TJA1051
High-speed CAN transceiver
Rev. 7 — 15 January 2015
Product data sheet
1. General description
The TJA1051 is a high-speed CAN transceiver that provides an interface between a
Controller Area Network (CAN) protocol controller and the physical two-wire CAN bus.
The transceiver is designed for high-speed CAN applications in the automotive industry,
providing differential transmit and receive capability to (a microcontroller with) a CAN
protocol controller.
The TJA1051 belongs to the third generation of high-speed CAN transceivers from NXP
Semiconductors, offering significant improvements over first- and second-generation
devices such as the TJA1050. It offers improved ElectroMagnetic Compatibility (EMC)
and ElectroStatic Discharge (ESD) performance, and also features:
• Ideal passive behavior to the CAN bus when the supply voltage is off
• TJA1051T/3 and TJA1051TK/3 can be interfaced directly to microcontrollers with
supply voltages from 3 V to 5 V
The TJA1051 implements the CAN physical layer as defined in the current ISO11898
standard (ISO11898-2:2003). Pending the release of the updated version of ISO11898-2
including CAN FD, additional timing parameters defining loop delay symmetry are
specified. This implementation enables reliable communication in the CAN FD fast phase
at data rates up to 2 Mbit/s.
These features make the TJA1051 an excellent choice for all types of HS-CAN networks,
in nodes that do not require a standby mode with wake-up capability via the bus.
2. Features and benefits
2.1 General
Fully ISO 11898-2:2003 compliant
Loop delay symmetry timing enables reliable communication at data rates up to
2 Mbit/s in the CAN FD fast phase
Suitable for 12 V and 24 V systems
Low ElectroMagnetic Emission (EME) and high ElectroMagnetic Immunity (EMI)
VIO input on TJA1051T/3 and TJA1051TK/3 allows for direct interfacing with 3 V to 5 V
microcontrollers (available in SO8 and very small HVSON8 packages respectively)
EN input on TJA1051T/E allows the microcontroller to switch the transceiver to a very
low-current Off mode
Available in SO8 package or leadless HVSON8 package (3.0 mm 3.0 mm) with
improved Automated Optical Inspection (AOI) capability
TJA1051
NXP Semiconductors
High-speed CAN transceiver
Dark green product (halogen free and Restriction of Hazardous Substances (RoHS)
compliant)
AEC-Q100 qualified
2.2 Low-power management
Functional behavior predictable under all supply conditions
Transceiver disengages from the bus when not powered up (zero load)
2.3 Protection
High ElectroStatic Discharge (ESD) handling capability on the bus pins
Bus pins protected against transients in automotive environments
Transmit Data (TXD) dominant time-out function
Undervoltage detection on pins VCC and VIO
Thermally protected
3. Quick reference data
Table 1.
Quick reference data
Symbol
Parameter
VCC
Min
Typ
Max
Unit
supply voltage
4.5
-
5.5
V
VIO
supply voltage on pin VIO
2.8
-
5.5
V
Vuvd(VCC)
undervoltage detection
voltage on pin VCC
3.5
-
4.5
V
Vuvd(VIO)
undervoltage detection
voltage on pin VIO
1.3
2.0
2.7
V
ICC
supply current
Silent mode
0.1
1
2.5
mA
Normal mode; bus
recessive
2.5
5
10
mA
Normal mode; bus
dominant
20
50
70
mA
recessive; VTXD = VIO
-
80
250
A
dominant; VTXD = 0 V
-
350
500
A
8
-
+8
kV
V
IIO
TJA1051
Product data sheet
Conditions
supply current on pin VIO
Normal and Silent
modes
VESD
electrostatic discharge
voltage
IEC 61000-4-2 at pins
CANH and CANL
VCANH
voltage on pin CANH
58
-
+58
VCANL
voltage on pin CANL
58
-
+58
V
Tvj
virtual junction temperature
40
-
+150
C
All information provided in this document is subject to legal disclaimers.
Rev. 7 — 15 January 2015
© NXP N.V. 2015. All rights reserved.
