Constant Current Relay Driver IFX52001 CCRD Data Sheet Rev.1.01, 2015-10-23 Standard Power IFX52001 1 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 2 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 3 3.1 3.2 Pin Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Pin Assignment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Pin Definitions and Functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 4 4.1 4.2 4.3 General Product Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Functional Range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Thermal Resistance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 5.1 5.2 Operation Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 6 Package Outlines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Green Product . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 7 Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Data Sheet 2 6 6 7 7 Rev.1.01, 2015-10-23 IFX52001 1 Overview Features • Reduces relay hold current to min. 40 mA • Functional at low supply voltage • Active freewheeling path using relay integrated freewheeling resistor • Overtemperature protection • Green Product (RoHS compliant) PG-DSO-8 (exposed pad) Description The IFX52001 is intended to drive relays with a constant current in order to reduce the coil current during relay hold phase. For relay activation, the IC pass element works as an activated switch for a limited period of time. After the activation time period has elapsed, the IC reduces the relay coil current to a lower constant value. Different operation modes allow adequate functionality also at very low or very high supply voltage. The IC is suited to operate with relay coil inductance, freewheeling resistor, operating voltage and environment conditions as required in industrial applications. For more details please refer to the operation range and electrical characteristics tables. The qualification of this product is based on JEDEC JESD47 and may reference existing qualification results of similar products. Such referencing is justified by the structural similarity of the products. The product is not qualified and manufactured according to the requirements of Infineon Technologies with regard to automotive and/or transportation applications. Infineon Technologies administrated a comprehensive quality management system according to the latest version of the ISO9001 and ISO/TS 16949. The most updated certificates of the aforesaid ISO9001 and ISO/TS 16949 are available on the Infineon Technologies web page http://www.infineon.com/cms/en/product/technology/quality/ Type Package Marking IFX52001 PG-DSO-8 (exposed pad) IFX52001 Data Sheet 3 Rev.1.01, 2015-10-23 IFX52001 Block Diagram 2 Block Diagram A Relay RL Freewheeling Resistor RF Relay Coil LR S IN Biasing Bandgap Constant Current Relay Driver Fwd Ctrl CS Driver D Delay CD CGND BlockDiagram.svg B Figure 1 Data Sheet Block Diagram and Simplified Application Circuit 4 Rev.1.01, 2015-10-23 IFX52001 Pin Configuration 3 Pin Configuration 3.1 Pin Assignment PG-DSO-8 (exposed pad) S 1 8 IN n.c. 2 7 n.c. n.c. 3 6 n.c. D 4 5 CGND Pinout.svg Figure 2 Pin Configuration 3.2 Pin Definitions and Functions Pin Symbol Function 1 S IC Supply; connect to relay coil freewheeling resistor according to Figure 1. 2, 3, 6, 7 n.c. Not Connected; connection to heat sink area and CGND recommended. 