Plastic Packages for Integrated Circuits Package Outline Drawing L10.4x3A 10 LEAD OPTICAL DUAL FLAT NO-LEAD PLASTIC PACKAGE (ODFN) Rev 1, 4/15 A 4.00 6 PIN 1 INDEX AREA 6 PIN #1 INDEX AREA B 10 1 3.00 2.14±0.10 2X 2.00 8X 0.50 (4X) 0.10 10X 0.25 6 5 0.10 M C A B 4 TOP VIEW 2.40±0.10 BOTTOM VIEW 10X 0.40±0.05 SEE DETAIL "X" 0.10 C 0 . 2 REF C SEATING PLANE 0.70 MAX 0 . 00 MIN. 0 . 05 MAX. C SIDE VIEW 0.08 C DETAIL "X" (3.20) PACKAGE OUTLINE (10X 0.60) (10X 0.25) (2.14) (8X 0.50) NOTES: 1. Dimensions are in millimeters. Dimensions in ( ) for Reference Only. 2. Dimensioning and tolerancing conform to ASME Y14.5m-1994. 3. Unless otherwise specified, tolerance : Decimal ± 0.05 4. Dimension applies to the metallized terminal and is measured between 0.15mm and 0.30mm from the terminal tip. 5. Tiebar shown (if present) is a non-functional feature and may be located on any of the 4 sides (or ends). 6. The configuration of the pin #1 identifier is optional, but must be located within the zone indicated. The pin #1 identifier may be either a mold or mark feature. (2.40) (3.80) CENTER LINES TYPICAL RECOMMENDED LAND PATTERN 1