MCP3909 Energy Metering IC with SPI Interface and Active Power Pulse Output Features Description • Supports IEC 62053 International Energy Metering Specification • Digital Waveform Data Access Through SPI Interface - 16-bit Dual ADC Output Data Words - 20-bit Multiplier Output Data Word • Dual Functionality Pins Support Serial Interface Access and Simultaneous Active Power Pulse Output • Two 16-bit Second Order Delta-sigma Analogto-Digital Converters (ADCs) with Multi-bit DAC - 81 dB SINAD (typical) on Both Channels • 0.1% Typical Active Energy Measurement Error Over 1000:1 Dynamic Range • PGA for Small Signal Input Supports Low Value Shunt Current Sensor • Ultra-low Drift On-chip Reference,15 ppm/°C (typical) • Direct Drive for Electromagnetic Mechanical Counter and Two-phase Stepper Motors • Low IDD of 4 mA (maximum) • Tamper Output Pin for Negative Power Indication • Temperature Ranges: - Industrial: -40°C to +85°C - Extended: -40°C to +125°C The MCP3909 device is an energy-metering IC designed to support the IEC 62053 international metering standard specification. It supplies a frequency output proportional to the average active real power, with simultaneous serial access to ADC channels and multiplier output data. This output waveform data is available at up to 14 kHz with 16-bit ADC output and 20-bit multiplier output words. The 16-bit, delta-sigma ADCs allow for a wide range of IB and IMAX currents and/or small shunt (<200 µOhms) meter designs. A no-load threshold block prevents any current creep measurements for the active power pulse outputs. The integrated on-chip voltage reference has an ultra-low temperature drift of 15 ppm per degree C. This accurate energy metering IC with high field reliability is available in the industry standard 24-lead SSOP pinout. Package Type 24-Lead SSOP DVDD HPF AVDD NC CH0+ CH0CH1CH1+ MCLR REFIN/OUT AGND F2/SCK 2006-2012 Microchip Technology Inc. 1 2 3 4 5 6 7 8 9 10 11 12 24 23 22 21 20 19 18 17 16 15 14 13 FOUT0 FOUT1 HFOUT DGND NEG/SDO NC CLKOUT CLKIN G0 G1 F0/CS F1/SDI DS22025C-page 1 MCP3909 Functional Block Diagram HPF G0 G1 F2/SCK F1/SDI F0/CS NEG/SDO CH0+ + PGA – CH0- 16-bit Multi-level ADC 4 k 16 HPF1 16 Serial Control And Output Buffers REFIN/OUT 2.4V Reference CH1+ + CH1- – 16 16-bit Multi-level ADC SPI Interface HFOUT FOUT0 FOUT1 20 X DS22025C-page 2 MCLR 16 HPF1 Clock Sub-system OSC1 OSC2 Dual Functionality Pin Control LPF1 Active Power DTF conversion Stepper Motor Output Drive for Active Power 2006-2012 Microchip Technology Inc. MCP3909 1.0 ELECTRICAL CHARACTERISTICS † Notice: Stresses above those listed under "Maximum Ratings" may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. Absolute Maximum Ratings † VDD...................................................................................7.0V Digital inputs and outputs w.r.t. AGND ....... -0.6V to VDD +0.6V Analog input w.r.t. AGND ..................................... ....-6V to +6V VREF input w.r.t. AGND .............................. -0.6V to VDD +0.6V Storage temperature .....................................-65°C to +150°C Ambient temp. with power applied ................-65°C to +125°C Soldering temperature of leads (10 seconds) ............. +300°C ESD on the analog inputs (HBM,MM) ................. 5.0 kV, 500V ESD on all other pins (HBM,MM) ........................5.0 kV, 500V ELECTRICAL CHARACTERISTICS Electrical Specifications: Unless otherwise indicated, all parameters apply at AVDD = DVDD = 4.5V to 5.5V, Internal VREF, HPF turned on (AC mode), AGND, DGND = 0V, MCLK = 3.58 MHz; TA = -40°C to +85°C. Parameter Sym Min Typ. Max Units Comment E — 0.1 — % FOUT Channel 0 swings 1000:1 range, FOUT0, FOUT1 Frequency outputs only, does not apply to serial interface data. (Note 1, Note 4) NLT — 0.0015 — % FOUT Frequency outputs only, does not Max apply to serial interface data. Disabled when F2, F1, F0 = 0, 1, 1 (Note 5, Note 6) — 1 5 % FOUT (Note 2, Note 5) Active Power Measurement Accuracy Active Energy Measurement Error No-Load Threshold/ Minimum Load System Gain Error AC Power Supply Rejection (output frequency variation) AC PSRR — 0.01 — % FOUT F2, F1, F0 = 0, 1, 1 (Note 3) DC Power Supply Rejection (output frequency variation) DC PSRR — 0.01 — % FOUT HPF = 1, Gain = 1 (Note 3) SINAD — 81 — dB Applies to both channels, VIN = 0 dBFS at 50 Hz (VIN = Full Scale) Bandwidth (Notch Frequency) — 14 — kHz Applies to both channels, MCLK/256 Phase Delay Between Channels — — 1/MCLK s Waveform Sampling A/D Converter Signal-toNoise and Distortion Ratio Note 1: 2: 3: 4: 5: 6: 7: HPF = 0 and 1, < 1 MCLK period (Note 4, Note 6, Note 7) Measurement error = (Energy Measured By Device - True Energy)/True Energy * 100%. Accuracy is measured with signal (±660 mV) on Channel 1. FOUT0, FOUT1 pulse outputs. Valid from 45 Hz to 75 Hz. See typical performance curves for higher frequencies and increased dynamic range. This parameter is not 100% production tested. Does not include internal VREF. Gain = 1, CH0 = 470 mVDC, CH1 = 660 mVDC, difference between measured output frequency and expected transfer function. Percent of HFOUT output frequency variation; Includes external VREF = 2.5V, CH1 = 100 mVRMS @ 50 Hz, CH2 = 100 mVRMS @ 50 Hz, AVDD = 5V + 1 Vpp @ 100 Hz. DC PSRR: 5V ±500 mV Error applies down to 60 degree lead (PF = 0.5 capacitive) and 60 degree lag (PF = 0.5 inductive). Refer to Section 4.0 “Device Overview” for complete description. Specified by characterization, not production tested. 1 MCLK period at 3.58 MHz is equivalent to less than < 0.005 degrees at 50 or 60 Hz. 2006-2012 Microchip Technology Inc. DS22025C-page 3 MCP3909 ELECTRICAL CHARACTERISTICS (CONTINUED) Electrical Specifications: Unless otherwise indicated, all parameters apply at AVDD = DVDD = 4.5V to 5.5V, Internal VREF, HPF turned on (AC mode), AGND, DGND = 0V, MCLK = 3.58 MHz; TA = -40°C to +85°C. Parameter Sym Min Typ. Max Units VOS — 2 5 mV — 0.5 — — 2.4 — Comment ADC/PGA Specifications Offset Error Gain Error Match Referred to Input, applies to both channels % FOUT (Note 5) Internal Voltage Reference Voltage V Tolerance — ±2 — % Tempco — 15 — ppm/°C Input Range 2.2 — 2.6 V Input Impedance 3.2 — — kΩ Input Capacitance — — 10 pF Reference Input Analog Inputs Maximum Signal Level — — ±1 V Differential Input Voltage Range Channel 0 — — ±470/G mV Differential Input Voltage Range Channel 1 — — ±660 mV 390 — — kΩ 1 — 4 MHz Input Impedance CH0+,CH0-,CH1+,CH1- to AGND G = PGA Gain on Channel 0 Proportional to 1/MCLK Oscillator Input Frequency Range MCLK Power Specifications Operating Voltage AVDD, DVDD 4.5 — 5.5 V IDD,A IDD,A — 2.3 2.8 mA AVDD pin only IDD,D IDD,D — 0.8 1.2 mA DVDD pin only Note 1: 2: 3: 4: 5: 6: 7: Measurement error = (Energy Measured By Device - True Energy)/True Energy * 100%. Accuracy is measured with signal (±660 mV) on Channel 1. FOUT0, FOUT1 pulse outputs. Valid from 45 Hz to 75 Hz. See typical performance curves for higher frequencies and increased dynamic range. This parameter is not 100% production tested. Does not include internal VREF. Gain = 1, CH0 = 470 mVDC, CH1 = 660 mVDC, difference between measured output frequency and expected transfer function. Percent of HFOUT output frequency variation; Includes external VREF = 2.5V, CH1 = 100 mVRMS @ 50 Hz, CH2 = 100 mVRMS @ 50 Hz, AVDD = 5V + 1 Vpp @ 100 Hz. DC PSRR: 5V ±500 mV Error applies down to 60 degree lead (PF = 0.5 capacitive) and 60 degree lag (PF = 0.5 inductive). Refer to Section 4.0 “Device Overview” for complete description. Specified by characterization, not production tested. 