2 of 22
TJA1051
NXP Semiconductors
High-speed CAN transceiver
4. Ordering information
Table 2.
Ordering information
Type number
Package
Name
Description
Version
TJA1051T
SO8
plastic small outline package; 8 leads; body width 3.9 mm
SOT96-1
TJA1051T/3[1]
SO8
plastic small outline package; 8 leads; body width 3.9 mm
SOT96-1
TJA1051T/E[1]
SO8
plastic small outline package; 8 leads; body width 3.9 mm
SOT96-1
TJA1051TK/3[1]
HVSON8
plastic thermal enhanced very thin small outline package; no leads;
8 terminals; body 3 3 0.85 mm
SOT782-1
[1]
TJA1051T/3 and TJA1051TK/3 with VIO pin; TJA1051T/E with EN pin.
5. Block diagram
VIO(1)
VCC
5
3
VCC
TJA1051
TEMPERATURE
PROTECTION
VI/O(1)
TXD
S
7
1
TIME-OUT
SLOPE
CONTROL
AND
DRIVER
6
CANH
CANL
8
MODE
CONTROL
EN(2)
RXD
5
4
DRIVER
2
015aaa036
GND
(1) In a transceiver without a VIO pin, the VIO input is internally connected to VCC.
(2) Only present in the TJA1051T/E.
Fig 1.
TJA1051
Product data sheet
Block diagram
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Rev. 7 — 15 January 2015
© NXP N.V. 2015. All rights reserved.
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TJA1051
NXP Semiconductors
High-speed CAN transceiver
6. Pinning information
6.1 Pinning
7-$7
7-$7(
7;'
6
7;'
6
*1'
&$1+
*1'
&$1+
9&&
&$1/
9&&
&$1/
5;'
QF
5;'
(1
DDD
DDD
a. TJA1051T: SO8
b. TJA1051T/E: SO8
WHUPLQDO
LQGH[DUHD
7-$7
7;'
*1'
6
7;'
6
&$1+
*1'
&$1+
9&&
&$1/
5;'
9,2
9&&
&$1/
5;'
9,2
DDD
7UDQVSDUHQWWRSYLHZ
DDD
c. TJA1051T/3: SO8
Fig 2.
7-$7.
d. TJA1051TK/3: HVSON8
Pin configuration diagrams
6.2 Pin description
Table 3.
Symbol
Pin
Description
TXD
1
transmit data input
GND[1]
2
ground
VCC
3
supply voltage
RXD
4
receive data output; reads out data from the bus lines
n.c.
5
not connected; in TJA1051T version
EN
5
enable control input; TJA1051T/E only
VIO
5
supply voltage for I/O level adapter; TJA1051T/3 and TJA1051TK/3 only
CANL
6
LOW-level CAN bus line
CANH
7
HIGH-level CAN bus line
S
8
Silent mode control input
[1]
TJA1051
Product data sheet
Pin description
For enhanced thermal and electrical performance, the exposed center pad of the HVSON8 package should
be soldered to board ground.
All information provided in this document is subject to legal disclaimers.
Rev. 7 — 15 January 2015
© NXP N.V. 2015. All rights reserved.
4 of 22
TJA1051
NXP Semiconductors
High-speed CAN transceiver
7. Functional description
The TJA1051 is a high-speed CAN stand-alone transceiver with Silent mode. It combines
the functionality of the TJA1050 transceiver with improved EMC and ESD handling
capability. Improved slope control and high DC handling capability on the bus pins
provides additional application flexibility.
The TJA1051 is available in three versions, distinguished only by the function of pin 5:
• The TJA1051T is backwards compatible with the TJA1050
• The TJA1051T/3 and TJA1051TK/3 allow for direct interfacing to microcontrollers with
supply voltages down to 3 V
• The TJA1051T/E allows the transceiver to be switched to a very low-current Off
mode.
7.1 Operating modes
The TJA1051 supports two operating modes, Normal and Silent, which are selected via
pin S. An additional Off mode is supported in the TJA1051T/E via pin EN. See Table 4 for
a description of the operating modes under normal supply conditions.
