0 -20 10Hz 0.01V 10kHz 100kHz 1MHz 10MHz 100MHz FREQUENCY 100Hz 10kHz 100kHz FREQUENCY 1kHz 1MHz 10MHz NOTE: External Compensation is required for closed loop gain < 5. If external compensation is used, also connect 100pF capacitor from output to ground. FIGURE 8. OUTPUT VOLTAGE SWING vs FREQUENCY FIGURE 9. OPEN LOOP FREQUENCY RESPONSE FOR VARIOUS VALUES OF CAPACITORS FROM COMP. PIN TO GND 20 120 ±20V SUPPLY 15 ±15V SUPPLY GAIN (dB) 10 ±10V SUPPLY 100 ±5V SUPPLY 5 5 10 15 SUPPLY VOLTAGE (±V) 80 -55 20 FIGURE 10. COMMON MODE VOLTAGE RANGE vs SUPPLY VOLTAGE -35 -15 INPUT NOISE VOLTAGE (nV/√Hz) 10 INPUT NOISE CURRENT 100 10 1.0 0.1 INPUT NOISE VOLTAGE 1 1 10 85 105 125 FIGURE 11. OPEN LOOP VOLTAGE GAIN vs TEMPERATURE 1000 100 1K FREQUENCY (Hz) 10K FIGURE 12. NOISE DENSITY vs FREQUENCY 6 5 25 45 65 TEMPERATURE (oC) 0.01 100K INPUT NOISE CURRENT (pA/√Hz) COMMON MODE RANGE (±V) -55oC TO 125oC HA-2620, HA-2625 Die Characteristics DIE DIMENSIONS: PASSIVATION: Type: Nitride (Si3N4) over Silox (SiO2, 5% Phos.) Silox Thickness: 12kÅ ±2kÅ Nitride Thickness: 3.5kÅ ±1.5kÅ 69 mils x 56 mils x 19 mils 1750µm x 1420µm x 483µm METALLIZATION: TRANSISTOR COUNT: Type: Al, 1% Cu Thickness: 16kÅ ±2kÅ 140 SUBSTRATE POTENTIAL (POWERED UP): PROCESS: Unbiased Bipolar Dielectric Isolation Metallization Mask Layout HA-2620, HA-2625 COMP V+ BAL OUT -IN +IN BAL V- 7 HA-2620, HA-2625 Dual-In-Line Plastic Packages (PDIP) E8.3 (JEDEC MS-001-BA ISSUE D) N 8 LEAD DUAL-IN-LINE PLASTIC PACKAGE E1 INDEX AREA 1 2 3 INCHES N/2 -B- -AD E BASE PLANE -C- A2 SEATING PLANE A L D1 e B1 D1 A1 eC B 0.010 (0.25) M C A B S SYMBOL MIN MAX MIN MAX NOTES A - 0.210 - 5.33 4 A1 0.015 - 0.39 - 4 A2 0.115 0.195 2.93 4.95 - B 0.014 0.022 0.356 0.558 - C L B1 0.045 0.070 1.15 1.77 8, 10 eA C 0.008 0.014 0.204 C D 0.355 0.400 9.01 D1 0.005 - 0.13 - 5 E 0.300 0.325 7.62 8.25 6 E1 0.240 0.280 6.10 7.11 5 eB NOTES: 1. Controlling Dimensions: INCH. In case of conflict between English and Metric dimensions, the inch dimensions control. 2. Dimensioning and tolerancing per ANSI Y14.5M-1982. 3. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of Publication No. 95. 4. Dimensions A, A1 and L are measured with the package seated in JEDEC seating plane gauge GS-3. 5. D, D1, and E1 dimensions do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.010 inch (0.25mm). 6. E and eA are measured with the leads constrained to be perpendicular to datum -C- . 7. eB and eC are measured at the lead tips with the leads unconstrained. eC must be zero or greater. 8. B1 maximum dimensions do not include dambar protrusions. Dambar protrusions shall not exceed 0.010 inch (0.25mm). 9. N is the maximum number of terminal positions. 10. Corner leads (1, N, N/2 and N/2 + 1) for E8.3, E16.3, E18.3, E28.3, E42.6 will have a B1 dimension of 0.030 - 0.045 inch (0.76 - 1.14mm). 8 MILLIMETERS e 0.100 BSC eA 0.300 BSC eB - L 0.115 N 8 0.355 10.16 5 2.54 BSC - 7.62 BSC 6 0.430 - 0.150 2.93 8 10.92 7 3.81 4 9 Rev. 0 12/93 HA-2620, HA-2625 Small Outline Plastic Packages (SOIC) M8.15 (JEDEC MS-012-AA ISSUE C) 8 LEAD NARROW BODY SMALL OUTLINE PLASTIC PACKAGE N INDEX AREA 0.25(0.010) M H B M E INCHES -B- 1 2 SYMBOL 3 L SEATING PLANE -A- h x 45o A D -C- e α A1 B 0.25(0.010) M C A M C B S NOTES: 1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of Publication Number 95. 2. Dimensioning and tolerancing per ANSI Y14.5M-1982. 3. Dimension “D” does not include mold flash, protrusions or gate burrs. Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006 inch) per side. 4. Dimension “E” does not include interlead flash or protrusions. Interlead flash and protrusions shall not exceed 0.25mm (0.010 inch) per side. 5. The chamfer on the body is optional. If it is not present, a visual index feature must be located within the crosshatched area. 6. “L” is the length of terminal for soldering to a substrate. 7. “N” is the number of terminal positions. 8. Terminal numbers are shown for reference only. 9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater above the seating plane, shall not exceed a maximum value of 0.61mm (0.024 inch). 10. Controlling dimension: MILLIMETER. Converted inch dimensions are not necessarily exact. 9 MAX MIN MAX NOTES A 0.0532 0.0688 1.35 1.75 - A1 0.0040 0.0098 0.10 0.25 - B 0.013 0.020 0.33 0.51 9 C 0.0075 0.0098 0.19 0.25 - D 0.1890 0.1968 4.80 5.00 3 E 0.1497 0.1574 3.80 4.00 4 e 0.10(0.004) MILLIMETERS MIN 0.050 BSC 1.27 BSC 0.2284 0.2440 h 0.0099 0.0196 0.25 0.50 5 L 0.016 0.050 0.40 1.27 6 8o 0o N α 5.80 8 0o 6.20 - H 8 - 7 8o Rev. 0 12/93 HA-2620, HA-2625 Metal Can Packages (Can) T8.C MIL-STD-1835 MACY1-X8 (A1) REFERENCE PLANE A 8 LEAD METAL CAN PACKAGE e1 L L2 L1 INCHES ØD2 4.19 4.70 - 0.019 0.41 0.48 1 Øb1 0.016 0.021 0.41 0.53 1 N Øb2 0.016 0.024 0.41 0.61 - ØD 0.335 0.375 8.51 9.40 - α ØD1 0.305 0.335 7.75 8.51 - ØD2 0.110 0.160 2.79 4.06 - k C L e BASE AND SEATING PLANE Q BASE METAL Øb1 NOTES 0.185 1 F MAX 0.016 k1 β MIN 0.165 Øe Øb1 Øb MAX A A 2 MIN Øb A ØD ØD1 MILLIMETERS SYMBOL LEAD FINISH Øb2 SECTION A-A NOTES: 1. (All leads) Øb applies between L1 and L2. Øb1 applies between L2 and 0.500 from the reference plane. Diameter is uncontrolled in L1 and beyond 0.500 from the reference plane. 0.200 BSC 5.08 BSC - e1 0.100 BSC F - 0.040 - 2.54 BSC 1.02 - k 0.027 0.034 0.69 0.86 - k1 0.027 0.045 0.69 1.14 2 12.70 19.05 1 1.27 1 L 0.500 0.750 L1 - 0.050 L2 0.250 - 6.35 - 1 Q 0.010 0.045 0.25 1.14 - α - β 45o BSC 45o BSC 45o BSC 45o BSC N 8 8 2. Measured from maximum diameter of the product. 3 3 4 Rev. 0 5/18/94 3. α is the basic spacing from the centerline of the tab to terminal 1 and β is the basic spacing of each lead or lead position (N -1 places) from α, looking at the bottom of the package. 4. N is the maximum number of terminal positions. 5. Dimensioning and tolerancing per ANSI Y14.5M - 1982. 6. Controlling dimension: INCH. All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification. Intersil semiconductor products are sold by description only. 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