MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS TSSOP28 CASE 948AA ISSUE A DATE 26 OCT 2011 SCALE 1:1 e 28 PIN ONE LOCATION 2X 0.20 C B A ÇÇÇÇ ÇÇÇÇ ÇÇÇÇ 15 DETAIL A E1 E 1 14 A 0.05 DIM A A1 A2 b b1 c c1 D E E1 e L L1 R R1 S 01 02 03 A A2 A D 0.10 C NOTES: 1. DIMENSIONS AND TOLERANCING PER ASME Y14.5M, 1994. 2. DIMENSIONS IN MILLIMETERS. 3. DIMENSION b DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 MM TOTAL IN EXCESS OF THE “b” DIMENSION AT MAXIMUM MATERIAL CONDITION. 4. DATUMS A AND B TO BE DETERMINED AT DATUM PLANE H. B A SEATING PLANE C 28X A1 b 02 0.10 C B A S H ÉÉÉ ÇÇÇ ÇÇÇ ÉÉÉ ÇÇÇ ÉÉÉ R1 (b) c R GAUGE PLANE c1 L (L1) 0.25 b1 03 SECTION A−A GENERIC MARKING DIAGRAM* 01 XXXXX XXXXG ALYW DETAIL A RECOMMENDED SOLDERING FOOTPRINT 28X MILLIMETERS MIN MAX −−− 1.20 0.05 0.15 0.80 1.05 0.19 0.30 0.19 0.25 0.09 0.20 0.09 0.16 9.60 9.80 6.40 BSC 4.30 4.50 0.65 BSC 0.45 0.75 1.00 REF 0.09 −−− 0.09 −−− 0.20 −−− 0_ 8_ 12 _REF 12 _REF 0.42 XXXXX A L Y W G 28X 1.15 6.70 0.65 PITCH DOCUMENT NUMBER: STATUS: NEW STANDARD: ON SEMICONDUCTOR STANDARD Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. http://onsemi.com 28 LEAD TSSOP, 9.7X4.4X1.0 MM, 0.65 PITCH 1 © Semiconductor Components Industries, LLC, 2002 October, DESCRIPTION: 2002 − Rev. 0 *This information is generic. Please refer to device data sheet for actual part marking. DIMENSIONS: MILLIMETERS 98AON13023D = Specific Device Code = Assembly Location = Wafer Lot = Year = Work Week = Pb−Free Package Case Outline Number: PAGE 1 OFXXX 2 DOCUMENT NUMBER: 98AON13023D PAGE 2 OF 2 ISSUE REVISION DATE O RELEASED FOR PRODUCTION. REQ. BY S. MOHAMMED 03 JUL 2003 A ADDED SOLDER FOOTPRINT. REQ. BY S. RIGGS. 26 OCT 2011 ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. © Semiconductor Components Industries, LLC, 2011 October, 2011 − Rev. A Case Outline Number: 948AA