Table 4.
Operating modes
Mode
Inputs
Outputs
Pin EN[1]
Pin S
Pin TXD
CAN driver
Pin RXD
HIGH
LOW
LOW
dominant
active[2]
HIGH
LOW
HIGH
recessive
active[2]
Silent
HIGH
HIGH
X[3]
recessive
active[2]
Off[1]
LOW
X[3]
X[3]
floating
floating
Normal
[1]
Only available on the TJA1051T/E.
[2]
LOW if the CAN bus is dominant, HIGH if the CAN bus is recessive.
[3]
‘X’ = don’t care.
7.1.1 Normal mode
A LOW level on pin S selects Normal mode. In this mode, the transceiver is able to
transmit and receive data via the bus lines CANH and CANL (see Figure 1 for the block
diagram). The differential receiver converts the analog data on the bus lines into digital
data which is output to pin RXD. The slopes of the output signals on the bus lines are
controlled internally and are optimized in a way that guarantees the lowest possible
ElectroMagnetic Emission (EME).
7.1.2 Silent mode
A HIGH level on pin S selects Silent mode. In Silent mode the transmitter is disabled,
releasing the bus pins to recessive state. All other IC functions, including the receiver,
continue to operate as in Normal mode. Silent mode can be used to prevent a faulty CAN
controller from disrupting all network communications.
TJA1051
Product data sheet
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Rev. 7 — 15 January 2015
© NXP N.V. 2015. All rights reserved.
5 of 22
TJA1051
NXP Semiconductors
High-speed CAN transceiver
7.1.3 Off mode
A LOW level on pin EN of TJA1051T/E selects Off mode. In Off mode the entire
transceiver is disabled, allowing the microcontroller to save power when CAN
communication is not required. The bus pins are floating in Off mode, making the
transceiver invisible to the rest of the network.
7.2 Fail-safe features
7.2.1 TXD dominant time-out function
A ‘TXD dominant time-out’ timer is started when pin TXD is set LOW. If the LOW state on
pin TXD persists for longer than tto(dom)TXD, the transmitter is disabled, releasing the bus
lines to recessive state. This function prevents a hardware and/or software application
failure from driving the bus lines to a permanent dominant state (blocking all network
communications). The TXD dominant time-out timer is reset when pin TXD is set HIGH.
The TXD dominant time-out time also defines the minimum possible bit rate of 40 kbit/s.
7.2.2 Internal biasing of TXD, S and EN input pins
Pin TXD has an internal pull-up to VIO and pins S and EN (TJA1051T/E) have internal
pull-downs to GND. This ensures a safe, defined state in case one or more of these pins
is left floating.
7.2.3 Undervoltage detection on pins VCC and VIO
Should VCC or VIO drop below their respective undervoltage detection levels (Vuvd(VCC)
and Vuvd (VIO); see Table 7), the transceiver will switch off and disengage from the bus
(zero load) until VCC and VIO have recovered.
7.2.4 Overtemperature protection
The output drivers are protected against overtemperature conditions. If the virtual junction
temperature exceeds the shutdown junction temperature, Tj(sd), the output drivers will be
disabled until the virtual junction temperature falls below Tj(sd) and TXD becomes
recessive again. Including the TXD condition ensures that output driver oscillations due to
temperature drift are avoided.
7.3 VIO supply pin
There are three versions of the TJA1051 available, only differing in the function of a single
pin. Pin 5 is either an enable control input (EN), a VIO supply pin or is not connected.
Pin VIO on the TJA1051T/3 and TJA1051TK/3 should be connected to the microcontroller
supply voltage (see Figure 6). This will adjust the signal levels of pins TXD, RXD and S to
the I/O levels of the microcontroller. For versions of the TJA1051 without a VIO pin, the VIO
input is internally connected to VCC. This sets the signal levels of pins TXD, RXD and S to
levels compatible with 5 V microcontrollers.
