Package Outline Drawing (POD)

Plastic Packages for Integrated Circuits
Package Outline Drawing
L32.4x4
32 LEAD THIN QUAD FLAT NO-LEAD PLASTIC PACKAGE
Rev 0, 2/10
6
PIN 1
INDEX AREA
4.00
A
2.80
28X 0.40
B
6
PIN #1 INDEX AREA
32
1
2.70
4.00
24
17
(4X)
8
0.15
16
32X 0.40
TOP VIEW
b
32X 0.20
0.10 M C A B
BOTTOM VIEW
SEE DETAIL "X"
(2.70)
0.05
(3.80)
// 0.10 C
C
BASE PLANE
SEATING PLANE
0.08 C
0.75
(3.80)
(2.80)
SIDE VIEW
(28X 0.40)
C
(32X 0.20)
5
0.2 REF
0.00 MIN
0.05 MAX
(32X 0.60)
TYPICAL RECOMMENDED LAND PATTERN
DETAIL "X"
NOTES:
1.
Dimensions are in millimeters.
Dimensions in ( ) for Reference Only.
2.
Dimensioning and tolerancing conform to ASME Y14.5m-1994.
3.
Unless otherwise specified, tolerance : Decimal ± 0.05
4.
Dimension b applies to the metallized terminal and is measured
between 0.15mm and 0.25mm from the terminal tip.
5.
Tiebar shown (if present) is a non-functional feature.
6.
The configuration of the pin #1 identifier is optional, but must be
located within the zone indicated. The pin #1 indentifier may be
either a mold or mark feature.
1