Package Outline Drawing (POD)

Plastic Packages for Integrated Circuits
Package Outline Drawing
L32.5x5E
32 LEAD THIN QUAD FLAT NO-LEAD PLASTIC PACKAGE
Rev 1, 05/10
3.50
5.00
28X 0.50
A
B
6
6
PIN 1
INDEX AREA
1
24
3.50
5.00
3.70
17
(4X)
PIN #1 INDEX AREA
32
25
0.15
8
32X 0.25 4
0.10 M C A B
9
16
3.70
32X 0.40
SIDE VIEW
TOP VIEW
BOTTOM VIEW
SEE DETAIL "X"
( 4.80 )
( 3.50)
0.10 C
Max 0.80
( 28X 0.50)
C
SEATING PLANE
0.08 C
SIDE VIEW
( 4.80 )
(3.70
)
( 3.50)
(32X 0.25)
C
0 . 2 REF
5
0 . 00 MIN.
0 . 05 MAX.
( 32 X 0.60)
DETAIL "X"
TYPICAL RECOMMENDED LAND PATTERN
NOTES:
1. Dimensions are in millimeters.
Dimensions in ( ) for Reference Only.
2. Dimensioning and tolerancing conform to AMSE Y14.5m-1994.
3. Unless otherwise specified, tolerance : Decimal ± 0.05
4. Dimension b applies to the metallized terminal and is measured
between 0.15mm and 0.30mm from the terminal tip.
5. Tiebar shown (if present) is a non-functional feature.
6. The configuration of the pin #1 identifier is optional, but must be
located within the zone indicated. The pin #1 identifier may be
either a mold or mark feature.
1