1 MCLK period at 3.58 MHz is equivalent to less than < 0.005 degrees at 50 or 60 Hz. DS22025C-page 4 2006-2012 Microchip Technology Inc. MCP3909 TEMPERATURE CHARACTERISTICS Electrical Specifications: Unless otherwise indicated, VDD = 4.5V to 5.5V, AGND, DGND = 0V. Parameters Sym Min Typ Max Units Specified Temperature Range TA -40 — +85 °C Operating Temperature Range TA -40 — +125 °C Storage Temperature Range TA -65 — +150 °C JA — 73 — °C/W Conditions Temperature Ranges Note Thermal Package Resistances Thermal Resistance, 24L-SSOP Note: The MCP3909 operates over this extended temperature range, but with reduced performance. In any case, the Junction Temperature (TJ) must not exceed the Absolute Maximum specification of +150°C. TIMING CHARACTERISTICS Electrical Specifications: Unless otherwise indicated, all parameters apply at AVDD = DVDD = 4.5V to 5.5V, AGND, DGND = 0V, MCLK = 3.58 MHz; TA = -40°C to +85°C. Parameter Sym Min Typ Max Units Comment FOUT0 and FOUT1 Pulse Width (Logic Low) tFW — 275 — ms 984376 MCLK periods (Note 1) HFOUT Pulse Width tHW — 90 — ms 322160 MCLK periods (Note 2) Frequency Outputs FOUT0 and FOUT1 Pulse Period tFP Refer to Equation 4-1 s HFOUT Pulse Period tHP Refer to Equation 4-2 s FOUT0 to FOUT1 Falling-Edge Time tFS2 — 0.5 tFP — FOUT0 to FOUT1 Minimum Separation tFS — 4/MCLK — FOUT0 and FOUT1 Output High Voltage VOH 4.5 — — V IOH = 10 mA, DVDD = 5.0V FOUT0 and FOUT1 Output Low Voltage VOL — — 0.5 V IOL = 10 mA, DVDD = 5.0V HFOUT and NEG Output High Voltage VOH 4.0 — — V IOH = 5 mA, DVDD = 5.0V HFOUT and NEG Output Low Voltage VOL — — 0.5 V IOL = 5 mA, DVDD = 5.0V High-Level Input Voltage (All Digital Input Pins) VIH 2.4 — — V DVDD = 5.0V Low Level Input Voltage (All Digital Input Pins) VIL — — 0.85 V DVDD = 5.0V Input Leakage Current — 0.1 ±1 µA VIN = 0, VIN = DVDD Pin Capacitance — — 10 pF (Note 3) Digital I/O Note 1: 2: 3: 4: If output pulse period (tFP) falls below 984376*2 MCLK periods, then tFW = 1/2 tFP. If output pulse period (tHP) falls below 322160*2 MCLK periods, then tHW = 1/2 tHP. When F2, F1, F0 equals 0,1,1, the HFOUT pulse time is fixed at 64 x MCLK periods or 18 µs for MCLK = 3.58 MHz. Specified by characterization, not production tested. Serial timings specified and production tested with 180 pF load. 2006-2012 Microchip Technology Inc. DS22025C-page 5 MCP3909 TIMING CHARACTERISTICS (CONTINUED) Electrical Specifications: Unless otherwise indicated, all parameters apply at AVDD = DVDD = 4.5V to 5.5V, AGND, DGND = 0V, MCLK = 3.58 MHz; TA = -40°C to +85°C. Parameter Sym Min Typ Max Units ns Comment Serial Interface Timings (Note 4) Data Ready Pulse Width tDR Reset Time tRST 100 — — Output Data Rate fADC — MCLK/256 — Serial Clock Frequency fCLK — 20 MHz 4/MCLK VDD = 5V Window for serial mode entry codes tWINDOW — — 32/ MCLK — Last bit must be clocked in before this time. Window start time for serial mode entry codes tWINSET 1/MCLK — — — First bit must be clocked in after this time. Serial Clock High Time tHI — — 25 ns fCLK= 20 MHz Serial Clock Low Time tLO — — 25 ns fCLK= 20 MHz tSUCS 15 — — ns tSU 10 — — ns CS Fall to First Rising CLK Edge Data Input Setup Time Data Input Hold Time tHD — — 10 ns CS Rise to Output Disable tDIS — — 150 ns CLK Rise to Output Data Valid tDO — — 30 ns SDO Rise Time tR — 2 — ns SDO Fall Time tF — 2 — ns Note 1: 2: 3: 4: If output pulse period (tFP) falls below 984376*2 MCLK periods, then tFW = 1/2 tFP. If output pulse period (tHP) falls below 322160*2 MCLK periods, then tHW = 1/2 tHP. When F2, F1, F0 equals 0,1,1, the HFOUT pulse time is fixed at 64 x MCLK periods or 18 µs for MCLK = 3.58 MHz. Specified by characterization, not production tested. Serial timings specified and production tested with 180 pF load. DS22025C-page 6 2006-2012 Microchip Technology Inc. MCP3909 tFP tFW FOUT0 tFS tFS2 FOUT1 tHW HFOUT tHP NEG FIGURE 1-1: Output Timings for Active Power Pulse Outputs and Negative Power Pin. CS tSUCS tCLK tHI tLO CLK tSU tHD SDI tDO SDO FIGURE 1-2: Hi-z tR tF tDIS Serial Interface Timings showing Output, Rise, Hold, and CS Times. 2006-2012 Microchip Technology Inc. DS22025C-page 7 MCP3909 VDD V –V DD OL R = -----------------------------------IOL SPI Data Output Pin FIGURE 1-3: DS22025C-page 8 180 pF VOH R = -----------------I OH SPI Output Pin Loading Circuit During SPI Testing. 2006-2012 Microchip Technology Inc. MCP3909 2.0 TYPICAL PERFORMANCE CURVES Note: The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. 1 0.8 0.6 0.4 0.2 +25°C 0 -0.2 -0.4 -0.6 -0.8 -1 0.0000 Measurement Error (%) Measurement Error (%) Note: Unless otherwise specified, DVDD, AVDD = 5V; AGND, DGND = 0V; VREF = Internal, HPF = 1 (AC mode), MCLK = 3.58 MHz, CH1 input = 660 mVP-P at 50 Hz, CH0 amplitude sweeps at 50 Hz. +85°C -40°C 0.0001 ` 0.0010 0.0100 0.1000 1 0.8 0.6 0.4 0.2 0 -0.2 -0.4 -0.6 -0.8 -1 0.0000 CH0 Vp-p Amplitude (V) +25°C - 40°C 0.0010 0.0100 0.1000 1 0.8 0.6 0.4 0.2 0 -0.2 -0.4 -0.6 -0.8 -1 0.0000 +85°C - 40°C 0.0100 0.1000 +25°C 1.0000 CH0 Vp-p Amplitude (V) FIGURE 2-3: Active Power Measurement Error (Gain = 2, PF = 1). 2006-2012 Microchip Technology Inc. 0.0010 0.0100 0.1000 +85°C +25°C -40°C 0.0001 0.0010 0.0100 0.1000 FIGURE 2-5: Active Power Measurement Error (Gain = 16, PF = 0.5). Measurement Error (%) Measurement Error (%) FIGURE 2-2: Active Power Measurement Error (Gain = 16, PF = 1). 0.0010 0.0001 CH0 Vp-p Amplitude (V) CH0 Vp-p Amplitude (V) 1 0.8 0.6 0.4 0.2 0 -0.2 -0.4 -0.6 -0.8 -1 0.0001 -40°C FIGURE 2-4: Active Power Measurement Error (Gain = 8, PF = 0.5). Measurement Error (%) Measurement Error (%) +85°C 0.0001 +25°C CH0 Vp-p Amplitude (V) FIGURE 2-1: Active Power Measurement Error (Gain = 8, PF = 1). 1 0.8 0.6 0.4 0.2 0 -0.2 -0.4 -0.6 -0.8 -1 0.0000 +85°C 1 0.8 0.6 0.4 0.2 0 -0.2 -0.4 -0.6 -0.8 -1 0.0001 +85°C +25°C -40°C 0.0010 0.0100 0.1000 1.0000 CH0 Vp-p Amplitude (V) FIGURE 2-6: Active Power Measurement Error (Gain =2, PF = 0.5). DS22025C-page 9 MCP3909 1 0.8 0.6 0.4 0.2 0 -0.2 -0.4 -0.6 -0.8 -1 0.0001 Measurement Error (%) Measurement Error (%) Note: Unless otherwise specified, DVDD, AVDD = 5V; AGND, DGND = 0V; VREF = Internal, HPF = 1 (AC mode), MCLK = 3.58 MHz, CH1 input = 660 mVP-P at 50 Hz, CH0 amplitude sweeps at 50 Hz. +85°C +25°C - 40°C 0.0010 0.0100 0.1000 1.0000 CH0 Vp-p Amplitude (V) FIGURE 2-7: Active Power Measurement Error (Gain = 1, PF = 1). 1 0.8 0.6 0.4 0.2 0 -0.2 -0.4 -0.6 -0.8 -1 0.0001 +25°C; PF = 1 +25°C; PF = 0.5 +125°C; PF = 0.5 +125°C; PF = 1 0.001 0.01 0.1 CH1 Vp-p Amplitude (V) 1 FIGURE 2-10: Measurement Error, Temperature = +125°C, Gain = 2. 1 0.8 0.6 0.4 0.2 0 -0.2 -0.4 -0.6 -0.8 -1 0.0001 Measurement Error (%) Measurement Error (%) L +85°C +25°C -40°C 0.0010 0.0100 0.1000 1.0000 CH0 Vp-p Amplitude (V) FIGURE 2-8: Active Power Measurement Error (Gain = 1, PF = 0.5). +25°C; PF = 1 +25°C; PF = 0.5 +125°C; PF = 0.5 +125°C; PF = 1 0.001 0.01 0.1 CH1 V A lit d Error, (V) Measurement FIGURE 2-9: Temperature = +125°C, Gain = 1. 1 1 FIGURE 2-11: Measurement Error, Temperature = +125°C, Gain = 8. Measurement Error (%) Measurement Error (%) 1 0.8 0.6 0.4 0.2 0 -0.2 -0.4 -0.6 -0.8 -1 0.0001 1 0.8 0.6 +25°C; PF = 1 0.4 +25°C; PF = 0.5 0.2 0 +125°C; PF = 0.5 -0.2 -0.4 -0.6 +125°C; PF = 1 -0.8 -1 0.0001 0.001 0.01 0.1 CH1 Vp-p Amplitude (V) 1 0.8 0.6 0.4 0.2 0 -0.2 -0.4 -0.6 -0.8 -1 0.0001 +25°C; PF = 1 +25°C; PF = 0.5 +125°C; PF = 0.5 +125°C; PF = 1 0.001 0.01 0.1 CH1 Vp-p Amplitude (V) 1 FIGURE 2-12: Measurement Error, Temperature = +125°C, Gain = 16. DS22025C-page 10 2006-2012 Microchip Technology Inc. MCP3909 Note: Unless otherwise specified, DVDD, AVDD = 5V; AGND, DGND = 0V; VREF = Internal, HPF = 1 (AC mode), MCLK = 3.58 MHz, CH1 input = 660 mVP-P at 50 Hz, CH0 amplitude sweeps at 50 Hz. 1200 3000 1000 O cOccurance currence 2000 1500 1000 800 16384 Samples Mean = -1.65 mV Std. Dev = 16.99 µV 600 400 200 500 FIGURE 2-13: Channel 0 Offset Error (DC Mode, HPF off, G = 1, PF = 1). 600 2000 500 O cOccurance currence O cOccurance currence -1.59 -1.60 -1.61 -1.62 FIGURE 2-15: Channel 0 Offset Error (DC Mode, HPF off, G = 8, PF = 1). 16384 Samples Mean = -1.20 mV Std. Dev. = 25.1 µV 2500 -1.64 Bin (mV) Bin (mV) 3000 -1.65 -1.50 -1.66 -1.59 -1.67 -1.68 -1.68 -1.77 -1.69 -1.72 0 0 -1.70 O cOccurance currence 2500 16,384 Samples Mean = -1.62 mV Std. Dev = 54.6 µV 1500 1000 500 16384 Samples Mean = - 17.91 mV Std. Dev = - 1.22 µV 400 300 200 100 -1.11 -1.13 -1.16 -1.18 -1.20 -1.22 -1.25 -1.27 -1.30 0 Bin (mV) FIGURE 2-14: Channel 0 Offset Error (DC Mode, HPF off, G = 2, PF = 1). 2006-2012 Microchip Technology Inc. 0 -1.30 -1.25 -1.23 -1.20 -1.17 Bin (mV) FIGURE 2-16: Channel 0 Offset Error (DC Mode, HPF Off, G = 16, PF = 1). DS22025C-page 11 MCP3909 Note: Unless otherwise specified, DVDD, AVDD = 5V; AGND, DGND = 0V; VREF = Internal, HPF = 1 (AC mode), MCLK = 3.58 MHz, CH1 input = 660 mVP-P at 50 Hz, CH0 amplitude sweeps at 50 Hz. 0.3 0.2 Measurement Error (%) Measurement Error (%) 0.3 0.25 VDD=5.0V 0.15 0.1 VDD=4.5V 0.05 VDD=5.25V 0 VDD=4.75V -0.05 VDD=5.5V -0.1 -0.15 0.0001 0.0010 0.0100 0.1000 0.2 0.1 -0.2 FIGURE 2-17: Active Power Measurement Error over VDD , Internal VREF (G = 16, PF = 1). Measurement Error (%) Measurement Error (%) 0.15 VDD=4.5V VDD=4.75V 0.05 VDD=5.0V VDD=5.25V -0.05 VDD=5.5V -0.1 0.0001 0.0010 0.0100 0.1000 1.0000 1 0.8 0.6 0.4 0.2 0 -0.2 -0.4 -0.6 -0.8 -1 0.0001 PF = 0.5 PF = 1 50 55 60 65 70 75 Frequency (Hz) FIGURE 2-19: Active Power Measurement Error vs. Input Frequency (G = 16). DS22025C-page 12 1.0000 +85°C +25°C -40°C 0.0010 0.0100 0.1000 1.0000 FIGURE 2-21: Active Power Measurement Error with External VREF (G = 1, PF = 0.5). Measurement Error (%) % Error FIGURE 2-18: Active Power Measurement Error over VDD, External VREF (G = 1, PF = 1). 