Package Outline Drawing (POD)

Plastic Packages for Integrated Circuits
Package Outline Drawing
L68.10x10B
68 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE
Rev 0, 11/08
PIN 1
INDEX AREA
6
10.00
A
4X 8.00
B
52
PIN 1
INDEX AREA
6
68
51
1
35
17
64X 0.50
Exp. DAP
7.70 Sq.
10.00
0.15 (4X)
34
18
68X 0.55
68X 0.25
4
TOP VIEW
0.10 M C A B
BOTTOM VIEW
SEE DETAIL "X"
0.90 Max
8.00 Sq
C
0.10 C
0.08 C
SEATING PLANE
64X 0.50
SIDE VIEW
68X 0.25
9.65 Sq
C
7.70 Sq
0 . 2 REF
5
0 . 00 MIN.
0 . 05 MAX.
68X 0.75
DETAIL "X"
TYPICAL RECOMMENDED LAND PATTERN
NOTES:
1.
Dimensions are in millimeters.
Dimensions in ( ) for Reference Only.
2. Dimensioning and tolerancing conform to AMSEY14.5m-1994.
3. Unless otherwise specified, tolerance : Decimal ± 0.05
4. Dimension b applies to the metallized terminal and is measured
between 0.15mm and 0.30mm from the terminal tip.
5. Tiebar shown (if present) is a non-functional feature.
6. The configuration of the pin #1 identifier is optional, but must be
located within the zone indicated. The pin #1 identifier may be
either a mold or mark feature.
1