Package Outline Drawing (POD)

Plastic Packages for Integrated Circuits
Package Outline Drawing
L31.5x7C
31 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE
0.10 M C A B
Rev 0, 3/12
0.10 M C A B
0.25
A
7.00
0.203
0.02
SIDE VIEW
0.50
0.55
1.442
1.31
1.00
(2X)
SEE DETAIL "X"
// 0.10 C
BASE PLANE C
SEATING PLANE
0.08 C
0.90±0.10
0.10 M C A B
0.83
0.50
B
0.50
0.83
0.25
5.00
6
PIN 1
INDEX AREA
1.418
0.50
0.50
0.05
0.25
C 0.2 REF
TOP VIEW
5
0.00 MIN
0.05 MAX
1.35 0.50 1.35
DETAIL "X"
0.25
6
PIN 1
INDEX AREA
0.25 (31X)
1
0.40
0.176
0.65
6
PIN 1
INDEX AREA
0.65
1
1
3.70
0.613
0.438
0.55
0.30
3.90
0.25
3.90
0.25
0.825
(2x)
0.30
0.40
0.55
0.79
0.25
0.30
0.30
0.25
0.281
0.329
0.329
5.00
BOTTOM VIEW
1
6
PIN 1
INDEX AREA
0.65
0.25
0.85
7.00
2.07
0.40
0.10 M C A B
0.75
3.976
3.70
2.336
Plastic Packages for Integrated Circuits
3.70
2.336
0.25 (31x)
2.07
1.315 0.834
3.70
1.005
3.90
1.356
1.449 0.85
6.80
0.60 (26X)
4.80
3.70
3.50
0.50 (17x)
1.356
1.025 (2X)
0.75
TYPICAL RECOMMENDED LAND PATTERN
NOTES:
1.
Dimensions are in millimeters.
Dimensions in ( ) for Reference Only.
2.
Dimensioning and tolerancing conform to ASME Y14.5m-1994.
3.
Unless otherwise specified, tolerance : Decimal ± 0.05
4.
Dimension applies to the metallized terminal and is measured
between 0.15mm and 0.25mm from the terminal tip.
5.
Tiebar shown (if present) is a non-functional feature.
6.
The configuration of the pin #1 identifier is optional, but must be
located within the zone indicated. The pin #1 identifier may be
either a mold or mark feature.
2