Package Outline Drawing (POD)

Plastic Packages for Integrated Circuits
Package Outline Drawing
L12.4x4A
12 LEAD DUAL FLAT NO-LEAD PLASTIC PACKAGE
Rev 3, 3/15
2.5 REF
4.00
A
PIN #1 INDEX AREA
10X 0.50 BSC
6
B
6
1
12X 0 . 45
6
PIN 1
INDEX AREA
4.00
1.58
0.15
(4X)
12
7
TOP VIEW
0.10 M C A B
0.05 M C
4 12 X 0.25
2.80
BOTTOM VIEW
( 2.80 )
SEE DETAIL "X"
1.00 MAX
( 12 X 0.65 )
0.10 C
BASE PLANE C
SIDE VIEW
( 3.75)
SEATING PLANE
0.08 C
( 1.58)
0 . 2 REF
C
( 10X 0 . 5 )
0 . 00 MIN.
0 . 05 MAX.
( 12X 0 . 25)
DETAIL "X"
TYPICAL RECOMMENDED LAND PATTERN
NOTES:
1.
Dimensions are in millimeters.
Dimensions in ( ) for Reference Only.
2.
Dimensioning and tolerancing conform to AMSE Y14.5m-1994.
3.
Unless otherwise specified, tolerance : Decimal ± 0.05
4.
Lead width applies to the metallized terminal and is measured
between 0.15mm and 0.30mm from the terminal tip.
5.
6.
Tiebar shown (if present) is a non-functional feature and may
be located on any of the 4 sides (or ends).
The configuration of the pin #1 identifier is optional, but must be
located within the zone indicated. The pin #1 identifier may be
either a mold or mark feature.
1