45 0.1000 CH1 Vp-p Amplitude (V) CH0 Vp-p Amplitude (V) 0.5 0.4 0.3 0.2 0.1 0 -0.1 -0.2 -0.3 -0.4 -0.5 0.0100 FIGURE 2-20: Active Power Measurement Error with External VREF (G = 1, PF = 1). 0.2 0 0.0010 CH0 Vp-p Amplitude (V) CH0 Vp-p Amplitude (V) 0.1 +25°C - 40°C -0.1 -0.3 0.0001 1.0000 +85°C 0 0.5 0.4 0.3 0.2 0.1 0 +25°C -0.1 -0.2 -0.3 -0.4 -0.5 0.0001 +85°C - 40°C 0.0010 0.0100 0.1000 1.0000 CH0 Vp-p Amplitude (V) FIGURE 2-22: Active Power Measurement Error with External VREF (G = 2, PF = 1). 2006-2012 Microchip Technology Inc. MCP3909 +85°C -40°C 0.0100 0.1000 1 0.8 0.6 0.4 0.2 0 -0.2 - 40°C -0.4 -0.6 -0.8 -1 0.0000 1.0000 +85°C -40°C 0.0010 0.0100 0.1000 1 0.8 0.6 0.4 0.2 +25°C 0 -0.2 -0.4 -0.6 -0.8 -1 0.0000 +85°C -40°C 0.0010 0.0100 0.1000 CH1 Vp-p Amplitude (V) FIGURE 2-25: Active Power Measurement Error with External VREF (G = 8, PF = 0.5). 2006-2012 Microchip Technology Inc. 0.0100 0.1000 -40°C +85°C 0.0001 0.0010 0.0100 0.1000 FIGURE 2-27: Active Power Measurement Error with External VREF (G =16, PF = 0.5). SINAD (dBFS) Measurement Error (%) FIGURE 2-24: Active Power Measurement Error with External VREF (G = 8, PF = 1). 0.0001 0.0010 CH1 Vp-p Amplitude (V) CH1 Vp-p Amplitude (V) 1 0.8 0.6 0.4 0.2 +25°C 0 -0.2 -0.4 -0.6 -0.8 -1 0.0000 0.0001 FIGURE 2-26: Active Power Measurement Error with External VREF (G = 16, PF = 1). Measurement Error (%) Measurement Error (%) FIGURE 2-23: Active Power Measurement Error with External VREF (G = 2, PF = 0.5). 0.0001 +25°C CH1 Vp-p Amplitude (V) CH1 Vp-p Amplitude (V) 1 0.8 0.6 0.4 0.2 +25°C 0 -0.2 -0.4 -0.6 -0.8 -1 0.0000 +85°C 100 90 80 70 60 50 40 30 20 10 0 0.0001 100 90 80 SINAD (dBFS) 70 60 SINAD(dB) 50 40 30 20 10 SINAD (dB) 1 0.8 0.6 0.4 0.2 0 -0.2 +25°C -0.4 -0.6 -0.8 -1 0.0001 0.0010 Measurement Error (%) Measurement Error (%) Note: Unless otherwise specified, DVDD, AVDD = 5V; AGND, DGND = 0V; VREF = Internal, HPF = 1 (AC mode), MCLK = 3.58 MHz, CH1 input = 660 mVP-P at 50 Hz, CH0 amplitude sweeps at 50 Hz. 0 0.0010 0.0100 0.1000 1.0000 CH0 Vp-p Amplitude (V) FIGURE 2-28: Signal-to-Noise and Distortion Ratio vs. Input Signal Amplitude (G = 1). DS22025C-page 13 MCP3909 100 100 90 90 80 80 SINAD (dBFS) 70 70 60 60 50 50 40 40 30 30 SINAD (dB) 20 20 10 10 0 0 0.000010 0.000100 0.001000 0.010000 0.100000 CH0 Vp-p Amplitude (V) CH0 Vp-p Amplitude (V) SINAD (dBFS) SINAD (dB) 0.0001 0.001 0.01 0.1 CH0 Vp-p Amplitude (V) FIGURE 2-30: Signal-to-Noise and Distortion Ratio vs. Input Signal Amplitude (G = 8). DS22025C-page 14 0 -20 Amplitude (dB) 100 90 80 70 60 50 40 30 20 10 0 FIGURE 2-31: Signal-to-Noise and Distortion Ratio vs. Input Signal Amplitude (G = 16). SINAD (dB) SINAD (dBFS) FIGURE 2-29: Signal-to-Noise and Distortion Ratio vs. Input Signal Amplitude (G = 2). 100 90 80 70 60 50 40 30 20 10 0 0.00001 SINAD (dB) SINAD (dBFS) 100 100 90 90 SINAD (dBFS) 80 80 70 70 60 60 50 50 SINAD (dB) 40 40 30 30 20 20 10 10 0 0 0.000100 0.001000 0.010000 0.100000 1.000000 SINAD (dB) SINAD (dBFS) Note: Unless otherwise specified, DVDD, AVDD = 5V; AGND, DGND = 0V; VREF = Internal, HPF = 1 (AC mode), MCLK = 3.58 MHz, CH1 input = 660 mVP-P at 50 Hz, CH0 amplitude sweeps at 50 Hz. -40 -60 -80 -100 -120 -140 -160 0 2000 4000 6000 Frequency (Hz) FIGURE 2-32: Frequency Spectrum, 50 Hz Input Signal. 2006-2012 Microchip Technology Inc. MCP3909 3.0 PIN DESCRIPTIONS The descriptions of the pins are listed in Table 3-1. TABLE 3-1: MCP3909 PIN FUNCTION TABLE Symbol Description SSOP 3.1 1 DVDD Digital Power Supply Pin 2 HPF High-Pass Filters Control Logic Pin 3 AVDD Analog Power Supply Pin 4 NC 5 CH0+ Non-Inverting Analog Input Pin for Channel 0 (Current Channel) 6 CH0- Inverting Analog Input Pin for Channel 0 (Current Channel) 7 CH1- Inverting Analog Input Pin for Channel 1 (Voltage Channel) 8 CH1+ Non-Inverting Analog Input Pin for Channel 1 (Voltage Channel) 9 MCLR Master Clear Logic Input Pin 10 REFIN/OUT 11 AGND Analog Ground Pin, Return Path for internal analog circuitry 12 SCK / F2 Serial Clock or Frequency Control for HFOUT Logic Input Pin 13 SDI / F1 Serial Data Input or Frequency Control for FOUT0/1 Logic Input Pin 14 CS / F0 Chip Select or Frequency Control for FOUT0/1 Logic Input Pin 15 G1 Gain Control Logic Input Pin 16 G0 Gain Control Logic Input Pin 17 OSC1 Oscillator Crystal Connection Pin or Clock Input Pin 18 OSC2 Oscillator Crystal Connection Pin or Clock Output Pin 19 NC 20 SDO / NEG 21 DGND Digital Ground Pin, Return Path for Internal Digital Circuitry 22 HFOUT High-Frequency Logic Output Pin (Intended for Calibration) 23 FOUT1 Differential Mechanical Counter Logic Output Pin 24 FOUT0 Differential Mechanical Counter Logic Output Pin No Connect Voltage Reference Input/Output Pin No Connect Serial Data Out or Negative Power Logic Output Pin Digital VDD (DVDD) DVDD is the power supply pin for the digital circuitry within the MCP3909 device. This pin requires appropriate bypass capacitors and should be maintained to 5V ±10% for specified operation. Refer to Section 6.0 “Applications Information”. 2006-2012 Microchip Technology Inc. 3.2 High-Pass Filter Input Logic Pin (HPF) HPF controls the state of the high-pass filter in both input channels. A logic ‘1’ enables both filters, removing any DC offset coming from the system or the device. A logic ‘0’ disables both filters allowing DC voltages to be measured. DS22025C-page 15 MCP3909 3.3 Analog VDD (AVDD) AVDD is the power supply pin for the analog circuitry within the MCP3909. This pin requires appropriate bypass capacitors and should be maintained to 5V ±10% for specified operation. Refer to Section 6.0 “Applications Information”. 3.4 Current Channel (CH0-, CH0+) CH0- and CH0+ are the fully differential analog voltage input channels for the current measurement, containing a PGA for small-signal input, such as shunt current sensing. The linear and specified region of this channel is dependant on the PGA gain. This corresponds to a maximum differential voltage of ±470 mV/G and maximum absolute voltage, with respect to AGND, of ±1V. Up to ±6V can be applied to these pins without the risk of permanent damage. Refer to Section 1.0 “Electrical Characteristics”. 3.5 Voltage Channel (CH1-,CH1+) CH1- and CH1+ are the fully differential analog voltage input channels for the voltage measurement. The linear and specified region of these channels have a maximum differential voltage of ±660 mV and a maximum absolute voltage of ±1V, with respect to AGND. Up to ±6V can be applied to these pins without the risk of permanent damage. Refer to Section 1.0 “Electrical Characteristics”. 3.6 Master Clear (MCLR) MCLR controls the reset for both delta-sigma ADCs, all digital registers, the SINC filters for each channel and all accumulators post multiplier. The MCLR pin is also used to change pin functionality and enter the serial interface mode. A logic ‘0’ resets all registers and holds both ADCs in a Reset condition. The charge stored in both ADCs is flushed and their output is maintained to 0x0000h. The only block consuming power on the digital power supply during Reset is the oscillator circuit. 3.7 Reference (REFIN/OUT) REFIN/OUT is the output for the internal 2.4V reference. This reference has a typical temperature coefficient of 15 ppm/°C and a tolerance of ±2%. In addition, an external reference can also be used by applying voltage to this pin within the specified range. This pin requires appropriate bypass capacitors to AGND, even when using the internal reference only. 3.8 Analog Ground (AGND) AGND is the ground connection to internal analog circuitry (ADCs, PGA, band gap reference, POR). To ensure accuracy and noise cancellation, this pin must be connected to the same ground as DGND, preferably with a star connection. If an analog ground plane is available, it is recommended that this device be tied to this plane of the PCB. This plane should also reference all other analog circuitry in the system. 3.9 Serial Clock Input or F2 Frequency Control Pin This dual function pin can act as either the serial clock input for SPI communication or the F2 selection for the high-frequency output and low-frequency output pin ranges, changing the value of the constants FC and HFC used in the device transfer function. FC and HFC are the frequency constants that define the period of the output pulses for the device. 