SP721 100 2.5 TA = 25oC SINGLE PULSE 2 FORWARD SCR CURRENT (A) FORWARD SCR CURRENT (mA) 80 TA = 25oC SINGLE PULSE 60 40 20 1.5 1 IFWD EQUIV. SAT. ON THRESHOLD ~ 1.1V 0.5 0 VFWD 0 600 800 1000 1200 0 FORWARD SCR VOLTAGE DROP (mV) FIGURE 2. LOW CURRENT SCR FORWARD VOLTAGE DROP CURVE 1 2 FORWARD SCR VOLTAGE DROP (V) FIGURE 3. HIGH CURRENT SCR FORWARD VOLTAGE DROP CURVE +VCC +VCC INPUT DRIVERS OR SIGNAL SOURCES LINEAR OR DIGITAL IC INTERFACE IN 1 - 3 IN 5 - 7 TO +VCC V+ SP721 V- SP721 INPUT PROTECTION CIRCUIT (1 OF 6 SHOWN) FIGURE 4. TYPICAL APPLICATION OF THE SP721 AS AN INPUT CLAMP FOR OVER-VOLTAGE, GREATER THAN 1V BE ABOVE V+ OR LESS THAN -1VBE BELOW V- 6-11 3 SP721 Peak Transient Current Capability of the SP721 The peak transient current capability rises sharply as the width of the current pulse narrows. Destructive testing was done to fully evaluate the SP721’s ability to withstand a wide range of peak current pulses vs time. The circuit used to generate current pulses is shown in Figure 5. + VX - VARIABLE TIME DURATION CURRENT PULSE GENERATOR R1 CURRENT SENSE (-) (+) The test circuit of Figure 5 is shown with a positive pulse input. For a negative pulse input, the (-) current pulse input goes to an SP721 ‘IN’ input pin and the (+) current pulse input goes to the SP721 V- pin. The V+ to V- supply of the SP721 must be allowed to float. (i.e., It is not tied to the ground reference of the current pulse generator.) Figure 6 shows the point of overstress as defined by increased leakage in excess of the data sheet published limits. 1 IN 2 IN V+ 8 IN 7 3 IN IN 6 4 IN 5 SP721 + C1 - VOLTAGE PROBE V- R1 ~ 10Ω TYPICAL VX ADJ. 10V/A TYPICAL C1 ~ 100µF The maximum peak input current capability is dependent on the ambient temperature, improving as the temperature is reduced. Peak current curves are shown for ambient temperatures of 25oC and 105oC and a 15V power supply condition. The safe operating range of the transient peak current should be limited to no more than 75% of the measured overstress level for any given pulse width as shown in the curves of Figure 6. FIGURE 5. TYPICAL SP721 PEAK CURRENT TEST CIRCUIT WITH A VARIABLE PULSE WIDTH INPUT Note that adjacent input pins of the SP721 may be paralleled to improve current (and ESD) capability. The sustained peak current capability is increased to nearly twice that of a single pin. 7 CAUTION: SAFE OPERATING CONDITIONS LIMIT THE MAXIMUM PEAK CURRENT FOR A GIVEN PULSE WIDTH TO BE NO GREATER THAN 75% OF THE VALUES SHOWN ON EACH CURVE. PEAK CURRENT (A) 6 TA = 25oC 5 V+ TO V- SUPPLY = 15V 4 TA = 105oC 3 2 1 0 0.001 0.01 0.1 1 10 100 1000 PULSE WIDTH TIME (ms) FIGURE 6. SP721 TYPICAL SINGLE PULSE PEAK CURRENT CURVES SHOWING THE MEASURED POINT OF OVERSTRESS IN AMPERES vs PULSE WIDTH TIME IN MILLISECONDS 6-12 SP721 Dual-In-Line Plastic Packages (PDIP) E8.3 (JEDEC MS-001-BA ISSUE D) N 8 LEAD DUAL-IN-LINE PLASTIC PACKAGE E1 INDEX AREA 1 2 3 INCHES N/2 MIN MAX MIN MAX NOTES A - 0.210 - 5.33 4 A1 0.015 - 0.39 - 4 A2 0.115 0.195 2.93 4.95 - B 0.014 0.022 0.356 0.558 - C L B1 0.045 0.070 1.15 1.77 8, 10 eA C 0.008 0.014 0.204 0.355 C D 0.355 0.400 9.01 D1 0.005 - 0.13 - 5 E 0.300 0.325 7.62 8.25 6 E1 0.240 0.280 6.10 7.11 5 -B-AE D BASE PLANE -C- A2 SEATING PLANE A L D1 e B1 D1 B 0.010 (0.25) M A1 eC C A B S eB NOTES: 1. Controlling Dimensions: INCH. In case of conflict between English and Metric dimensions, the inch dimensions control. 