Package Outline Drawing (POD)

Plastic Packages for Integrated Circuits
Metric Plastic Quad Flatpack Packages (MQFP)
Q100.14x20 (JEDEC MS-022GC-1 ISSUE B)
D
100 LEAD METRIC PLASTIC QUAD FLATPACK PACKAGE
D1
-D-
INCHES
-A-
-B-
E E1
e
PIN 1
SEATING
A PLANE
-H-
0.076
0.003
-C-
12o-16o
0.40
0.016 MIN
0.20
M C A-B S
0.008
0o MIN
A2 A1
0o-7o
L
86
MIN
MAX
MIN
MAX
NOTES
A
-
0.134
-
3.40
-
A1
0.010
-
0.25
-
-
A2
0.101
0.113
2.57
2.87
-
b
0.009
0.015
0.22
0.38
6
b1
0.009
0.013
0.22
0.33
-
D
0.908
0.918
23.08
23.32
3
D1
0.782
0.792
19.88
20.12
4, 5
E
0.673
0.681
17.10
17.30
3
E1
0.547
0.555
13.90
14.10
4, 5
L
0.029
0.040
0.73
1.03
-
N
100
100
7
e
0.026 BSC
0.65 BSC
-
ND
30
30
-
NE
20
20
Rev. 1 4/99
NOTES:
1. Controlling dimension: MILLIMETER. Converted inch
dimensions are not necessarily exact.
b
2. All dimensions and tolerances per ANSI Y14.5M-1982.
b1
BASE METAL
WITH PLATING
SYMBOL
D S
3. Dimensions D and E to be determined at seating plane -C- .
4. Dimensions D1 and E1 to be determined at datum plane
-H- .
0.13/0.17
0.005/0.007
12o-16o
MILLIMETERS
5. Dimensions D1 and E1 do not include mold protrusion.
Allowable protrusion is 0.25mm (0.010 inch) per side.
0.13/0.23
0.005/0.009
6. Dimension b does not include dambar protrusion. Allowable
dambar protrusion shall be 0.08mm (0.003 inch) total.
7. ā€œNā€ is the number of terminal positions.