Plastic Packages for Integrated Circuits Dual-In-Line Plastic Packages (PDIP) E40.6 (JEDEC MS-011-AC ISSUE B) N 40 LEAD DUAL-IN-LINE PLASTIC PACKAGE E1 INDEX AREA 1 2 3 INCHES N/2 SYMBOL -B- -C- A2 SEATING PLANE e B1 D1 A1 eC B 0.010 (0.25) M C A B S NOTES - 0.250 - 6.35 4 - 0.39 - 4 A2 0.125 0.195 3.18 4.95 - B 0.014 0.022 0.356 0.558 - C L B1 0.030 0.070 0.77 1.77 8 eA C 0.008 0.015 0.204 0.381 - D 1.980 2.095 D1 0.005 - C eB NOTES: 1. Controlling Dimensions: INCH. In case of conflict between English and Metric dimensions, the inch dimensions control. 2. Dimensioning and tolerancing per ANSI Y14.5M-1982. 3. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of Publication No. 95. 4. Dimensions A, A1 and L are measured with the package seated in JEDEC seating plane gauge GS-3. 5. D, D1, and E1 dimensions do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.010 inch (0.25mm). 6. E and eA are measured with the leads constrained to be perpendicular to datum -C- . 7. eB and eC are measured at the lead tips with the leads unconstrained. eC must be zero or greater. 8. B1 maximum dimensions do not include dambar protrusions. Dambar protrusions shall not exceed 0.010 inch (0.25mm). 9. N is the maximum number of terminal positions. 10. Corner leads (1, N, N/2 and N/2 + 1) for E8.3, E16.3, E18.3, E28.3, E42.6 will have a B1 dimension of 0.030 - 0.045 inch (0.76 - 1.14mm). 14 MAX 0.015 A L D1 MIN A E BASE PLANE MAX A1 -AD MILLIMETERS MIN 50.3 53.2 5 - 5 0.13 E 0.600 0.625 15.24 15.87 6 E1 0.485 0.580 12.32 14.73 5 e 0.100 BSC 2.54 BSC - eA 0.600 BSC 15.24 BSC 6 eB - 0.700 - 17.78 7 L 0.115 0.200 2.93 5.08 4 N 40 40 9 Rev. 0 12/93