Package Outline Drawing (POD)

Plastic Packages for Integrated Circuits
Package Outline Drawing
M20.15
20 LEAD QUARTER SIZE OUTLINE PLASTIC PACKAGE (QSOP)
Rev 2, 1/11
20
INDEX
AREA
1
2
0.244 (6.19)
0.157 (3.98) 0.228 (5.80)
0.150 (3.81)
4
3
GAUGE
PLANE
TOP VIEW
6
0.050 (1.27)
0.25
0.010
SEATING PLANE
3
0.069 (1.75)
0.053 (1.35)
0.344 (8.74)
0.337 (8.56)
0.016 (0.41)
0.0196 (0.49)
5
0.0099 (0.26)
8°
0°
0.012 (0.30)
0.008 (0.20)
0.025
(0.635 BSC)
8
0.010 (0.25)
0.004 (0.10)
0.061 MAX (1.54 MIL)
SIDE VIEW
0.010 (0.25)
0.007 (0.18)
DETAIL "X"
NOTES:
0.015 (0.38) x 20
0.025 (0.64) x 18
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of
Publication Number 95.
2. Dimensioning and tolerancing conform to AMSE Y14.5m-1994.
20
0.060 (1.52) x 20
3. Dimension does not include mold flash, protrusions or gate burrs.
Mold flash, protrusion and gate burrs shall not exceed 0.15mm
(0.006 inch) per side.
4. Dimension does not include interlead flash or protrusions. Interlead
flash and protrusions shall not exceed 0.25mm (0.010 inch) per
side.
0.220(5.59)
5. The chamfer on the body is optional. If it is not present, a visual index
feature must be located within the crosshatched area.
6. Length of terminal for soldering to a substrate.
7. Terminal numbers are shown for reference only.
1
2
3
TYPICAL RECOMMENDED LAND PATTERN
8. Dimension does not include dambar protrusion. Allowable
dambar protrusion shall be 0.10mm (0.004 inch) total in excess of
dimension at maximum material condition.
9. Controlling dimension: INCHES. Converted millimeter dimensions
are not necessarily exact.
1