3.10 Serial Data Input or F1 Frequency Control Pin This dual function pin can act as either the serial data input for SPI communication or the F1 selection for the high-frequency output and low-frequency output pin ranges, changing the value of the constants FC and HFC used in the device transfer function. FC and HFC are the frequency constants that define the period of the output pulses for the device. 3.11 Chip Select (CS) or F0 Frequency Control Pin This dual function pin can act as either the chip select for SPI communication or the F0 selection for the highfrequency output and low-frequency output pin ranges by changing the value of the constants FC and HFC used in the device transfer function. FC and HFC are the frequency constants that define the period of the output pulses for the device. 3.12 Gain Control Logic Pins (G1, G0) G1 and G0 select the PGA gain (G) on Channel 0 from four different values: 1, 2, 8 and 16. Refer to Section 6.0 “Applications Information”. DS22025C-page 16 2006-2012 Microchip Technology Inc. MCP3909 3.13 Oscillator (OSC1, OSC2) OSC1 and OSC2 provide the master clock for the device. A resonant crystal or clock source with a similar sinusoidal waveform must be placed across these pins to ensure proper operation. The typical clock frequency specified is 3.579545 MHz. However, the clock frequency can be within the range of 1 MHz to 4 MHz without disturbing measurement error. Appropriate load capacitance should be connected to these pins for proper operation. A full-swing, single-ended clock source may be connected to OSC1 with proper resistors in series to ensure no ringing of the clock source due to fast transient edges. 3.14 Serial Data Output or Negative Power Output Logic Pin (NEG) This dual function pin can act as either the serial data output for SPI communication or NEG. NEG detects the phase difference between the two channels and will go to a logic ‘1’ state when the phase difference is greater than 90° (i.e., when the measured real power is negative). The output state is synchronous with the rising edge of HFOUT and maintains the logic ‘1’ until the real power becomes positive again and HFOUT shows a pulse. 3.15 3.16 High-Frequency Output (HFOUT) HFOUT is the high-frequency output of the device and supplies the instantaneous real-power information. The output is a periodic pulse output, with its period proportional to the measured real power, and to the HFC constant defined by F0, F1 and F2 pin logic states. This output is the preferred output for calibration due to faster output frequencies, giving smaller calibration times. Since this output gives instantaneous real power, the 2 ripple on the output should be noted. However, the average period will show minimal drift. 3.17 Frequency Output (FOUT0, FOUT1) FOUT0 and FOUT1 are the frequency outputs of the device that supply the average real-power information. The outputs are periodic pulse outputs, with its period proportional to the measured real power, and to the FC constant, defined by F0 and F1 pin logic states. These pins include high-output drive capability for direct use of electromechanical counters and 2-phase stepper motors. Since this output supplies average real power, any 2 ripple on the output pulse period is minimal. Ground Connection (DGND) DGND is the ground connection to internal digital circuitry (SINC filters, multiplier, HPF, LPF, digital-to-frequency converter and oscillator). To ensure accuracy and noise cancellation, DGND must be connected to the same ground as AGND, preferably with a star connection. If a digital ground plane is available, it is recommended that this device be tied to this plane of the Printed Circuit Board (PCB). This plane should also reference all other digital circuitry in the system. 2006-2012 Microchip Technology Inc. DS22025C-page 17 MCP3909 4.0 DEVICE OVERVIEW 4.1 Active Power The instantaneous power signal contains the active power information; it is the DC component of the instantaneous power. The averaging technique can be used with both sinusoidal and non-sinusoidal waveforms, as well as for all power factors. The instantaneous power is thus low-pass filtered in order to produce the instantaneous real-power signal. The MCP3909 is an energy metering IC that serves two distinct functions that can operate simultaneously: - Active Power Pulse Output - Waveform Output via SPI Interface For the active power output, the device supplies a frequency output proportional to active (real) power, and higher frequency output proportional to the instantaneous power for meter calibration. A digital-to-frequency converter accumulates the instantaneous active real power information to produce output pulses with a frequency proportional to the average real power. The low-frequency pulses present at the FOUT0 and FOUT1 outputs are designed to drive electromechanical counters and two-phase stepper motors displaying the real-power energy consumed. Each pulse corresponds to a fixed quantity of real energy, selected by the F2, F1 and F0 logic settings. The HFOUT output has a higher frequency setting and less integration period such that it can represent the instantaneous real-power signal. Due to the shorter accumulation time, it enables the user to proceed to faster calibration under steady load conditions (see Section 4.8 “Active Power FOUT0/1 and HFOUT Output Frequencies”). For the waveform output, it can be used serially to gather 16-bit voltage channel and current channel A/D data, or 20-bit wide multiplier output data. Both channels use 16-bit, second-order, delta-sigma ADCs that oversample the input at a frequency equal to MCLK/4, allowing for wide dynamic range input signals. A Programmable Gain Amplifier (PGA) increases the usable range on the current input channel (Channel 0). Figure 4-1 represents the simplified block diagram of the MCP3909, detailing its main signal processing blocks. Two digital high-pass filters cancel the system offset on both channels such that the real-power calculation does not include any circuit or system offset. After being high-pass filtered, the voltage and current signals are multiplied to give the instantaneous power signal. This signal does not contain the DC offset components, such that the averaging technique can be efficiently used to give the desired active-power output. MCP3909 CH0+ + CH0- PGA ??A ? DC ANALOG HPF X DIGITAL ..0101... LPF CH1+ + CH1- - Frequency Content ? 0 Input Signal with System offset and line frequency FIGURE 4-1: DS22025C-page 18 DTF HPF ??A ? DC 0 FOUT0 FOUT1 HFOUT ? ADC Output code contains System and ADC offset 0 ? DC Offset removed by HPF 0 ? ? 0 ? INSTANTANEOUS POWER ? ? ? INSTANTANEOUS REAL POWER Active Power Signal Flow with Frequency Contents. 2006-2012 Microchip Technology Inc. MCP3909 Analog Inputs The MCP3909 analog inputs can be connected directly to the current and voltage transducers (such as shunts or current transformers). Each input pin is protected by specialized ESD structures that are certified to pass 5 kV HBM and 500V MM contact charge. These structures also allow up to ±6V continuous voltage to be present at their inputs without the risk of permanent damage. Both channels have fully differential voltage inputs for better noise performance. The absolute voltage at each pin relative to AGND should be maintained in the ±1V range during operation in order to ensure the measurement error performance. The common-mode signals should be adapted to respect both the previous conditions and the differential input voltage range. For best performance, the common-mode signals should be referenced to AGND. The current channel comprises a PGA on the front-end to allow for smaller signals to be measured without additional signal conditioning. The maximum differential voltage specified on Channel 0 is equal to ±470 mV/ Gain (see Table 4-1). The maximum peak voltage specified on Channel 1 is equal to ±660 mV. TABLE 4-1: GAIN SELECTIONS G1 G0 CH0 Gain Maximum CH0 Voltage 0 0 1 1 0 1 0 1 1 2 8 16 ±470 mV ±235 mV ±60 mV ±30 mV 4.3 16-Bit Delta-Sigma A/D Converters The ADCs used in the MCP3909 for both current and voltage channel measurements are delta-sigma ADCs. They comprise a second-order, delta-sigma modulator using a multi-bit DAC and a third-order SINC filter. The delta-sigma architecture is very appropriate for the applications targeted by the MCP3909 because it is a waveform-oriented converter architecture that can offer both high linearity and low distortion performance throughout a wide input dynamic range. It also creates minimal requirements for the anti-aliasing filter design. The multi-bit architecture used in the ADC minimizes quantization noise at the output of the converters without disturbing the linearity. 