Plastic Packages for Integrated Circuits Package Outline Drawing L30.4x6 30 LEAD DUAL FLAT NO-LEAD PLASTIC PACKAGE Rev 1, 3/15 (0.711) A 4.00 B (0.461) 6 PIN 1 INDEX AREA 1.678 30 0.10 6 PIN #1 INDEX AREA 1 26x 0.40 1.25 6.00 6.00 5.40 4.15 30x 0.20 (4X) 0.10 15 16 2.60 0.10 TOP VIEW 0.10 M C A B 30X 0.45 4.00 BOTTOM VIEW 0.70 SEE DETAIL "X" 0.90 0.035 0.203 0.10 C C BASE PLANE SEATING PLANE 0.08 C SIDE VIEW 0.711 0.461 PACKAGE OUTLINE (1.678) 0.65 (1.25) 0.60 0.20 (6.00) (4.15) 0.40 30x 0.20 5 0 . 00 MIN. 0 . 05 MAX. DETAIL "X" 1. Dimensions are in millimeters. Dimensions in ( ) for Reference Only. 2. Dimensioning and tolerancing conform to ASME Y14.5m-1994. 3. Unless otherwise specified, tolerance : Decimal ± 0.05 4. Dimension applies to the metallized terminal and is measured 5. Tiebar shown (if present) is a non-functional feature and may be located on any of the 4 sides (or ends). 6. The configuration of the pin #1 identifier is optional, but must be located within the zone indicated. The pin #1 identifier may be 7. JEDEC reference drawing: MO-229. between 0.15mm and 0.30mm from the terminal tip. 0.40 (5.40) 0 . 203 REF NOTES: (26x 0.40) 0.10 C 3.80 either a mold or mark feature. 0.10 2.60 0.25 TYPICAL RECOMMENDED LAND PATTERN 1 (30x 0.65)