Package Outline Drawing (POD)

Plastic Packages for Integrated Circuits
Package Outline Drawing
S3x3.9
3X3 ARRAY 9 BUMP OPTICAL CHIP SCALE PACKAGE (OCSP)
Rev 7, 10/10
2.155 ±0.025
A1
CORNER
1.30
A
0.65
B
A1
CORNER
3
2
1.30
1
A
2.155 ±0.025
B
C
TOP VIEW
0.30 ±0.03
5
0.15 M C A B
0.08 M C
0.65
BOTTOM VIEW
0.825 ±0.045
0.10 C
1.045 MAX
SEATING PLANE
C
0.16 ±0.03
0.10 C
SIDE VIEW
(1.30)
(1.30)
(0.65)
NOTES:
1. Dimensions are in millimeters.
Dimensions in ( ) for Reference only.
2. Dimensioning and tolerancing conform to ASME Y 14.5M-1994
3. Primary datum C and seating plane are defined by the spherical
crowns of the contact balls.
(0.30)
(0.65)
TYPICAL RECOMMENDED LAND PATTERN
1
4. Pin "A1" is marked on the top and bottom side adjacent to the
A1 ball.
5. Dimension is measured at the maximum ball diameter.