Plastic Packages for Integrated Circuits Thin Dual Flat No-Lead Plastic Package (TDFN) 2X L8.2.5x2 0.15 C A A D 8 LEAD THIN DUAL FLAT NO-LEAD PLASTIC PACKAGE 2X MILLIMETERS 0.15 C B SYMBOL E 6 MIN 0.75 0.80 - A1 - - 0.05 - D2 // 0.10 SIDE VIEW D2 (DATUM B) C 0.08 C A3 7 8 D2/2 1 6 INDEX AREA 0.20 0.25 0.30 5, 8 1.10 7, 8 2.00 BSC 0.90 E E2 A C SEATING PLANE 0.20 REF D B NOTES 0.70 b TOP VIEW MAX A A3 INDEX AREA NOMINAL 1.00 - 2.50 BSC 1.20 e 1.30 1.40 7, 8 0.50 BSC - k 0.20 - - - L 0.30 0.40 0.50 8 N 8 Nd 4 2 3 Rev. 1 10/15 2 NX k NOTES: 1. Dimensioning and tolerancing conform to ASME Y14.5-1994. 2. N is the number of terminals. (DATUM A) 3. Nd refers to the number of terminals on D. E2 4. All dimensions are in millimeters. Angles are in degrees. E2/2 5. Dimension b applies to the metallized terminal and is measured between 0.25mm and 0.30mm from the terminal tip. NX L N N-1 e 8 6. The configuration of the pin #1 identifier is optional, but must be located within the zone indicated. The pin #1 identifier may be either a mold or mark feature. NX b 5 0.10 (Nd-1)Xe REF. M C A B 8. Nominal dimensions are provided to assist with PCB Land Pattern Design efforts, see Intersil Technical Brief TB389. BOTTOM VIEW CL (A1) 9. Tiebar shown (if present) is a non-functional feature and may be located on any of the 4 sides (or ends). NX (b) L 5 SECTION "C-C" C C e TERMINAL TIP FOR EVEN TERMINAL/SIDE 1 7. Dimensions D2 and E2 are for the exposed pads which provide improved electrical and thermal performance.