TJA1051
Product data sheet
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Rev. 7 — 15 January 2015
© NXP N.V. 2015. All rights reserved.
6 of 22
TJA1051
NXP Semiconductors
High-speed CAN transceiver
8. Limiting values
Table 5.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134). All voltages are referenced to GND.
Symbol Parameter
Conditions
Min
Max
Unit
58
+58
V
Vx
voltage on pin x
on pins CANH, CANL and SPLIT
Vtrt
transient voltage
on pins CANH and CANL
[1]
VESD
electrostatic discharge voltage
IEC 61000-4-2 (150 pF, 330 )
[2]
on any other pin
at pins CANH and CANL
Human Body Model (HBM); 100 pF, 1.5 k
at any other pin
at any pin
virtual junction temperature
Tstg
storage temperature
8
+8
kV
8
+8
kV
4
+4
kV
300
+300
V
750
+750
V
[5]
at corner pins
Tvj
V
V
[4]
at any pin
Charged Device Model (CDM); field Induced
charge; 4 pF
+7
+100
[3]
at pins CANH and CANL
Machine Model (MM); 200 pF, 0.75 H, 10
0.3
150
[6]
500
+500
V
40
+150
C
55
+150
C
[1]
Verified by an external test house to ensure pins CANH and CANL can withstand ISO 7637 part 3 automotive transient test pulses 1, 2a,
3a and 3b.
[2]
According to IEC TS 62228 (2007), Section 4.3; DIN EN 61000-4-2.
[3]
According to AEC-Q100-002.
[4]
According to AEC-Q100-003.
[5]
AEC-Q100-011 Rev-C1. The classification level is C4B.
[6]
In accordance with IEC 60747-1. An alternative definition of virtual junction temperature is: Tvj = Tamb + P Rth(vj-a), where Rth(vj-a) is a
fixed value to be used for the calculation of Tvj. The rating for Tvj limits the allowable combinations of power dissipation (P) and ambient
temperature (Tamb).
9. Thermal characteristics
Table 6.
Thermal characteristics
According to IEC 60747-1.
Symbol
Parameter
Conditions
Value
Unit
Rth(vj-a)
thermal resistance from virtual junction to ambient
SO8 package; in free air
155
K/W
HVSON8 package; in free air
55
K/W
TJA1051
Product data sheet
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Rev. 7 — 15 January 2015
© NXP N.V. 2015. All rights reserved.
7 of 22
TJA1051
NXP Semiconductors
High-speed CAN transceiver
10. Static characteristics
Table 7.
Static characteristics
Tvj = 40 C to +150 C; VCC = 4.5 V to 5.5 V; VIO = 2.8 V to 5.5 V[1]; RL = 60 unless specified otherwise; All voltages are
defined with respect to ground; Positive currents flow into the IC[2].
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
4.5
-
5.5
V
Off mode (TJA1051T/E)
1
5
8
A
Silent mode
0.1
1
2.5
mA
recessive; VTXD =VIO
-
5
10
mA
dominant; VTXD = 0 V
-
50
70
mA
3.5
-
4.5
V
2.8
-
5.5
V
Supply; pin VCC
VCC
supply voltage
ICC
supply current
Normal mode
Vuvd(VCC)
undervoltage detection
voltage on pin VCC
I/O level adapter supply; pin VIO[1]
VIO
supply voltage on pin VIO
IIO
supply current on pin VIO
Vuvd(VIO)
Normal and Silent modes
recessive; VTXD = VIO
-
80
250
A
dominant; VTXD = 0 V
-
350
500
A
1.3
2.0
2.7
V
0.7VIO
-
VIO + 0.3 V
0.3
-
0.3VIO
V
undervoltage detection
voltage on pin VIO
Mode control inputs; pins S and EN[3]
[4]
VIH
HIGH-level input voltage
VIL
LOW-level input voltage
IIH
HIGH-level input current
VS = VIO; VEN = VIO
1
4
10
A
IIL
LOW-level input current
VS = 0 V; VEN = 0 V
1
0
+1
A
0.7VIO
-
VIO + 0.3 V
0.3
-
+0.3VIO
CAN transmit data input; pin TXD
[4]
VIH
HIGH-level input voltage
VIL
LOW-level input voltage
IIH
HIGH-level input current
VTXD = VIO
5
0
+5
A
IIL
LOW-level input current
Normal mode; VTXD = 0 V
260
150
30
A
Ci
input capacitance
-
5
10
pF
[5]
V
CAN receive data output; pin RXD
IOH
HIGH-level output current
VRXD = VIO 0.4 V; VIO = VCC
8
3
1
mA
IOL
LOW-level output current
VRXD = 0.4 V; bus dominant
2
5
12
mA
Bus lines; pins CANH and CANL
VO(dom)
dominant output voltage
Vdom(TX)sym transmitter dominant voltage
symmetry
TJA1051
Product data sheet
VTXD = 0 V; t < tto(dom)TXD
pin CANH
2.75
3.5
4.5
V
pin CANL
0.5
1.5
2.25
V
400
0
+400
mV
Vdom(TX)sym = VCC VCANH VCANL
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Rev. 7 — 15 January 2015
© NXP N.V. 2015. All rights reserved.
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TJA1051
NXP Semiconductors
High-speed CAN transceiver
Table 7.
Static characteristics …continued
Tvj = 40 C to +150 C; VCC = 4.5 V to 5.5 V; VIO = 2.8 V to 5.5 V[1]; RL = 60 unless specified otherwise; All voltages are
defined with respect to ground; Positive currents flow into the IC[2].
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
VO(dif)bus
bus differential output voltage VTXD = 0 V; t < tto(dom)TXD
VCC = 4.75 V to 5.25 V
RL = 45 to 65
1.5
-
3
V
VTXD = VIO; recessive; no load
50
-
+50
mV
VO(rec)
recessive output voltage
Normal and Silent modes;
VTXD = VIO; no load
2
0.5VCC 3
V
Vth(RX)dif
differential receiver threshold
voltage
Normal and Silent modes
Vcm(CAN)[6] = 30 V to +30 V
0.5
0.7
0.9
V
Vhys(RX)dif
differential receiver hysteresis Normal and Silent modes
voltage
Vcm(CAN) = 30 V to +30 V
50
120
200
mV
IO(sc)dom
dominant short-circuit output
current
pin CANH; VCANH = 0 V
100
70
40
mA
pin CANL; VCANL = 5 V / 40 V
40
70
100
mA
VTXD = 0 V; t < tto(dom)TXD; VCC = 5 V
IO(sc)rec
recessive short-circuit output
current
Normal and Silent modes;
VTXD = VIO;
VCANH = VCANL = 27 V to +32 V
5
-
+5
mA
IL
leakage current
VCC = VIO = 0 V;
VCANH = VCANL = 5 V
5
0
+5
A
Ri
input resistance
9
15
28
k
Ri
input resistance deviation
1
0
+1
%
Ri(dif)
differential input resistance
between VCANH and VCANL
19
30
52
k
-
-
20
pF
Ci(cm)
common-mode input
capacitance
[5]
Ci(dif)
differential input capacitance
[5]
-
-
10
pF
[5]
-
190
-
C
Temperature protection
Tj(sd)
shutdown junction
temperature
[1]
Only TJA1051T/3 and TJA1051TK/3 have a VIO pin. In transceivers without a VIO pin, the VIO input is internally connected to VCC.
[2]
All parameters are guaranteed over the virtual junction temperature range by design. Factory testing uses correlated test conditions to
cover the specified temperature and power supply voltage range.
[3]
Only TJA1051T/E has an EN pin.
[4]
Maximum value assumes VCC < VIO; if VCC > VIO, the maximum value will be VCC + 0.3 V.
[5]
Not tested in production; guaranteed by design.
[6]
Vcm(CAN) is the common mode voltage of CANH and CANL.
TJA1051
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 7 — 15 January 2015
© NXP N.V. 2015. All rights reserved.
9 of 22
TJA1051
NXP Semiconductors
High-speed CAN transceiver
11. Dynamic characteristics
Table 8.
Dynamic characteristics
Tvj = 40 C to +150 C; VCC = 4.5 V to 5.5 V; VIO = 2.8 V to 5.5 V[1]; RL = 60 unless specified otherwise. All voltages are
defined with respect to ground. Positive currents flow into the IC.[2]
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Transceiver timing; pins CANH, CANL, TXD and RXD; see Figure 7 and Figure 3
td(TXD-busdom)
delay time from TXD to bus dominant
Normal mode
-
65
-
ns
td(TXD-busrec)
delay time from TXD to bus recessive
Normal mode
-
90
-
ns
td(busdom-RXD) delay time from bus dominant to RXD
Normal and Silent modes
-
60
-
ns
td(busrec-RXD)
delay time from bus recessive to RXD
Normal and Silent modes
-
65
-
ns
tPD(TXD-RXD)
propagation delay from TXD to RXD
Normal mode; versions
with VIO pin
40
-
250
ns
Normal mode; all other
versions
40
-
220
ns
400
-
550
ns
0.3
1
5
ms
tbit(RXD)
bit time on pin RXD
tbit(TXD) = 500 ns
tto(dom)TXD
TXD dominant time-out time
VTXD = 0 V; Normal mode
[3]
[1]
Only TJA1051T/3 and TJA1051TK/3 have a VIO pin. In transceivers without a VIO pin, the VIO input is internally connected to VCC.
[2]
All parameters are guaranteed over the virtual junction temperature range by design. Factory testing uses correlated test conditions to
cover the specified temperature and power supply voltage range.
[3]
See Figure 4.
TJA1051
Product data sheet
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Rev. 7 — 15 January 2015
© NXP N.V. 2015. All rights reserved.
10 of 22
TJA1051
NXP Semiconductors
High-speed CAN transceiver
HIGH
TXD
LOW
CANH
CANL
dominant
0.9 V
VO(dif)(bus)
0.5 V
recessive
HIGH
0.7VIO
RXD
0.3VIO
LOW
td(TXD-busrec)
td(TXD-busdom)
td(busrec-RXD)
td(busdom-RXD)
tPD(TXD-RXD)
Fig 3.
tPD(TXD-RXD)
015aaa025
CAN transceiver timing diagram
7;'
[WELW7;'
WELW7;'
5;'
WELW5;'
DDD
Fig 4.
TJA1051
Product data sheet
Loop delay symmetry timing diagram
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Rev. 7 — 15 January 2015
© NXP N.V. 2015. All rights reserved.
11 of 22
TJA1051
NXP Semiconductors
High-speed CAN transceiver
12. Application information
12.1 Application diagrams
5V
BAT
VCC
CANH
CANH
EN
S
TJA1051T/E
CANL
CANL
TXD
RXD
VDD
Pxx
Pyy
TX0
RX0
MICROCONTROLLER
GND
GND
Fig 5.
015aaa226
Typical application of the TJA1051T/E
BAT
3V
EN
5V
VIO
VCC
VDD
CANH
CANH
Pxx
TJA1051T/3
TJA1051TK/3
CANL
CANL
S
TXD
RXD
Pyy
TX0
RX0
GND
Fig 6.
MICROCONTROLLER
GND
015aaa227
Typical application of the TJA1051T/3 or TJA1051TK/3.
12.2 Application hints
Further information on the application of the TJA1051 can be found in NXP application
hints AH1014 Application Hints - Standalone high speed CAN transceiver
TJA1042/TJA1043/TJA1048/TJA1051.
TJA1051
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 7 — 15 January 2015
© NXP N.V. 2015. All rights reserved.
12 of 22
TJA1051
NXP Semiconductors
High-speed CAN transceiver
13. Test information
+5 V
47 μF
100 nF
VIO/EN(1)
VCC
TXD
CANH
TJA1051
RXD
GND
RL
100 pF
CANL
S
15 pF
015aaa040
(1) For versions with a VIO pin (TJA1051T/3 and TJA1051TK/3) or an EN pin (TJA1051T/E), these
inputs are connected to pin VCC.
