Hermetic Packages for Integrated Circuits Package Outline Drawing K8.A 8 LEAD CERAMIC METAL SEAL FLATPACK PACKAGE Rev 4, 12/14 0.015 (0.38) 0.008 (0.20) PIN NO. 1 ID OPTIONAL 1 2 0.050 (1.27 BSC) 0.005 (0.13) MIN 4 PIN NO. 1 ID AREA 0.022 (0.56) 0.015 (0.38) 0.110 (2.79) 0.087 (2.21) 0.265 (6.73) 0.245 (6.22) TOP VIEW 0.036 (0.92) 0.026 (0.66) 0.009 (0.23) 0.004 (0.10) 6 0.265 (6.75) 0.245 (6.22) -D- -H- -C0.180 (4.57) 0.170 (4.32) SEATING AND BASE PLANE 0.370 (9.40) 0.325 (8.26) 0.03 (0.76) MIN SIDE VIEW 0.007 (0.18) 0.004 (0.10) NOTES: LEAD FINISH 0.009 (0.23) BASE METAL 1. Index area: A notch or a pin one identification mark shall be located adjacent to pin one and shall be located within the shaded area shown. The manufacturer’s identification shall not be used as a pin one identification mark. Alternately, a tab may be used to identify pin one. 0.004 (0.10) 2. If a pin one identification mark is used in addition to or instead of a tab, the limits of the tab dimension do not apply. 0.019 (0.48) 0.015 (0.38) 0.0015 (0.04) MAX 0.022 (0.56) 0.015 (0.38) 3. The maximum limits of lead dimensions (section A-A) shall be measured at the centroid of the finished lead surfaces, when solder dip or tin plate lead finish is applied. 4. Measure dimension at all four corners. 3 SECTION A-A 5. For bottom-brazed lead packages, no organic or polymeric materials shall be molded to the bottom of the package to cover the leads. 6. Dimension shall be measured at the point of exit (beyond the meniscus) of the lead from the body. Dimension minimum shall be reduced by 0.0015 inch (0.038mm) maximum when solder dip lead finish is applied. 7. Dimensioning and tolerancing per ANSI Y14.5M - 1982. 8. Controlling dimension: INCH. 1