MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS TSSOP28 9.7x4.4 EP CASE 948BG ISSUE O DATE 08 FEB 2012 SCALE 1:1 NOTE 6 B 28 PIN ONE LOCATION E 1 2X 14 TIPS TOP VIEW 0.05 C A2 NOTE 4 DETAIL A B 0.10 C 28X b 0.10 C B A C SEATING PLANE NOTE 3 SIDE VIEW M c A 28X NOTE 8 0.20 C B A NOTE 6 D SECTION B−B c 14 A e ÉÉÉ ÇÇÇ ÇÇÇ ÉÉÉ b1 c1 ÇÇÇÇ ÇÇÇÇ E1 NOTE 5 b 15 B END VIEW NOTES: 1. DIMENSIONS AND TOLERANCING PER ASME Y14.5M, 1994. 2. DIMENSIONS IN MILLIMETERS. 3. DIMENSION b DOES NOT INCLUDE DAMBAR PROTRUSION. DAMBAR PROTRUSION SHALL BE 0.07 MAX AT MAXIMUM MATERIAL CONDITION. DAMBAR CANNOT BE LOCATED ON THE LOWER RADIUS OF THE FOOT. MINIMUM SPACE BETWEEN PROTRUSION AND ADJACENT LEAD IS 0.07. 4. DIMENSION D DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.15 PER SIDE. DIMENSION D IS DETERMINED AT DATUM PLANE H. 5. DIMENSION E1 DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS. INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.25 PER SIDE. DIMENSION E1 IS DETERMINED AT DATUM PLANE H. 6. DATUMS A AND B TO BE DETERMINED AT DATUM PLANE H. 7. A1 IS DEFINED AS THE VERTICAL DISTANCE FROM THE SEATING PLANE TO THE LOWEST POINT ON THE PACKAGE BODY. 8. SECTION B−B TO BE DETERMINED AT 0.10 TO 0.25 FROM THE LEAD TIP. DIM A A1 A2 b b1 c c1 D D2 E E1 E2 e L L2 M D2 H L2 E2 A1 NOTE 7 L C GAUGE PLANE DETAIL A BOTTOM VIEW RECOMMENDED SOLDERING FOOTPRINT* 28X 6.47 MILLIMETERS MIN MAX −−− 1.20 0.00 0.15 0.80 1.05 0.19 0.30 0.19 0.25 0.09 0.20 0.09 0.16 9.60 9.80 5.21 6.17 6.40 BSC 4.30 4.50 1.44 2.40 0.65 BSC 0.45 0.75 0.25 BSC 0_ 8_ GENERIC MARKING DIAGRAM* 1.15 XXXXX XXXXG ALYW 2.70 6.70 1 0.65 PITCH 28X 0.30 DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. DOCUMENT NUMBER: 98AON67255E A L Y W G = Assembly Location = Wafer Lot = Year = Work Week = Pb−Free Package *This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “ G”, may or may not be present. Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed STATUS: ON SEMICONDUCTOR STANDARD versions are uncontrolled except when stamped “CONTROLLED COPY” in red. NEW STANDARD: © Semiconductor Components Industries, LLC, 2002 Case Outline Number: http://onsemi.com October, DESCRIPTION: 2002 − Rev. 0 PAGE 1 OFXXX 2 TSSOP28 EP, 9.7X4.4MM, 0.65P 1 DOCUMENT NUMBER: 98AON67255E PAGE 2 OF 2 ISSUE O REVISION RELEASED FOR PRODUCTION. REQ. J. LIU. DATE 08 FEB 2012 ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. © Semiconductor Components Industries, LLC, 2012 February, 2012 − Rev. O Case Outline Number: 948BG