Fig 7.
Timing test circuit for CAN transceiver
13.1 Quality information
This product has been qualified in accordance with the Automotive Electronics Council
(AEC) standard Q100 Rev-G - Failure mechanism based stress test qualification for
integrated circuits, and is suitable for use in automotive applications.
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14. Package outline
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Product data sheet
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15. Handling information
All input and output pins are protected against ElectroStatic Discharge (ESD) under
normal handling. When handling ensure that the appropriate precautions are taken as
described in JESD625-A or equivalent standards.
16. Soldering of SMD packages
This text provides a very brief insight into a complex technology. A more in-depth account
of soldering ICs can be found in Application Note AN10365 “Surface mount reflow
soldering description”.
16.1 Introduction to soldering
Soldering is one of the most common methods through which packages are attached to
Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both
the mechanical and the electrical connection. There is no single soldering method that is
ideal for all IC packages. Wave soldering is often preferred when through-hole and
Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not
suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high
densities that come with increased miniaturization.
16.2 Wave and reflow soldering
Wave soldering is a joining technology in which the joints are made by solder coming from
a standing wave of liquid solder. The wave soldering process is suitable for the following:
• Through-hole components
• Leaded or leadless SMDs, which are glued to the surface of the printed circuit board
Not all SMDs can be wave soldered. Packages with solder balls, and some leadless
packages which have solder lands underneath the body, cannot be wave soldered. Also,
leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered,
due to an increased probability of bridging.
The reflow soldering process involves applying solder paste to a board, followed by
component placement and exposure to a temperature profile. Leaded packages,
packages with solder balls, and leadless packages are all reflow solderable.
Key characteristics in both wave and reflow soldering are:
•
•
•
•
•
•
Board specifications, including the board finish, solder masks and vias
Package footprints, including solder thieves and orientation
The moisture sensitivity level of the packages
Package placement
Inspection and repair
Lead-free soldering versus SnPb soldering
16.3 Wave soldering
Key characteristics in wave soldering are:
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• Process issues, such as application of adhesive and flux, clinching of leads, board
transport, the solder wave parameters, and the time during which components are
exposed to the wave
• Solder bath specifications, including temperature and impurities
16.4 Reflow soldering
Key characteristics in reflow soldering are:
• Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see Figure 10) than a SnPb process, thus
reducing the process window
• Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
• Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 9 and 10
Table 9.
SnPb eutectic process (from J-STD-020D)
Package thickness (mm)
Package reflow temperature (C)
Volume (mm3)
< 350
350
< 2.5
235
220
2.5
220
220
Table 10.
Lead-free process (from J-STD-020D)
Package thickness (mm)
Package reflow temperature (C)
Volume (mm3)
< 350
350 to 2000
> 2000
< 1.6
260
260
260
1.6 to 2.5
260
250
245
> 2.5
250
245
245
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see Figure 10.
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maximum peak temperature
= MSL limit, damage level
temperature
minimum peak temperature
= minimum soldering temperature
peak
temperature
time
001aac844
MSL: Moisture Sensitivity Level
Fig 10. Temperature profiles for large and small components
For further information on temperature profiles, refer to Application Note AN10365
“Surface mount reflow soldering description”.
