Package Outline Drawing (POD)

Plastic Packages for Integrated Circuits
Package Outline Drawing
L10.2.1X3.5B
10 LEAD OPTICAL CO-PACKAGE
Rev 2, 4/15
6
PIN 1
INDEX AREA
EMITTING
REGION
A
2.10 7
0.65 7
1.70
A-A
0.36
B
0.40
0.48
0.68
2.65
0.30
1.00
0.50
3.50 7
2.67
4 0.20
(4X)
0.10 M C A B
0.10
A-A
0.76
0.20
LED
SIDE VIEW
TOP VIEW
BOTTOM VIEW
0.38
0.10
SEE DETAIL "X"
0.10 C
C
BASE PLANE
SEATING PLANE
0.08 C
0.80
1.49
1.17
SIDE VIEW
0.49
0.41
C 0 . 2 REF
DETECTOR DIMENSION
5
0 . 00 MIN.
0 . 05 MAX.
A-A SECTION
DETAIL "X"
PACKAGE
OUTLINE
0.015
1.00 (2X)
NOTES:
0.20 (10x)
2.67
0.50 (6X)
1.
Dimensions are in millimeters.
Dimensions in ( ) for Reference Only.
2.
Dimensioning and tolerancing conform to ASME Y14.5m-1994.
3.
Unless otherwise specified, tolerance : Decimal ± 0.05
4.
Dimension applies to the metallized terminal and is measured
between 0.15mm and 0.30mm from the terminal tip.
0.76
1.38
2.62
5.
Tiebar shown (if present) is a non-functional feature and may
be located on any of the 4 sides (or ends).
6.
The configuration of the pin #1 identifier is optional, but must be
located within the zone indicated. The pin #1 identifier may be
7.
Dimension tolerance is +0.05/-0.05.
TYPICAL RECOMMENDED LAND PATTERN
1
either a mold or mark feature.