Package Outline Drawing (POD)

Plastic Packages for Integrated Circuits
Package Outline Drawing
Q216.24x24
216 LEAD LOW PLASTIC QUAD FLATPACK EXPOSED PAD PACKAGE (LQFP-EP)
Rev 0, 1/12
D
D1
D2
MILLIMETERS
A
-D-
A2
109
108
163
A1
- 0.05 S
162
-B-
E
E1
E2
-A-
216
55
54
bbb H A-B D
4X
e
b
aaa C A-B D
ddd M C A-B s D s
c
TOP VIEW
MIN
NOM
MAX
MIN
NOM
MAX
A
-
-
1.60
-
-
0.063
-
0.006
A1
0.05
-
0.15
0.002
A2
1.35
1.40
1.45
0.053 0.055 0.057
D
26.00 BSC.
1.024 BSC.
D1
24.00 BSC.
0.945 BSC.
E
26.00 BSC.
1.024 BSC.
E1
24.00 BSC.
0.945 BSC.
R2
0.08
-
0.20
0.003
-
R1
0.08
-
-
0.003
-
-
θ
0°
3.5°
7°
0°
3.5°
7°
SEE DETAIL "X"
0.008
θ1
0°
-
-
0°
-
-
θ2
11°
12°
13°
11°
12°
13°
θ3
11°
12°
13°
11°
12°
13°
c
0.09
-
0.20
0.004
-
0.008
L
0.45
0.60
0.75
0.018 0.024 0.030
L1
4X
1
MILLIMETERS
SYMBOL
L1
S
1.00 REF
0.20
-
0.039 REF
-
0.008
-
-
θ1
216L
MILLIMETERS
θ
SIDE VIEW
-C- SEATING PLANE
ccc C
θ2
MIN
NOM
MAX
b
0.13
0.16
0.23
S
L
MIN
NOM
MAX
0.005 0.006 0.009
e
0.40 BSC
0.016 BSC
D2
21.20
0.835
E2
21.20
0.835
R1
-H-
MILLIMETERS
SYMBOL
TOLERANCES OF FORM AND POSITION
R2
GAUGE
PLANE
0.25mm
θ3
aaa
0.20
0.008
bbb
0.20
0.008
ccc
0.08
0.003
ddd
0.07
0.003
NOTES:
1. Dimensions D1 and E1 do not include mold protrusion.
Allowable protrusion is 0.25mm per side. D1 and E1 are
maximum plastic body size dimensions including mold
mismatch.
DETAIL "X"
7.000
1
2. Dimension b does not include dambar protrusion. Allowable
dambar protrusion shall not cause the lead width to exceed
the maximum b dimension by more than 0.08mm. Dambar
cannot be located on the lower radius or the foot. Minimum
space between protrusion and an adjacent lead is 0.07mm
for 0.4mm and 0.5mm pitch packages.
54
55
7.000
216
3. All dimensions of 160L are based on those of 176L since they
are not mentioned in JEDEC spec MS-026.
4. Control dimensions are in millimeters.
108
163
162
109
EXPOSED PAD
BOTTOM VIEW
1