4 D Delay; for generating the activation time length, connect a ceramic capacitor between pin D and CGND. 5 CGND Relay Coil Current Output and IC Ground; 8 IN Relay Coil Current Input; connect to relay coil according to Figure 1. Exposed Pad – Data Sheet Exposed Pad; interconnect with CGND and heat sink area on PCB. 5 Rev.1.01, 2015-10-23 IFX52001 General Product Characteristics 4 General Product Characteristics 4.1 Absolute Maximum Ratings Table 1 Absolute Maximum Ratings 1) Tj = -40 °C to +125 °C; all voltages with respect to CGND, positive current flowing into pin (unless otherwise specified) Parameter Symbol Values Min. Typ. Max. Unit Note or Test Condition Number Pin S (IC Supply) Voltage at pin S VS -0.3 – 45 V VS > VIN or VIN open; IS externally not limited P_4.1.1 Current into pin S IS -400 – – mA VS < -0.3V P_4.1.2 Voltage at pin IN VIN -0.3 – 30 V VS > VIN or VS open; IIN externally not limited P_4.1.3 Current into pin IN IIN -250 – 400 mA – P_4.1.4 VD -0.3 – 6.8 V – P_4.1.5 Junction Temperature Tj -40 – 150 °C – P_4.1.6 Storage Temperature Tstg -55 – 150 °C – P_4.1.7 – 2 kV HBM2) P_4.1.8 kV 3) P_4.1.9 Pin IN (Relay Coil Current Input) Pin D (Delay) Voltage at pin D Temperatures ESD Susceptibility ESD Resistivity to CGND ESD Resistivity middle pins VESD,HBM -2 VESD,CDM -1 – 1 CDM 1) Not subject to production test, specified by design. 2) ESD susceptibility, Human Body Model “HBM” according to EIA/JESD 22-A114B 3) ESD susceptibility, Charged Device Model “CDM” according to EIA/JESD22-C101 or ESDA STM5.3.1 Note: Stresses above the ones listed here may cause permanent damage to the device. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Integrated protection functions are designed to prevent IC destruction under fault conditions described in the data sheet. Fault conditions are considered as “outside” normal operating range. Protection functions are not designed for continuous repetitive operation. Data Sheet 6 Rev.1.01, 2015-10-23 IFX52001 General Product Characteristics 4.2 Functional Range Table 2 Functional Range Parameter Symbol Values Min. Typ. Max. Unit Note or Test Condition Number Supply Voltage VS 3 – 30 V – P_4.2.1 Input Capacitance CS 70 – – nF typ. 100 nF/50 V recommended for compensating line influences P_4.2.2 Delay Capacitance CD 250 – – nF typ. 470 nF/6.3 V recommended P_4.2.3 Junction Temperature Tj -40 – 125 °C – P_4.2.4 Relay Coil Inductance LR – – 1000 mH – P_4.2.5 Relay Coil Series Resistance RL 60 – 120 Ω – P_4.2.6 420 – 750 Ω – P_4.2.7 Relay Freewheeling Resistor RF Note: Within the functional range the IC operates as described in the circuit description. The electrical characteristics are specified within the conditions given in the related electrical characteristics table. 4.3 Thermal Resistance1) Table 3 Thermal Resistance Parameter Symbol Values Min. Typ. Max. – 10 – Unit Note or Test Condition Number K/W – P_4.3.1 K/W 1) P_4.3.2 PG-DSO-8 (exposed pad): Junction to Case Bottom Junction to Ambient RthJC RthJA – 70 – 1) EIA/JESD 52_2, FR4, 80 × 80 × 1.5 mm; 35 µm Cu, 5 µm Sn; 300 mm 2 1) Not subject to production test, specified by design. Data Sheet 7 Rev.1.01, 2015-10-23 IFX52001 Operation Modes 5 Operation Modes 5.1 Description The IFX52001 provides two different operation modes: • Activation mode: For relay activation, the IC pass element works as an activated switch with lowest dropout voltage VDR (see Figure 3 a). • Hold mode: After the activation time period tActv has elapsed, the IC switches to hold mode regulating the relay coil current to constant values (see Figure 3 b). During commutation, the relay coil current flows from the IC input “IN” to “S” into the relay freewheeling resistor. A Zener structure protects the IC from overvoltage by limiting the input voltage transient to VZ. The relay activation time period tActv is generated by charging the external capacitor CD at pin D with a constant current. This time period starts once the IC supply voltage exceeds VS,Start. In case the IC supply voltage VS drops below the threshold VS,Hold-Actv, the IC changes to active mode allowing maximum relay current at low supply voltage. At low supply voltage, the IC switches to Low Voltage Mode with lowest current consumption. As in activation mode, the IC is working as a switch with lowest dropout voltage. In order