Package Outline Drawing (POD)

Plastic Packages for Integrated Circuits
Package Outline Drawing
L32.5x5L
32 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE
Rev 0, 10/14
3.50
5.00
6
PIN 1
INDEX AREA
28x 0.50
A
B
25
6
32
1
24
PIN 1
INDEX AREA
3.50
5.00
(4x)
3.70
+0.05 4
32x 0.25
-0.07
0.10 M C A B
0.10
8
17
16
9
BOTTOM VIEW
TOP VIEW
32x 0.40
(4.80)
(3.50)
SEE DETAIL "X"
(28x 0.50)
0.10 C
MAX 0.90
(4.80)
SEATING PLANE
0.05 C
(3.50)
( 3.70)
SIDEVIEW
C
(32x 0.25)
0.2 REF
5
0.00 MIN.
0.05 MAX.
(32x 0.60)
DETAIL "X"
TYPICAL RECOMMENDED LAND PATTERN
NOTES:
1.
Dimensions are in millimeters.
Dimensions in ( ) for Reference Only.
2.
Dimensioning and tolerancing conform to ASME Y14.5m-1994.
3.
Unless otherwise specified, tolerance : Decimal ± 0.05
4.
Dimension applies to the metallized terminal and is measured
between 0.15mm and 0.30mm from the terminal tip.
5.
Tiebar shown (if present) is a non-functional feature.
6.
The configuration of the pin #1 identifier is optional, but must be
located within the zone indicated. The pin #1 identifier may be
either a mold or mark feature.
1
C