Plastic Packages for Integrated Circuits Package Outline Drawing L18.5x3 18 LEAD THIN DUAL FLAT NO-LEAD PLASTIC PACKAGE (TDFN) Rev 2, 4/15 3.00 6 PIN #1 INDEX AREA A B 6 PIN 1 INDEX AREA 18 1 4 . 40 ± 0 . 15 5.00 16X 0.50 9 0.10 M C A B (4X) 0.15 b 4 0.25 ± 0.05 18X 0 . 4 ± 0 . 1 1.50 ± 0 . 15 TOP VIEW BOTTOM VIEW PACKAGE OUTLINE SEE DETAIL "X" 0.10 C 0 . 75 ± 0 . 05 C BASE PLANE SEATING PLANE 0.08 C SIDE VIEW 0.50 ( 4 . 40 TYP ) 0.25 C 0 . 15 REF 5 0 . 00 MIN. 0 . 05 MAX. DETAIL "X" 0.6 ( 1.50 TYP ) TYPICAL RECOMMENDED LAND PATTERN 1 NOTES: 1. Dimensions are in millimeters. Dimensions in ( ) for Reference Only. 2. Dimensioning and tolerancing conform to AMSE Y14.5m-1994. 3. Unless otherwise specified, tolerance : Decimal ± 0.05 4. Dimension b applies to the metallized terminal and is measured between 0.20mm and 0.30mm from the terminal tip. 5. Tiebar shown (if present) is a non-functional feature and may be located on any of the 4 sides (or ends). 6. The configuration of the pin #1 identifier is optional, but must be located within the zone indicated. The pin #1 identifier may be either a mold or mark feature.