Plastic Packages for Integrated Circuits Plastic Ball Grid Array Packages (BGA) o A A1 CORNER V196.12x12 D 196 BALL PLASTIC BALL GRID ARRAY PACKAGE INCHES A1 CORNER I.D. E B TOP VIEW 0.15 M C A B 0.006 0.08 M C 0.003 b A1 CORNER D1 14 13 12 11 10 9 8 7 6 5 4 3 2 1 S A S A A1 CORNER I.D. MIN MAX MIN MAX NOTES A - 0.059 - 1.50 - A1 0.012 0.016 0.31 0.41 - A2 0.037 0.044 0.93 1.11 - b 0.016 0.020 0.41 0.51 7 D/E 0.468 0.476 11.90 12.10 - D1/E1 0.405 0.413 10.30 10.50 - N 196 196 - e 0.032 BSC 0.80 BSC - MD/ME 14 x 14 14 x 14 3 bbb 0.004 0.10 - aaa 0.005 0.12 Rev. 2 12/00 NOTES: 1. Controlling dimension: MILLIMETER. Converted inch dimensions are not necessarily exact. e 7. Dimension “b” is measured at the maximum ball diameter, parallel to the primary datum C. 2. Dimensioning and tolerancing conform to ASME Y14.5M-1994. 3. “MD” and “ME” are the maximum ball matrix size for the “D” and “E” dimensions, respectively. 4. “N” is the maximum number of balls for the specific array size. 5. Primary datum C and seating plane are defined by the spherical crowns of the contact balls. 6. Dimension “A” includes standoff height “A1”, package body thickness and lid or cap height “A2”. ALL ROWS AND COLUMNS 8. Pin “A1” is marked on the top and bottom sides adjacent to A1. 9. “S” is measured with respect to datum’s A and B and defines the position of the solder balls nearest to package centerlines. When there is an even number of balls in the outer row the value is “S” = e/2. A1 A2 bbb C aaa C C A SEATING PLANE 112 SYMBOL A B C D E F G E1 H J K L M N P BOTTOM VIEW SIDE VIEW MILLIMETERS