Package Outline Drawing (POD)

Plastic Packages for Integrated Circuits
Package Outline Drawing
L36.6x6
36 LEAD THIN QUAD FLAT NO-LEAD PLASTIC PACKAGE
Rev 5, 08/08
6.00
6
PIN #1 INDEX AREA
32x 0.50
A
B
36
28
6
27
6.00
PIN 1
INDEX AREA
1
4.15 +0.10/-0.15
4X 4.00
9
19
(4X)
0.15
10
18
36X 0.55 ± 0.10
36X 0.25 +0.05/-.07 4
0.10 M C A B
BOTTOM VIEW
TOP VIEW
( 5.65 )
( 4.15)
Exp. Dap.
SEE DETAIL "X"
( 5.65 )
0.10 C
Max 0.80
C
( 32x 0.50)
0.08 C
( 4.15)
Exp. Dap.
SIDE VIEW
(36X .25)
C
0 . 2 REF
5
0 . 00 MIN.
0 . 05 MAX.
( 4X 4.00)
(36X 0.75)
TYPICAL RECOMMENDED LAND PATTERN
DETAIL "X"
1. Dimensions are in millimeters.
2. Dimensioning and tolerancing conform to AMSEY14.5m-1994.
3. Unless otherwise specified, tolerance : Decimal ± 0.05
4. Dimension applies to the metallized terminal and is measured
between 0.15mm and 0.30mm from the terminal tip.
5. Tiebar shown (if present) is a non-functional feature.
6. The configuration of the pin #1 identifier is optional, but must be
located within the zone indicated. The pin #1 indentifier may be
either a mold or mark feature.
1