2006-2012 Microchip Technology Inc. Each ADC has a 16-bit resolution, allowing wide input dynamic range sensing. The oversampling ratio of both converters is 64. Both converters are continuously converting during normal operation. When the MCLR pin is low, both converters will be in Reset and output code 0x0000h. If the voltage at the inputs of the ADC is larger than the specified range, the linearity is no longer specified. However, the converters will continue to produce output codes until their saturation point is reached. The DC saturation point is around 700 mV for Channel 0 and 1V for Channel 1, using internal voltage reference. The output code will be locked past the saturation point to the maximum output code. The clocking signals for the ADCs are equally distributed between the two channels in order to minimize phase delays to less than 1 MCLK period (see Section 3.2 “High-Pass Filter Input Logic Pin (HPF)”). The SINC filters main notch is positioned at MCLK/256 (14 kHz with MCLK = 3.58 MHz), allowing the user to be able to measure wide harmonic content on either channel. The data ready signals used for synchronization of the part with a MCU will come at a rate of MCLK/256 and a pipeline delay of 3 data readys is required to settle the SINC 3rd order digital filter. The magnitude response of the SINC filter is shown in Figure 4-2. Normal Mode Rejection (dB) 4.2 0 -20 -40 -60 -80 -100 -120 0 5 10 15 20 25 30 Frequency (kHz) FIGURE 4-2: SINC Filter Magnitude Response (MCLK = 3.58 MHz). DS22025C-page 19 MCP3909 Ultra-Low Drift VREF The MCP3909 contains an internal voltage reference source specially designed to minimize drift over temperature. This internal VREF supplies reference voltage to both current and voltage channels ADCs. The typical value of this voltage reference is 2.4V ±100 mV. The internal reference has a very low typical temperature coefficient of ±15 ppm/°C, allowing the output frequencies to have minimal variation with respect to temperature since they are proportional to (1/VREF)². The output pin for the voltage reference is REFIN/OUT. Appropriate bypass capacitors must be connected to the REFIN/OUT pin for proper operation (see Section 6.0 “Applications Information”). The voltage reference source impedance is typically 4 kΩ which enables this voltage reference to be overdriven by an external voltage reference source. If an external voltage reference source is connected to the REFIN/OUT pin, the external voltage will be used as the reference for both current and voltage channel ADCs. The voltage across the source resistor will then be the difference between the internal and external voltage. The allowed input range for the external voltage source goes from 2.2V to 2.6V for accurate measurement error. A VREF value outside of this range will cause additional heating and power consumption due to the source resistor, which might affect measurement error. 4.5 Power-On Reset (POR) The MCP3909 contains an internal POR circuit that monitors analog supply voltage AVDD during operation. This circuit ensures correct device startup at system power-up and system power-down events. The POR circuit has built-in hysteresis and a timer to give a high degree of immunity to potential ripple and noise on the power supplies, allowing proper settling of the power supply during power-up. A 0.1 µF decoupling capacitor should be mounted as close as possible to the AVDD pin, providing additional transient immunity (see Section 6.0 “Applications Information”). The threshold voltage is typically set at 4V, with a tolerance of about ±5%. If the supply voltage falls below this threshold, the MCP3909 will be held in a Reset condition (equivalent to applying logic ‘0’ on the MCLR pin). The typical hysteresis value is approximately 200 mV in order to prevent glitches on the power supply. Once a power-up event has occurred, an internal timer prevents the part from outputting any pulse for approximately 1s (with MCLK = 3.58 MHz), thereby preventing potential metastability due to intermittent resets caused by an unsettled regulated power supply. Figure 4-3 illustrates the different conditions for a power-up and a power-down event in the typical conditions. DS22025C-page 20 AVDD 5V 4.2V 4V 1s 0V DEVICE MODE RESET NO PULSE OUT FIGURE 4-3: 4.6 Time PROPER OPERATION RESET Power-On Reset Operation. High-Pass Filters and Multiplier The active real-power value is extracted from the DC instantaneous power. Therefore, any DC offset component present on Channel 0 and Channel 1 affects the DC component of the instantaneous power and will cause the real-power calculation to be erroneous. In order to remove DC offset components from the instantaneous power signal, a high-pass filter has been introduced on each channel. Since the high-pass filtering introduces phase delay, identical high-pass filters are implemented on both channels. The filters are clocked by the same digital signal, ensuring a phase difference between the two channels of less than one MCLK period. Under typical conditions (MCLK = 3.58 MHz), this phase difference is less than 0.005°, with a line frequency of 50 Hz. The cut-off frequency of the filter (4.45 Hz) has been chosen to induce minimal gain error at typical line frequencies, allowing sufficient settling time for the desired applications. The two highpass filters can be disabled by applying logic ‘0’ to the HPF pin. Normal Mode Rejection (dB) 4.4 0 -5 -10 -15 -20 -25 -30 -35 -40 0.1 1 10 100 1000 Frequency (Hz) FIGURE 4-4: HPF Magnitude Response (MCLK = 3.58 MHz). 2006-2012 Microchip Technology Inc. MCP3909 The multiplier output gives the product of the two high-pass filtered channels, corresponding to instantaneous real power. Multiplying two sine wave signals by the same ω frequency gives a DC component and a 2ω component. The instantaneous power signal contains the real power of its DC component, while also containing 2ω components coming from the line frequency multiplication. These 2ω components come for the line frequency (and its harmonics) and must be removed in order to extract the real-power information. This is accomplished using the low-pass filter and DTF converter. 4.7 Active Power Low-Pass Filter and DTF Converter For the active power signal calculation, the MCP3909 uses a digital low-pass filter. This low-pass filter is a first-order IIR filter, which is used to extract the active real-power information (DC component) from the instantaneous power signal. The magnitude response of this filter is detailed in Figure 4-5. Due to the fact that the instantaneous power signal has harmonic content (coming from the 2 components of the inputs), and since the filter is not ideal, there will be some ripple at the output of the low-pass filter at the harmonics of the line frequency. Normal Mode Rejection (dB) The cut-off frequency of the filter (8.9 Hz) has been chosen to have sufficient rejection for commonly-used line frequencies (50 Hz and 60 Hz). With a standard input clock (MCLK = 3.58 MHz) and a 50 Hz line frequency, the rejection of the 2ω component (100 Hz) will be more than 20 dB. This equates to a 2ω component containing 10 times less power than the main DC component (i.e., the average active real power). The output of the low-pass filter is accumulated in the digital-to-frequency converter. This accumulation is compared to a different digital threshold for FOUT0/1 and HFOUT, representing a quantity of real energy measured by the part. Every time the digital threshold on FOUT0/1 or HFOUT is crossed, the part will output a pulse (See Section 4.8 “Active Power FOUT0/1 and HFOUT Output Frequencies”). The equivalent quantity of real energy required to output a pulse is much larger for the FOUT0/1 outputs than the HFOUT. This is such that the integration period for the FOUT0/1 outputs is much larger. This larger integration period acts as another low-pass filter so that the output ripple due to the 2ω components is minimal. However, these components are not totally removed, since realized low-pass filters are never ideal. This will create a small jitter in the output frequency. Averaging the output pulses with a counter or a MCU in the application will then remove the small sinusoidal content of the output frequency and filter out the remaining 2 ripple. HFOUT is intended to be used for calibration purposes due to its instantaneous power content. The shorter integration period of HFOUT demands that the 2ω component be given more attention. Since a sinusoidal signal average is zero, averaging the HFOUT signal in steady-state conditions will give the proper real energy value. 