Hermetic Packages for Integrated Circuits Package Outline Drawing K14.C 14 LEAD CERAMIC METAL SEAL FLATPACK PACKAGE Rev 0, 9/12 A A 0.050 (1.27 BSC) PIN NO. 1 ID AREA 0.390 (9.91) 0.376 (9.55) 1 TOP VIEW 0.022 (0.56) 0.005 (0.13) MIN 3 0.015 (0.38) 0.115 (2.92) 0.009 (0.23) 0.045 (1.14) 0.085 (2.16) 0.026 (0.66) 5 0.260 (6.60) 0.248 (6.30) -C- BOTTOM METAL 0.183 (4.65) 0.370 (9.40) 0.167 (4.24) 0.270 (6.86) -H- 0.03 (0.76) MIN 6 SEATING AND BASE PLANE 0.004 (0.10) -D- SIDE VIEW BOTTOM METAL 0.005 (0.127) REF. OFFSET FROM CERAMIC EDGE OPTIONAL PIN 1 INDEX BOTTOM VIEW NOTES: 0.006 (0.15) 1. Index area: A notch or a pin one identification mark shall be located adjacent to pin one and shall be located within the shaded area shown. The manufacturer’s identification shall not be used as a pin one identification mark. LEAD FINISH 0.004 (0.10) 2. The maximum limits of lead dimensions (section A-A) shall be measured at the centroid of the finished lead surfaces, when solder dip or tin plate lead finish is applied. BASE METAL 0.019 (0.48) 0.015 (0.38) 0.0015 (0.04) MAX 4. For bottom-brazed lead packages, no organic or polymeric materials shall be molded to the bottom of the package to cover the leads. 6. The bottom of the package is a solderable metal surface. 2 1 3. Measure dimension at all four corners. 5. Dimension shall be measured at the point of exit (beyond the meniscus) of the lead from the body. Dimension minimum shall be reduced by 0.0015 inch (0.038mm) maximum when solder dip lead finish is applied. 0.022 (0.56) 0.015 (0.38) SECTION A-A 0.009 (0.23) 0.004 (0.10) 7. Dimensioning and tolerancing per ANSI Y14.5M - 1982. 8. Dimensions: INCH (mm). Controlling dimension: INCH.