17. Soldering of HVSON packages
Section 16 contains a brief introduction to the techniques most commonly used to solder
Surface Mounted Devices (SMD). A more detailed discussion on soldering HVSON
leadless package ICs can found in the following application notes:
• AN10365 ‘Surface mount reflow soldering description”
• AN10366 “HVQFN application information”
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18. Revision history
Table 11.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
TJA1051 v.7
20150115
Product data sheet
-
TJA1051 v.6
Modifications:
•
•
•
•
•
•
•
•
•
•
•
•
•
Section 1: text revised (1st paragraph); paragraph added
Section 2.1: minor amendments to text; features added
Table 1: added parameters VIO, Vuvd(VIO) and IIO; measurements conditions changed: VCANH, VCANL
Figure 2 : pin diagrams updated
Table 3: Table note 1 added
Section 7, Section 7.1.1: minor changes to text
Table 5: measurements conditions changed: Vx, VESD; table note section revised
Table 7: parameter values changed: Vuvd(VIO); parameters renamed: IO(sc)dom and IO(sc)rec
Table 8: parameter tbit(RXD) added; Table note 3 and Figure 4 added
Section 12.2 “Application hints”: added
Figure 7 moved to Section 13
Section 13.1: text updated
Section 19.3: ‘Translations’ disclaimer added
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Product data sheet
-
TJA1051 v.5
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20101229
Product data sheet
-
TJA1051 v.4
TJA1051 v.4
20091020
Product data sheet
-
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20090825
Product data sheet
-
TJA1051 v.2
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20090701
Product data sheet
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TJA1051 v.1
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-
-
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19. Legal information
19.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
19.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
19.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
TJA1051
Product data sheet
Suitability for use in automotive applications — This NXP
Semiconductors product has been qualified for use in automotive
applications. Unless otherwise agreed in writing, the product is not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer's own
risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
All information provided in this document is subject to legal disclaimers.
Rev. 7 — 15 January 2015
© NXP N.V. 2015. All rights reserved.
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No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Translations — A non-English (translated) version of a document is for
reference only. The English version shall prevail in case of any discrepancy
between the translated and English versions.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
19.4 Trademarks
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
20. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
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21. Contents
1
2
2.1
2.2
2.3
3
4
5
6
6.1
6.2
7
7.1
7.1.1
7.1.2
7.1.3
7.2
7.2.1
7.2.2
7.2.3
7.2.4
7.3
8
9
10
11
12
12.1
12.2
13
13.1
14
15
16
16.1
16.2
16.3
16.4
17
18
19
19.1
19.2
19.3
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
General . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Low-power management . . . . . . . . . . . . . . . . . 2
Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Quick reference data . . . . . . . . . . . . . . . . . . . . . 2
Ordering information . . . . . . . . . . . . . . . . . . . . . 3
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Pinning information . . . . . . . . . . . . . . . . . . . . . . 4
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4
Functional description . . . . . . . . . . . . . . . . . . . 5
Operating modes . . . . . . . . . . . . . . . . . . . . . . . 5
Normal mode . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Silent mode. . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Off mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Fail-safe features . . . . . . . . . . . . . . . . . . . . . . . 6
TXD dominant time-out function . . . . . . . . . . . . 6
Internal biasing of TXD, S and EN input pins . . 6
Undervoltage detection on pins VCC and VIO . . 6
Overtemperature protection . . . . . . . . . . . . . . . 6
VIO supply pin . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 7
Thermal characteristics . . . . . . . . . . . . . . . . . . 7
Static characteristics. . . . . . . . . . . . . . . . . . . . . 8
Dynamic characteristics . . . . . . . . . . . . . . . . . 10
Application information. . . . . . . . . . . . . . . . . . 12
Application diagrams . . . . . . . . . . . . . . . . . . . 12
Application hints . . . . . . . . . . . . . . . . . . . . . . . 12
Test information . . . . . . . . . . . . . . . . . . . . . . . . 13
Quality information . . . . . . . . . . . . . . . . . . . . . 13
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 14
Handling information. . . . . . . . . . . . . . . . . . . . 16
Soldering of SMD packages . . . . . . . . . . . . . . 16
Introduction to soldering . . . . . . . . . . . . . . . . . 16
Wave and reflow soldering . . . . . . . . . . . . . . . 16
Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 16
Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 17
Soldering of HVSON packages. . . . . . . . . . . . 18
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 19
Legal information. . . . . . . . . . . . . . . . . . . . . . . 20
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 20
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
19.4
20
21
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Contact information . . . . . . . . . . . . . . . . . . . . 21
Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP N.V. 2015.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 15 January 2015
Document identifier: TJA1051