0 -5 -10 -15 -20 -25 -30 -35 -40 0.1 1 10 100 1000 Frequency (Hz) FIGURE 4-5: LPF1 Magnitude Response (MCLK = 3.58 MHz). 2006-2012 Microchip Technology Inc. DS22025C-page 21 MCP3909 4.8 Active Power FOUT0/1 and HFOUT Output Frequencies The thresholds for the accumulated energy are different for FOUT0/1 and HFOUT (i.e., they have different transfer functions). The FOUT0/1 allowed output frequencies are quite low in order to allow superior integration time (see Section 4.7 “Active Power LowPass Filter and DTF Converter”). The FOUT0/1 output frequency can be calculated with the following equation: EQUATION 4-1: Where: FOUT FREQUENCY OUTPUT EQUATION 8.06 V 0 V1 G F C F OUT Hz = ---------------------------------------------------------2 VREF V0 = the RMS differential voltage on Channel 0 V1 = the RMS differential voltage on Channel 1 G = the PGA gain on Channel 0 (current channel) FC = the frequency constant selected VREF = the voltage reference For a given DC input V, the DC and RMS values are equivalent. For a given AC input signal with amplitude of V, the equivalent RMS value is V/ sqrt(2), assuming purely sinusoidal signals. Note that since the real power is the product of two RMS inputs, the output frequencies of AC signals are half of the DC inputs ones, again assuming purely sinusoidal AC signals. The constant FC depends on the FOUT0 and FOUT1 digital settings. Table 4-2 shows FOUT0/1 output frequencies for the different logic settings. TABLE 4-2: ACTIVE POWER OUTPUT FREQUENCY CONSTANT FC FOR FOUT0/1 (VREF = 2.4V) F1 F0 FC (Hz) FC (Hz) (MCLK = 3.58 MHz) FOUT Frequency (Hz) with Full-Scale DC Inputs FOUT Frequency (Hz) with Full-Scale AC Inputs 0 0 MCLK/221 1.71 0.74 0.37 0 1 20 MCLK/2 3.41 1.48 0.74 1 0 MCLK/219 6.83 2.96 1.48 1 18 13.66 5.93 2.96 1 MCLK/2 The high-frequency output HFOUT has lower integration times and, thus, higher frequencies. The output frequency value can be calculated with the following equation: DS22025C-page 22 2006-2012 Microchip Technology Inc. MCP3909 EQUATION 4-2: ACTIVE POWER HFOUT FREQUENCY OUTPUT EQUATION 8.06 V 0 V 1 G HF C HF OUT Hz = ----------------------------------------------------------------2 V REF Where: V0 = the RMS differential voltage on Channel 0 V1 = the RMS differential voltage on Channel 1 G = the PGA gain on Channel 0 (current channel) HFC = the frequency constant selected VREF = the voltage reference The constant HFC depends on the FOUT0 and FOUT1 digital settings with the Table 4-3. The detailed timings of the output pulses are described in the Timing Characteristics table (see Section 1.0 “Electrical Characteristics” and Figure 1-1). TABLE 4-3: 4.8.1 MINIMAL OUTPUT FREQUENCY FOR NO-LOAD THRESHOLD The MCP3909 also includes, on each output frequency, a no-load threshold circuit that will eliminate any creep effects in the meter. The outputs will not show any pulse if the output frequency falls below the no-load threshold. This threshold only applies to the pulse outputs and does not gate any serial data coming from either the A/D output or the multiplier output. The minimum output frequency on FOUT0/1 and HFOUT is equal to 0.0015% of the maximum output frequency (respectively FC and HFC) for each of the F2, F1 and F0 selections (see Table 4-2 and Table 4-3); except when F2, F1, F0 = 011. In this last configuration, the no-load threshold feature is disabled. The selection of FC will determine the start-up current load. In order to respect the IEC standards requirements, the meter will have to be designed to allow start-up currents compatible with the standards by choosing the FC value matching these requirements. For additional applications information on no-load threshold, startup current and other meter design points, refer to AN994, "IEC Compliant Active Energy Meter Design Using The MCP3905/6”, (DS00994). OUTPUT FREQUENCY CONSTANT HFC FOR HFOUT (VREF = 2.4V) F2 F1 F0 HFC HFC (Hz) HFC (Hz) (MCLK = 3.58 MHz) HFOUT Frequency (Hz) with full scale AC Inputs 0 0 0 64 x FC MCLK/215 109.25 27.21 32 x FC MCLK/215 109.25 27.21 16 x FC MCLK/215 109.25 27.21 0 0 0 1 1 0 0 1 1 2048 x FC MCLK/27 27968.75 6070.12 1 0 0 128 x FC MCLK/216 219.51 47.42 64 x FC MCLK/216 219.51 47.42 32 x FC MCLK/216 219.51 47.42 16 x FC MCLK/216 219.51 47.42 1 1 1 0 1 1 1 0 1 2006-2012 Microchip Technology Inc. DS22025C-page 23 MCP3909 5.0 5.1 SERIAL INTERFACE DESCRIPTION DVDD HPF AVDD NC CH0+ CH0CH1CH1+ Dual Functionality Pin And Serial Interface Overview The MCP3909 device contains three serial modes that are accessible by changing the pin functionality of the NEG, F2, F1, and F0 pins to SDO, SCK, SDI and CS, respectively. These modes are entered by giving the MCP3909 device a serial command on these pins during a time window after device reset or POR. During this window of time, F2 acts as SCK, F1 acts as SDI and F0 acts as CS. Once a serial mode has been entered, the device must be reset to disable mode functionality, or change to another serial mode. This is done by using MCLR pin or power on reset event. MCLR REFIN/OUT AGND F2/SCK FIGURE 5-1: the MCP3909. 1 2 3 4 5 6 7 8 9 10 11 12 24 23 22 21 20 19 18 17 16 15 14 13 FOUT0 FOUT1 HFOUT DGND NEG/SDO NC CLKOUT CLKIN G0 G1 F0/CS F1/SDI Dual Functionality Pins for During serial mode entry and the three serial modes, data is clocked into the device on the rising edge of SCK and out of the device on the falling edge of SCK. The SPI data can be access at up to 20 MHz. This speed enables quick data retrieval in between conversion times. For 3-phase metering applications with multiple ADCs, this fast communication is essential to allow for power calculation windows between conversions, as shown in Figure 5-3. After a serial mode has been entered, all blocks of the MCP3909 device are still operational. The PGA, A/D converters, HPF, multiplier, LPF, and other digital sections are still functional, allowing the device to have true dual functionality in energy metering systems. IRQ tSAMPLE tLINE_CYC IRQ Phase A,B,C I & V Data SDO DR 16 bits x 6 ADCs DR tSAMPLE FIGURE 5-2: DS22025C-page 24 Data Access between Data Ready Pulses using SPI Interface for a 3-phase System. 2006-2012 Microchip Technology Inc. MCP3909 MCLR tWINDOW tWINSET 1 2 3 4 5 6 7 8 F2 / SCK F0 / CS F1 / SDI D7 D6 D5 D4 D3 D2 FIGURE 5-3: 5.2 D1 D0 Dual Functionality Pin Serial Mode Entry Protocol. Serial Mode Entry Codes The MCP3909 devices contains three different serial modes with data presented in 2's complement coding. • Multiplier Output • Dual Channel Output • Filter Input After entering any of these modes the active power calculation block is still functional and presents output pulses on FOUT0, FOUT1, and HFOUT. For this reason, the F2, F1, F0 output frequency selection constant can be changed with multiple command bytes for serial mode entry. The command bytes to enter these modes are described in Table 5-1. TABLE 5-1: ENTRY CODES Internal State of F2, F1, F0 Constants Frequency Selection During Serial Mode (1) Command D7......D0 Serial Mode 1 0 1 0 0 0 0 1 Multiplier Output 0 F1 pin 1 1 0 1 0 1 0 0 1 Multiplier Output 1 F1 pin 1 1 0 1 0 0 1 0 0 Dual Channel Output Pre HPF1 0 F1 pin 1 1 0 1 0 1 1 0 0 Dual Channel Output Post HPF1 1 F1 pin 1 1 0 1 0 1 0 1 0 Filter Input 1 0 F0 pin 1 0 1 0 1 1 1 0 Filter Input 1 1 F0 pin 1 0 1 0 0 0 1 0 Filter Input 0 0 F0 pin 1 0 1 0 0 1 1 0 Filter Input 0 1 F0 pin Note 1: F2 F1 F0 The active power frequency outputs FOUT0, FOUT1, and HFOUT remain active after serial mode entry. Leaving the SDI (F1) and CS (F0) pins at a known state after serial communication will control the frequency selection. The HPF pin controls the state of the HPF for the multiplier mode output and the output pulses from the active power D to F block. 