Package Outline Drawing (POD)

Plastic Packages for Integrated Circuits
Plastic Ball Grid Array Packages (BGA)
o
A
A1 CORNER
V196.12x12
D
196 BALL PLASTIC BALL GRID ARRAY PACKAGE
INCHES
A1 CORNER I.D.
E
B
TOP VIEW
0.15
M C A B
0.006
0.08
M C
0.003
b
A1
CORNER
D1
14 13 12 11 10 9 8 7 6 5 4 3 2 1
S
A
S
A
A1
CORNER I.D.
MIN
MAX
MIN
MAX
NOTES
A
-
0.059
-
1.50
-
A1
0.012
0.016
0.31
0.41
-
A2
0.037
0.044
0.93
1.11
-
b
0.016
0.020
0.41
0.51
7
D/E
0.468
0.476
11.90
12.10
-
D1/E1
0.405
0.413
10.30
10.50
-
N
196
196
-
e
0.032 BSC
0.80 BSC
-
MD/ME
14 x 14
14 x 14
3
bbb
0.004
0.10
-
aaa
0.005
0.12
Rev. 2 12/00
NOTES:
1. Controlling dimension: MILLIMETER. Converted inch
dimensions are not necessarily exact.
e
7. Dimension “b” is measured at the maximum ball diameter,
parallel to the primary datum C.
2. Dimensioning and tolerancing conform to ASME Y14.5M-1994.
3. “MD” and “ME” are the maximum ball matrix size for the “D”
and “E” dimensions, respectively.
4. “N” is the maximum number of balls for the specific array size.
5. Primary datum C and seating plane are defined by the spherical crowns of the contact balls.
6. Dimension “A” includes standoff height “A1”, package body
thickness and lid or cap height “A2”.
ALL ROWS AND COLUMNS
8. Pin “A1” is marked on the top and bottom sides adjacent to A1.
9. “S” is measured with respect to datum’s A and B and defines
the position of the solder balls nearest to package centerlines. When there is an even number of balls in the outer row
the value is “S” = e/2.
A1
A2
bbb C
aaa C
C
A
SEATING PLANE
112
SYMBOL
A
B
C
D
E
F
G
E1
H
J
K
L
M
N
P
BOTTOM VIEW
SIDE VIEW
MILLIMETERS