2. Dimensioning and tolerancing per ANSI Y14.5M-1982. 3. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of Publication No. 95. 4. Dimensions A, A1 and L are measured with the package seated in JEDEC seating plane gauge GS-3. 5. D, D1, and E1 dimensions do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.010 inch (0.25mm). 6. E and eA are measured with the leads constrained to be perpendicular to datum -C- . 7. eB and eC are measured at the lead tips with the leads unconstrained. eC must be zero or greater. 8. B1 maximum dimensions do not include dambar protrusions. Dambar protrusions shall not exceed 0.010 inch (0.25mm). 9. N is the maximum number of terminal positions. 10. Corner leads (1, N, N/2 and N/2 + 1) for E8.3, E16.3, E18.3, E28.3, E42.6 will have a B1 dimension of 0.030 - 0.045 inch (0.76 - 1.14mm). 6-13 MILLIMETERS SYMBOL 10.16 5 e 0.100 BSC 2.54 BSC - eA 0.300 BSC 7.62 BSC 6 eB - L 0.115 N 8 0.430 - 0.150 2.93 8 10.92 7 3.81 4 9 Rev. 0 12/93 SP721 Small Outline Plastic Packages (SOIC) M8.15 (JEDEC MS-012-AA ISSUE C) N INDEX AREA 0.25(0.010) M H 8 LEAD NARROW BODY SMALL OUTLINE PLASTIC PACKAGE B M E INCHES -B- 1 2 SYMBOL 3 L SEATING PLANE -A- h x 45o A D -C- e µα A1 B 0.25(0.010) M 0.10(0.004) C A M B S NOTES: 1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of Publication Number 95. 2. Dimensioning and tolerancing per ANSI Y14.5M-1982. 3. Dimension “D” does not include mold flash, protrusions or gate burrs. Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006 inch) per side. 4. Dimension “E” does not include interlead flash or protrusions. Interlead flash and protrusions shall not exceed 0.25mm (0.010 inch) per side. 5. The chamfer on the body is optional. If it is not present, a visual index feature must be located within the crosshatched area. 6. “L” is the length of terminal for soldering to a substrate. 7. “N” is the number of terminal positions. 8. Terminal numbers are shown for reference only. 9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater above the seating plane, shall not exceed a maximum value of 0.61mm (0.024 inch). 10. Controlling dimension: MILLIMETER. Converted inch dimensions are not necessarily exact. 6-14 MAX MILLIMETERS MIN MAX NOTES A 0.0532 0.0688 1.35 1.75 - A1 0.0040 0.0098 0.10 0.25 - B 0.013 0.020 0.33 0.51 9 C 0.0075 0.0098 0.19 0.25 - D 0.1890 0.1968 4.80 5.00 3 E 0.1497 0.1574 3.80 4.00 4 e C MIN 0.050 BSC 1.27 BSC - H 0.2284 0.2440 5.80 6.20 - h 0.0099 0.0196 0.25 0.50 5 L 0.016 0.050 0.40 1.27 6 N α 8 0o 8 8o 0o 7 8o Rev. 0 12/93