e18.3: 18 Lead Dual-In-Line Plastic Package

Plastic Packages for Integrated Circuits
Package Outline Drawing
E18.3
18 LEAD DUAL-IN-LINE PLASTIC PACKAGE
Rev. 3, 11/11
18
0.280 (7.11)
0.240 (6.10)
INDEX
1
AREA
2
5
3
0.325 (8.25)
0.300 (7.62)
TOP VIEW
6
CL
0.920 (34.65)
0.880 (33.27)
6
5
0.300 (7.62) BSC
0.014 (0.355)
0.008 (0.204)
0.195 (4.95)
0.115 (2.93)
-C-
0.210 (5.33) MAX 4
SEATING
0.150 (3.81)
4
0.115 (2.93)
PLANE
5
2X 0.005 (0.13) MIN
8
0.430 (10.92) MAX
7
0.015 (0.39) MIN 4
0.070 (1.77)
0.045 (1.15)
0.022 (0.558)
0.014 (0.356)
0.100 (2.54) BSC
SIDE VIEW
NOTES:
1. Controlling Dimensions: INCH (Metric dimensions in parentheses).
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of
Publication No. 95.
4. Dimensions are measured with the package seated in JEDEC seating
plane gauge GS-3.
5. Dimensions do not include mold flash or protrusions. Mold flash or
protrusions shall not exceed 0.010 inch (0.25mm).
6. Dimensions are measured with the leads constrained to be perpendicular
to datum -C- .
7. Dimension measured at the lead tips with the leads unconstrained.
8. Maximum dimensions do not include dambar protrusions. Dambar
protrusions shall not exceed 0.010 inch (0.25mm).
9. Package outline compliant to JEDEC MS-001-AC ISSUE D.
1