Package Outline Drawing (POD)

Plastic Packages for Integrated Circuits
Package Outline Drawing
Q160.24x24
160 LEAD LOW PLASTIC QUAD FLATPACK PACKAGE (LQFP)
Rev 0, 10/12
MILLIMETERS
D
D1
D2
-D-
-B-
E
E1
E2
-A-
4X
e
b
aaa C A-B D
MIN
NOM
MAX
MIN
NOM
MAX
A
-
-
1.60
-
-
0.063
-
0.006
A1
0.05
-
0.15
0.002
A2
1.35
1.40
1.45
0.053 0.055 0.057
D
26.00 REF.
1.024 BSC.
D1
24.00 REF.
0.945 BSC.
E
26.00 REF.
1.024 BSC.
E1
24.00 REF.
0.945 BSC.
R2
0.08
-
0.20
0.003
-
R1
0.08
-
-
0.003
-
-
θ
0°
3.5°
7°
0°
3.5°
7°
ddd M CA-B s D s
TOP VIEW
1
0.008
θ1
0°
-
-
0°
-
-
θ2
11°
12°
13°
11°
12°
13°
θ3
11°
12°
13°
11°
12°
13°
c
0.09
-
0.20
0.004
-
0.008
L
0.45
0.60
0.75
0.018 0.024 0.030
bbb H A-B D
4X
INCH
SYMBOL
L1
1.00 REF
0.039 REF
S
0.20
-
-
b
0.17
0.20
0.27
0.008
-
-
0.007 0.008 0.011
e
0.50 BSC
0.020 BSC
D2
19.50
0.768
E2
19.50
0.768
TOLERANCES OF FORM AND POSITION
-C- SEATING PLANE
ccc C
- 0.05 S
A1
SIDE VIEW
0.20
0.008
bbb
0.20
0.008
ccc
0.08
0.003
ddd
0.08
0.003
NOTES:
A
A2
c
L1
aaa
1. Dimensions D1 and E1 do not include mold protrusion.
Allowable protrusion is 0.25mm per side. D1 and E1 are
maximum plastic body size dimensions including mold
mismatch.
2. Dimension b does not include dambar protrusion. Allowable
dambar protrusion shall not cause the lead width to exceed
the maximum b dimension by more than 0.08mm. Dambar
cannot be located on the lower radius or the foot. The
minimum space between protrusion and an adjacent lead is
0.07mm for 0.4mm and 0.5mm pitch packages.
2
R1
3. All Dimensions of 160L were based on those of 176L since
they are not mentioned in JEDEC SPEC MS-026.
R2
-HS
GAGE PLANE
0.25mm
L
3
DETAIL "X"
1