Package Outline Drawing (POD)

Plastic Packages for Integrated Circuits
Package Outline Drawing
L4.1.5x1.3
4 LD 1.5X1.3 OPTICAL DUAL FLAT NO-LEAD (ODFN)
Rev 6, 4/15
1.50
(0.55)
A
6
PIN #1
INDEX AREA
B
6
PIN 1
INDEX AREA
1
4
1.30
0.50
0.25 ±0.07 4
3
2
(4X)
0.10
0.10 M C A B
3X 0 . 40 ± 0 . 10
TOP VIEW
BOTTOM VIEW
SEE DETAIL "X"
(0.55)
0.10 C
(3x0.60)
0.70 ±0.05
(0.75)
C
BASE PLANE
SEATING PLANE
4
1
(0.50)
0.08 C
SIDE VIEW
2
3
(4 x 0.25)
(1.30)
C
TYPICAL RECOMMENDED LAND PATTERN
0 . 2 REF
5
0 . 00 MIN.
0 . 05 MAX.
DETAIL "X"
NOTES:
1
1.
Dimensions are in millimeters.
Dimensions in ( ) for Reference Only.
2.
Dimensioning and tolerancing conform to AMSE Y14.5m-1994.
3.
Unless otherwise specified, tolerance : Decimal ± 0.05
4.
Dimension applies to the metallized terminal and is measured
between 0.18mm and 0.32mm from the terminal tip.
5.
Tiebar shown (if present) is a non-functional feature and may
be located on any of the 4 sides (or ends).
6.
The configuration of the pin #1 identifier is optional, but must be
located within the zone indicated. The pin #1 identifier may be
either a mold or mark feature.
7.
This package not defined by JEDEC, but MO-229 can be used as
a general reference.