2006-2012 Microchip Technology Inc. DS22025C-page 25 MCP3909 5.3 Multiplier Output Mode Multiplier mode allows the user to retrieve the output of the multiplier on the MCP3909 device. Data is presented in a 20 bit (19 bit + sign) protocol, MSB first. A data ready flag (DR) is output for every MCLK/256 clock cycles and a new multiplier output value is ready. If the multiplier value is not clocked out of the device it will be over-written. Data is clocked out on the rising edge of SCK. EQUATION 5-1: + – + – CH0 – CH0 CH1 – CH1 Multiplier Code = ---------------------------------------------------------------------------------- 524288 8.06 G VREF 2 TABLE 5-2: MULTIPLIER OUTPUT MODE CODING Binary Decimal 0 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 +524287 0 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 0 +524286 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 -1 1 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 1 -524287 1 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 -524288 F0 / CS 1 2 3 4 X 20 17 18 19 20 F2 / SCK X 20 NEG / SDO Hi-z DR D19 D18 D17 D16 SIGN MSB F1 / SDI FIGURE 5-4: DS22025C-page 26 D3 Hi-z D2 D1 0 D0 Hi-z LSB Multiplier Output Mode. 2006-2012 Microchip Technology Inc. MCP3909 5.4 Dual Channel Output Mode This mode allows the user to retrieve the individual channel information from the ADC outputs. The ADC outputs of both channels are synchronized together and their data ready is represented by the data ready pulse on SDO. If the ADC output values are not clocked out of the device, they will be over-written. A 32-bit data word is given, each channel is 16 bits (15 bits + sign), presented in 2's complement coding. Channel 1 comes first then channel 0. A data ready flag (DR) is output for every MCLK / 256 clock cycles and a new filter output value is ready. If the dual channel output values are not clocked, and is not clocked out of the device, they will be over-written. The following formulas relate the channel input voltages to their respective output code. The code locks to +32767 on the positive side, and to -32768 on the negative side. EQUATION 5-2: VIN+ – V IN- 0.66 Channel 0 Code = ------------------------------------ 32768 8.06 ----------- PGA V 0.47 REF V –V IN+ IN0.47 Channel 1 Code = ------------------------------------ 32768 8.06 ----------- V 0.66 REF TABLE 5-3: CHANNEL OUTPUT MODE CODING Binary 0 0 0 1 1 1 111 111 000 111 000 000 5.5 1111 1111 0000 1111 0000 0000 1111 1111 0000 1111 0000 0000 Decimal 1111 1110 0000 1111 0001 0000 + 32,767 + 32,766 0 -1 - 32,767 - 32,768 High-Pass Filter Control There are two options for the channel output data. The first options collects the channel data pre-high pass filter, or the output of the SINC filter of the delta sigma modulator. The second option collects the channel data post high pass filter. It is important to note that the HPF pin controls the state of the high pass filter for this second option. If the HPF pin is low, the post high pass filter mode will output all zero's. This HPF pin must be high to access the post HPF data in the channel output mode. 2006-2012 Microchip Technology Inc. DS22025C-page 27 MCP3909 F0 / CS 1 2 X 32 X 16 15 16 X 16 17 18 31 32 F2 / SCK X 16 NEG / SDO Hi-z DR D15 D14 D1 D31 D30 D17 D16 Hi-z Hi-z F1 / SDI 5.6 D0 Channel 0 Channel 1 FIGURE 5-5: X 16 X 32 Dual Channel Output Mode. Filter Input Mode The filter input mode allows the user to feed the MCP3909 device an input to the LPF1. Data is received MSB first. The MCP3909 will treat this data as if it were the output of the multiplier and will LPF and D-F the result as normal, giving the resulting output frequency on HFOUT, FOUT0 and FOUT1. See Tables 4-2 and 4-3 for transfer functions of the output frequencies. When using filter input mode, the user must wait for the data ready flag (DR) to appear on SDO before attempting to clock in data to the device. The user can not access either the multiplier output or the dual channel output while in this mode. F0 / CS X 20 1 2 3 4 17 18 19 20 D3 D1 F2 / SCK X 20 F1 / SDI NEG / SDO FIGURE 5-6: DS22025C-page 28 D19 Hi-z D18 D17 D16 D2 D0 Hi-z DR Filter Input Mode. 2006-2012 Microchip Technology Inc. MCP3909 5.7 Using the MCP3909 with Microcontroller (MCU) SPI Ports With microcontroller SPI ports, it is required to send groups of eight bits. It is also required that the microcontroller SPI port be configured to clock out data on the falling edge of clock and latch data in on the rising edge, or vice versa depending on the mode. 5.7.1 SPI MODE DEFINITIONS The following table represents the standard SPI mode terminology, the respective PIC bit settings, and a description of compatibility for the MCP3909 device. The MCP3909 works in SPI mode 0,1 mode, that is the data is clocked out of the part on the rising edge and clocked in on the falling edge of SCK. TABLE 5-4: Standard SPI Mode Terminology SPI MODE COMPATIBILITY PIC Control Bits State MCP3909 Compatibility Description CKP CKE 0,0 0 1 — Idle state for clock is low level, transmit (from PIC) occurs from active to idle clock state 0,1 0 0 √ Idle state for clock is low level, transmit (from PIC) occurs from idle to active clock state 1,0 1 1 — Idle state for clock is high level, transmit (from PIC) occurs from active to idle clock state 1,1 1 0 — Idle state for clock is high level, transmit (from PIC) occurs from idle to active clock state 2006-2012 Microchip Technology Inc. DS22025C-page 29 MCP3909 F0 / CS MCU latches data from Device on falling edges of SCK F2 / SCK 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 Data is clocked out on rising edges of SCK F1 / SDI Don’t Care NEG / SDO D19 D18 D17 D16 D15 D14 D13 MCU Transmit Buffer MCU Receive Buffer X X X X X X X D11 D10 D9 D8 D7 D6 D5 D4 D12 X X X X X X X X X D19 D18 D17 D16 D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 Data is stored into the MCU receive register after transmission of the first 8 bits Data is stored into the MCU receive register after transmission of the second 8 bits F0 / CS F2 / SCK 17 18 F1 / SDI 19 20 21 22 23 24 Don’t Care D3 D2 D1 D0 NEG / SDO MCU Transmit Buffer X MCU Receive Buffer D3 D2 D1 D0 X X X X X X X 0 0 0 0 X = Don’t Care Bits Data is stored into the MCU receive register after transmission of the third 8 bits FIGURE 5-7: SCK idles low). DS22025C-page 30 N = Null Bits Multiplier Output Mode 1 SPI Communication using 8-bit segments (Mode 0,1: 2006-2012 Microchip Technology Inc. MCP3909 F0 / CS MCU latches data from Device on falling edges of SCK 1 F2 / SCK 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 Data is clocked out on rising edges F1 / SDI Don’t Care CHANNEL 0 NEG / SDO D15 D14 D13 D12 D11 D10 D9 D8 MCU Transmit Buffer X MCU Receive Buffer X X X X X X D6 D5 D4 D3 D2 D1 D0 D7 X X X X X X X X X D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0 CH0 Data is stored into the MCU receive register after transmission of the first 8 bits CH0 Data is stored into the MCU receive register after transmission of the second 8 bits F0 / CS MCU latches data from Device on falling edges of SCK F2 / SCK 17 18 20 19 21 22 23 24 25 26 27 28 29 30 31 32 Data is clocked out on rising edges F1 / SDI Don’t Care CHANNEL 1 NEG / SDO MCU Transmit Buffer MCU Receive Buffer D15 D14 D13 D12 D11 D10 D9 D8 X X X X X X X X D15 D14 D13 D12 D11 D10 D9 D8 CH1 Data is stored into the MCU receive register after transmission of the third 8 bits D7 X D6 D5 D4 D3 D2 D1 D0 X X X X X X X D7 D6 D5 D4 D3 D2 D1 D0 CH1 Data is stored into the MCU receive register after transmission of the fourth 8 bits FIGURE 5-8: Dual Channel Output Mode SPI Communication using 8-bit segments (Mode 0,1: SCK idles low). 2006-2012 Microchip Technology Inc. DS22025C-page 31 MCP3909 6.0 APPLICATIONS INFORMATION The following application figures represent meter designs using the MCP3909 device. Some of these applications ideas are available as fully function meter reference designs and demo boards. For complete schematic and for fully function meter designs, visit Microchip’s web page for demo board and reference design availability. 