to prevent excessive power dissipation at high supply voltage, the IC is working as a switch (High Voltage Mode). A transition to Hold Mode during this mode is not possible. An overtemperature protection circuit protects the IC from immediate destruction in fault condition by reducing output current. A thermal balance below 200 °C junction temperature will be established. Please note that a junction temperature above 150 °C is outside the maximum ratings and reduces IC lifetime. S Biasing Bandgap IN S Fwd Control IN Biasing Bandgap Fwd Control IIN,Hold VDR Driver D VZ VZ Driver D Delay CGND Delay CGND BlockDiagram_Modes.svg a) Activation Mode High Voltage Mode Low Voltage Mode Figure 3 Data Sheet b) Hold Mode Operation as Switch or as Current Source 8 Rev.1.01, 2015-10-23 IFX52001 Operation Modes VS VS,GoHVM,hi VS,GoHVM,lo VS,Start VS,GoLVM VS,min t tActv VD VD,hi t VZ VIN VDR t IIN IIN,Hold t VS too low - Hold Mode Low Voltage Mode Activation Activation Mode VS too low - Activation Low Mode Mode undefined Voltage Mode Low Voltage High Voltage Mode Mode undefined Figure 4 Data Sheet High Voltage Mode Hold Mode; VS too low Constant Current undefined Regulation Low Voltage Mode PrincipleOfOperation.svg Principle of Operation 9 Rev.1.01, 2015-10-23 IFX52001 Operation Modes High Voltage Mode VS,GoHVM,hi VS,GoHVM,lo Activation Mode VS,Start tAct VS,GoHVM,hi Hold Mode VS,GoLVM Low Voltage Mode Modes_BubbleDiagram.svg Figure 5 Data Sheet Conditions of Transitions between Modes, Definition of Parameters 10 Rev.1.01, 2015-10-23 IFX52001 Operation Modes 5.2 Electrical Characteristics Table 4 Electrical Characteristics, Tj = -40 °C to +125 °C, all voltages with respect to ground, positive current flowing into pin (unless otherwise specified) Parameter Symbol Values Min. Typ. Max. Unit Note or Test Condition Number General Freewheeling path drop voltage VIN-S – 1 2 V IIN-S = 400 mA P_5.2.1 Input Zener Voltage VZ 30 – 45 V IZ = 50 mA P_5.2.2 Overtemperature Shutdown Threshold 1) Tj,sd 151 – 200 °C Tj increasing due to power dissipation generated by the IC P_5.2.3 Activation Mode, VS ≥ VS,Start, unless otherwise specified Activation Mode Timing Start VS,Start Supply Voltage Threshold 7 8 9 V VS increasing P_5.2.4 Activation Time Period tActv 65 100 135 ms CD = 470 nF P_5.2.5 Dropout Voltage Activation Mode VDR,Actv – 0.9 1.3 V IIN = 200 mA VS = 9 V P_5.2.6 Current consumption Activation Mode IS,Actv – 0.85 1.5 mA IIN = 200 mA VS = 9 V P_5.2.7 Hold Mode, VS,GoHVM ≥ VS ≥ VS,GoLVM , unless otherwise specified Relay coil hold current IIN,Hold 40 50 60 mA – P_5.2.8 Current consumption Hold Mode IS,Hold – 0.85 1.5 mA VS = 9 V P_5.2.9 – 1 1.8 mA VS = 18 V Low Voltage Mode, VS,Start ≥ VS 3 V, unless otherwise specified Go to Low Voltage Mode Threshold VS,GoLVM Go to Low Voltage Mode Hysteresis VS,GoLVM,hy 0.7 Dropout voltage Low Voltage Mode VDR,LVM Dropout voltage Low Voltage Mode Current consumption Low Voltage Mode Data Sheet 6 7 8 V VS decreasing P_5.2.10 1 – V Calculated value: VS,GoLVM,hy = VS,Start - VS,GoLVM P_5.2.11 – 0.85 1.3 V IIN = 40 mA P_5.2.12 VDR,LVM – 0.85 1.0 V IIN = 40 mA; Tj = 25 °C P_5.2.13 IS,LVM – 0.65 1.1 mA VS = 3 V; IIN = IIN,Hold P_5.2.14 – 0.85 1.4 mA VS = 7 V; IIN = IIN,Hold 11 Rev.1.01, 2015-10-23 IFX52001 Operation Modes Table 4 Electrical Characteristics, Tj = -40 °C to +125 °C, all voltages with respect to ground, positive current flowing into pin (unless otherwise specified) Parameter Symbol Values Min. Typ. Unit Note or Test Condition Number Max. High Voltage Mode, VS ≥ VS,GoHVM,, unless otherwise specified Go to High Voltage Mode Upper Threshold VS,GoHVM,hi 19 – 21 V VS increasing P_5.2.15 Go to High Voltage Mode Lower Threshold VS,GoHVM,lo 18 – 20 V VS decreasing P_5.2.16 Go to High Voltage Mode Hysteresis VS,GoHVM,hy 0.7 1 – V Calculated value: VS,GoHVM,hy = VS,GoHVM,hi - VS,GoHVM,lo P_5.2.17 Dropout Voltage High Voltage Mode VDR,HVM – 1.1 1.6 V IIN = 400 mA; VS = 28 V P_5.2.18 Current Consumption High Voltage Mode IS,HVM – 1 1.8 mA IIN = 400 mA; VS = 28 V P_5.2.19 1) Specified by design, not subject to production test. Data Sheet 12 Rev.1.01, 2015-10-23 IFX52001 Package Outlines 6 Package Outlines 0.35 x 45˚ 1.27 0.41±0.09 2) 0.2 M 0.19 +0.06 0.08 C Seating Plane C A-B D 8x 0.64 ±0.25 D 0.2 6 ±0.2 8˚ MAX. C 0.1 C D 2x 1.7 MAX. Stand Off (1.45) 0.1+0 -0.1 3.9 ±0.11) M D 8x Bottom View 8 1 5 1 4 8 4 5 2.65 ±0.2 3 ±0.2 A B 4.9 ±0.11) 0.1 C A-B 2x Index Marking 1) Does not include plastic or metal protrusion of 0.15 max. per side 2) Dambar protrusion shall be maximum 0.1 mm total in excess of lead width 3) JEDEC reference MS-012 variation BA PG-DSO-8-27-PO V01 1.31 0.65 3 1.27 2.65 5.69 PG-DSO-8-27-FP V01 Figure 6 PG-DSO-8 (exposed pad) Outline and Recommended Footprint for Reflow Soldering Green Product To meet the world-wide customer requirements for environmentally friendly products and to be compliant with government regulations the device is available as a green product. Green products are RoHS-Compliant (i.e Pb-free finish on leads and suitable for Pb-free soldering according to IPC/JEDEC J-STD-020). For further information on alternative packages, please visit our website: http://www.infineon.com/packages. Data Sheet 13 Dimensions in mm Rev.1.01, 2015-10-23 IFX52001 Revision History 7 Revision History Revision Date Changes 1.01 2015-10-23 Data sheet updated to new style guide. Editorial changes. 1.0 2011-03-31 Initial Data Sheet Data Sheet 14 Rev.1.01, 2015-10-23 Trademarks of Infineon Technologies AG AURIX™, C166™, CanPAK™, CIPOS™, CIPURSE™, CoolGaN™, CoolMOS™, CoolSET™, CoolSiC™, CORECONTROL™, CROSSAVE™, DAVE™, DI-POL™, DrBLADE™, EasyPIM™, EconoBRIDGE™, EconoDUAL™, EconoPIM™, EconoPACK™, EiceDRIVER™, eupec™, FCOS™, HITFET™, HybridPACK™, I²RF™, ISOFACE™, IsoPACK™, i-Wafer™, LITIX™, MIPAQ™, ModSTACK™, my-d™, NovalithIC™, OmniTune™, OptiMOS™, OPTIGA™, ORIGA™, POWERCODE™, PRIMARION™, PrimePACK™, PrimeSTACK™, PRO-SIL™, PROFET™, RASIC™, ReverSave™, SatRIC™, SIEGET™, SINDRION™, SIPMOS™, SmartLEWIS™, SPOC™, SOLID FLASH™, TEMPFET™, thinQ!™, TRENCHSTOP™, TriCore™. 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Openwave™ of Openwave Systems Inc. RED HAT™ of Red Hat, Inc. RFMD™ of RF Micro Devices, Inc. SIRIUS™ of Sirius Satellite Radio Inc. SOLARIS™ of Sun Microsystems, Inc. SPANSION™ of Spansion LLC Ltd. Symbian™ of Symbian Software Limited. TAIYO YUDEN™ of Taiyo Yuden Co. TEAKLITE™ of CEVA, Inc. TEKTRONIX™ of Tektronix Inc. TOKO™ of TOKO KABUSHIKI KAISHA TA. UNIX™ of X/Open Company Limited. VERILOG™, PALLADIUM™ of Cadence Design Systems, Inc. VLYNQ™ of Texas Instruments Incorporated. VXWORKS™, WIND RIVER™ of WIND RIVER SYSTEMS, INC. ZETEX™ of Diodes Zetex Limited. Trademarks Update 2014-11-12 www.infineon.com Edition 2015-10-23 Published by Infineon Technologies AG 81726 Munich, Germany © 2015 Infineon Technologies AG. All Rights Reserved. Do you have a question about any aspect of this document? Email: [email protected] Legal Disclaimer The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of noninfringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices, please contact the nearest Infineon Technologies Office (www.infineon.com). Warnings Due to technical requirements, components may contain dangerous substances. For information on the types in question, please contact the nearest Infineon Technologies Office. The Infineon Technologies component described in this Data Sheet may be used in lifesupport devices or systems and/or automotive, aviation and aerospace applications or systems only with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support automotive, aviation and aerospace device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered.