Plastic Packages for Integrated Circuits Plastic Ball Grid Array Packages (BGA) o V100.11x11 A1 CORNER 100 BALL PLASTIC BALL GRID ARRAY PACKAGE A INCHES D A1 CORNER I.D. E B TOP VIEW 0.15 M C 0.006 0.08 0.003 M C A B A1 CORNER D1 10 9 8 7 6 5 4 3 2 1 S A1 CORNER I.D. A B C D E F G E1 H J K b A MILLIMETERS SYMBOL MIN MAX MIN MAX NOTES A - 0.055 - 1.40 - A1 0.012 0.016 0.31 0.41 - A2 0.033 0.039 0.83 0.99 - b 0.016 0.020 0.40 0.51 7 D/E 0.429 0.437 10.90 11.10 - D1/E1 0.350 0.358 8.90 9.10 - N 100 100 - e 0.039 BSC 1.0 BSC - MD/ME 10 x 10 10 x 10 3 bbb 0.004 0.10 - aaa 0.005 0.12 Rev. 0 6/03 NOTES: 1. Controlling dimension: MILLIMETER. Converted inch dimensions are not necessarily exact. 2. Dimensioning and tolerancing conform to ASME Y14.5M-1994. 3. “MD” and “ME” are the maximum ball matrix size for the “D” and “E” dimensions, respectively. 4. “N” is the maximum number of balls for the specific array size. 5. Primary datum C and seating plane are defined by the spherical crowns of the contact balls. S A e ALL ROWS AND COLUMNS 6. Dimension “A” includes standoff height “A1”, package body thickness and lid or cap height “A2”. 7. Dimension “b” is measured at the maximum ball diameter, parallel to the primary datum C. BOTTOM VIEW 8. Pin “A1” is marked on the top and bottom sides adjacent to A1. A1 A2 bbb C aaa C C SEATING PLANE A SIDE VIEW 1 9. “S” is measured with respect to datum’s A and B and defines the position of the solder balls nearest to package centerlines. When there is an even number of balls in the outer row the value is “S” = e/2.