6.1 Performing RMS, Apparent Power, and Active Power using MCP3909 Waveform Data Output registers for the power quantities and calibration registers for phase, offset, gain, and LSB adjustment are available through a serial interface to the PIC microcontroller. See Microchip’s web page for firmware solution and demo board. The example signal flow here shows 4 output power quantities and 6 calibration registers. For a 60 Hz design that is using 128 samples per line cycle for the power calculation the MCP3909 would have a new data ready pulse every 130 µs. The SPI communication to gather 16-bits x 2 channels at 10 MHz is approximately 3.2 µs, leaving ~125 µs for the power calculations before the next sample is ready. Figure 6-1 represents power calculations from waveform data based on a PIC MCU and MCP3909 device. The PIC MCU accomplishes the following energy meter calculation outputs per phase, per line cycle: - RMS Current RMS Voltage Active Power Apparent Power . MCP3909 PIC Microcontroller RMS Current ADC CURRENT X S X2 PHA_I_RMS_OFF:16 X S X X Apparent Power PHA_VA_GAIN:16 Active Power VOLTAGE ADC PHA_DELAY:8 PHA_W_GAIN:16 PHA_W_OFF:32 PHA_V_RMS_OFF:16 F X2 S RMS Voltage FIGURE 6-1: Power Calculations from Waveform Sampling Using a PIC MCU. Register names shown are used on MCP3909 Energy Meter Reference Design. DS22025C-page 32 2006-2012 Microchip Technology Inc. MCP3909 6.2 Achieving Line Cycle Sampling with Zero Blind Cycles A simpler lower cost option would be to choose a frequency that would give an integer number of line cycles for exactly 50 Hz (or 60 Hz). This is possible using a 39.3216 MHz crystal for the PIC18F device. In most energy meter applications, it will be necessary to have 2N samples for each 50 or 60 Hz line cycle, where N is typically 64, 128 or 256. Controlling the MCLK of the MCP3909 allows you to control the sample rate and ultimately the data ready (DR) pulses for coherent waveform sampling. Figure 6-2 shows example clock frequencies to achieve 128 samples for each line cycle, 1.63 MHz for a 50 Hz line, or 1.96 MHz for a 60 Hz line. The MCP3909 clock can operate from 1 MHz to 4 MHz. Using this approach, the PIC MCU can gather the waveform data immediately after the data ready pulse, at up to 10 MHz. The remainder of the time can be used to calculate the power measurements to achieve true line cycle sampling with zero blind cycles. The following scheme shows how the TIMER and COMPARATOR modules of the PIC MCU can be used to generate the clock for the MCP3909 from either a PLL internal MCLK. For class 0.2 or class 0.1 meter designs that require harmonic analysis using a PLL is recommended to shift sample rate with line cycle drift, e.g. line cycle changes from 60 Hz to 59.1 Hz. This is shown as option 1 in Figure 6-2. For more information and firmware, see the Microchip web page for demo board information. 128 samples/line cycle X1 Phase A || B || C 50 (or 60 Hz) 39.3216 MHz (50 or 60 Hz) 1.63 MHz (50) PLL Circuit x 32768 1.96 MHz (60) 3.579 MHz PIC MCU CCP2 / 32768 Option 1 Option 2 MCLK input SDO SDO IRQ To PIC MCU IRQ MCP3909 SDO MCP3909 MCP3909 DR Pulse tSAMPLE tLINE_CYC IRQ Phase A,B,C I & V Data SDO DR 16 bits x 6 ADCs DR tSAMPLE FIGURE 6-2: Using the PIC device to control the MCP3909 MCLK to achieve 2N samples per line cycle, 3-phase sampling shown with 6 ADCs. 2006-2012 Microchip Technology Inc. DS22025C-page 33 MCP3909 N L PHA_W:16 ENERGY_W:64 ENERGY_VA_GLSB:16 PHA_I_RMS:16 PHA_V_RMS:16 kW kWhr kVAhr A V CH1+ CH1- MCP3909 AGND,DGND SCK SDI SDO CS Power Supply Circuitry RC3/SCK RC5/SDO RC4/SDI RA0/ANO ... RB7 RC1/CCP2 OSC1 40 MHZ Resistor Divider AVDD,DVDD CLKIN PIC MCU CH0+ CH0- RB0 LCD OSC2 RX/RC6 TX/RC7 GND FIGURE 6-3: 6.3 RS-232 To PC or Calibration Equipment Simplified MCU Based Energy Meter. Meter Calibration To achieve meter calibration the MCP3909 waveform samples are adjusted during the power calculations on the PIC MCU. In Figure 6-3, this interface is shown via RS-232 on the PIC microcontroller. This process is streamlined using calibration software available from the Microchip’s web site. 6.4 Analog Meter Design Tips For analog design tips and PCB layout recommendations, refer to AN994, "IEC Compliant Active Energy Meter Design Using The MCP390X” (DS00994). This application note includes all required energy meter design information, including the following: • • • • • • • • • • • • Meter rating and current sense choices Shunt design PGA selection F2, F1, F0 selection Meter calibration Anti-aliasing filter design Compensation for parasitic shunt inductance EMC design Power supply design No-Load threshold Start-up current Accuracy testing results from MCP390X-based meter • EMC testing results from MCP390X-based meter DS22025C-page 34 2006-2012 Microchip Technology Inc. MCP3909 7.0 PACKAGING INFORMATION 7.1 Package Marking Information 24-Lead SSOP Examples: XXXXXXXXXXXX XXXXXXXXXXXX YYWWNNN MCP3909 e3 I/SS^^ 1140256 MCP3909 e3 E/SS^^ 1140256 Legend: XX...X Y YY WW NNN e3 * Note: Customer-specific information Year code (last digit of calendar year) Year code (last 2 digits of calendar year) Week code (week of January 1 is week ‘01’) Alphanumeric traceability code Pb-free JEDEC designator for Matte Tin (Sn) This package is Pb-free. The Pb-free JEDEC designator ( e3 ) can be found on the outer packaging for this package. In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. 2006-2012 Microchip Technology Inc. DS22025C-page 35 MCP3909 /HDG3ODVWLF6KULQN6PDOO2XWOLQH66±PP%RG\>6623@ 1RWH )RUWKHPRVWFXUUHQWSDFNDJHGUDZLQJVSOHDVHVHHWKH0LFURFKLS3DFNDJLQJ6SHFLILFDWLRQORFDWHGDW KWWSZZZPLFURFKLSFRPSDFNDJLQJ D N E E1 1 2 NOTE 1 b e c φ A2 A A1 L L1 8QLWV 'LPHQVLRQ/LPLWV 1XPEHURI3LQV 0,//,0(7(56 0,1 1 120 0$; 3LWFK H 2YHUDOO+HLJKW $ ± %6& ± 0ROGHG3DFNDJH7KLFNQHVV $ 6WDQGRII $ ± ± 2YHUDOO:LGWK ( 0ROGHG3DFNDJH:LGWK ( 2YHUDOO/HQJWK ' )RRW/HQJWK / )RRWSULQW / 5() /HDG7KLFNQHVV F ± )RRW$QJOH /HDG:LGWK E ± 1RWHV 3LQYLVXDOLQGH[IHDWXUHPD\YDU\EXWPXVWEHORFDWHGZLWKLQWKHKDWFKHGDUHD 'LPHQVLRQV'DQG(GRQRWLQFOXGHPROGIODVKRUSURWUXVLRQV0ROGIODVKRUSURWUXVLRQVVKDOOQRWH[FHHGPPSHUVLGH 'LPHQVLRQLQJDQGWROHUDQFLQJSHU$60(<0 %6& %DVLF'LPHQVLRQ7KHRUHWLFDOO\H[DFWYDOXHVKRZQZLWKRXWWROHUDQFHV 5() 5HIHUHQFH'LPHQVLRQXVXDOO\ZLWKRXWWROHUDQFHIRULQIRUPDWLRQSXUSRVHVRQO\ 0LFURFKLS 7HFKQRORJ\ 'UDZLQJ &% DS22025C-page 36 2006-2012 Microchip Technology Inc. MCP3909 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 2006-2012 Microchip Technology Inc. DS22025C-page 37 MCP3909 NOTES: DS22025C-page 38 2006-2012 Microchip Technology Inc. MCP3909 APPENDIX A: REVISION HISTORY Revision C (March 2012) The following is the list of modifications: 1. 2. 3. 4. Added the extended temperature option to the features list. Updated Section 2.0 “Typical Performance Curves” with new extended temperature graphs. Added the package markings information for the extended temperature option. Updated the Product Identification System page. Revision B (April 2009) Updated EDS information and Timing Characteristics in Section 1.0 “Electrical Characteristics”. Revision A (December 2006) Original release of this document. 2006-2012 Microchip Technology Inc. DS22025C-page 39 MCP3909 NOTES: DS22025C-page 40 2006-2012 Microchip Technology Inc. MCP3909 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. PART NO. -X /XX Device Temperature Range Package Device: a) MCP3909-I/SS: b) Industrial Temperature, 24LD SSOP. MCP3909T-I/SS: Tape and Reel, Industrial Temperature, 24LD SSOP. c) MCP3909-E/SS: d) Extended Temperature, 24LD SSOP. MCP3909T-E/SS: Tape and Reel, = -40°C to +85°C = -40°C to +125°C SS = Plastic Shrink Small Outline (209 mil Body), 24-lead 2006-2012 Microchip Technology Inc. Energy Metering IC Energy Metering IC MCP3909: Energy Metering IC MCP3909T: Energy Metering IC (Tape and Reel) Temperature Range: I E Package: Examples: Energy Metering IC Energy Metering IC Extended Temperature, 24LD SSOP. DS22025C-page 41 MCP3909 NOTES: DS22025C-page 42 2006-2012 Microchip Technology Inc. Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. • Microchip is willing to work with the customer who is concerned about the integrity of their code. • Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, dsPIC, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART, PIC32 logo, rfPIC and UNI/O are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor, MXDEV, MXLAB, SEEVAL and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Analog-for-the-Digital Age, Application Maestro, chipKIT, chipKIT logo, CodeGuard, dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN, ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial Programming, ICSP, Mindi, MiWi, MPASM, MPLAB Certified logo, MPLIB, MPLINK, mTouch, Omniscient Code Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit, PICtail, REAL ICE, rfLAB, Select Mode, Total Endurance, TSHARC, UniWinDriver, WiperLock and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. © 2006-2012, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. ISBN: 978-162076-064-2 QUALITY MANAGEMENT SYSTEM CERTIFIED BY DNV == ISO/TS 16949 == 2006-2012 Microchip Technology Inc. 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