Hermetic Packages for Integrated Circuits Package Outline Drawing K18.C 18 LEAD CERAMIC METAL SEAL CERAMIC LID FLATPACK PACKAGE Rev 1, 4/10 A 0.050 BSC (1.27 BSC) A 1 PIN NO. 1 ID AREA 0.450 (11.43) 0.430 (10.92) -A- 2 -B- 0.022 (0.56) 0.015 (0.38) 0.360 (9.14) MAX 0.004 M H A-B S D S 2 0.036 M 4 0.000 (0.00) MIN H A-B S D S TOP VIEW 6 0.045 (1.14) 0.026 (0.66) 0.009 (0.23) 0.004 (0.10) 0.340 (8.64) 0.320 (8.13) -D- 0.320 (8.13) 0.280 (7.11) SEATING AND BASE PLANE 0.030 (0.76) MIN -C- 0.030 (0.76) MIN 0.125 (3.18) 0.095 (2.41) 0.240 (6.10) 0.220 (5.59) 5 0.320 (8.13) 0.280 (7.11) -H- 5 SIDE VIEW NOTES: 1. Index area: A notch or a pin one identification mark shall be located adjacent to pin one and shall be located within the shaded area shown. The manufacturer’s identification shall not be used as a pin one identification mark. Alternately, a tab may be used to identify pin one. 2. This dimension allows for off-center lid, meniscus, and glass overrun. 3. The maximum limits of lead dimensions shall be measured at the centroid of the finished lead surfaces, when solder dip or tin plate lead finish is applied. 4. Measure dimension at all four corners. 5. For bottom-brazed lead packages, no organic or polymeric materials shall be molded to the bottom of the package to cover the leads. 6. Dimension shall be measured at the point of exit (beyond the meniscus) of the lead from the body. Dimension minimum shall be reduced by 0.0015 inch (0.038mm) maximum when solder dip lead finish is applied. 7. Dimensioning and tolerancing per ANSI Y14.5M - 1982. 8. Controlling dimension: INCH. 0.006 (0.15) 0.004 (0.10) LEAD FINISH 0.0015 (0.04) MAX 0.009 (0.23) 0.004 (0.10) BASE METAL 0.019 (0.48) 0.015 (0.38) 0.0015 (0.04) MAX 0.022 (0.56) 0.015 (0.38) 3 SECTION A-A 1