Package Outline Drawing (POD)

Plastic Packages for Integrated Circuits
Package Outline Drawing
L32.4x6A
32 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE
Rev 0, 06/08
0.40
2.75 4
4.00
2.50
A
B
27
PIN #1 INDEX AREA
Chamfer 0.400x45×
32
PIN 1
INDEX AREA
26
1
6.00
(2X 1.75) 4
5.20
4.50
10
17
0.40
0.10
11
16
2X
SIDE VIEW
TOP VIEW
0.50
0.10 M C A B
18X 0.25
4.40
2.50
2.75
3.20 REF
2.50
4
BOTTOM VIEW
(11X 0.50)
(3X 0.30)
(3X 0.60)
SEE DETAIL "X"
MAX. 1.00
0.10 C
C
SEATING PLANE
0.08 C
(14X 0.25)
(2X 1.75)
SIDE VIEW
(18X 0.25)
(4.50)
(2X 0.50)
(6.40)
0.2 REF
C
5
(15X 0.50)
0 . 00 MIN.
0 . 05 MAX.
DETAIL "X"
18X 0.60
Package Boundary
(2X 2.50)
TYPICAL RECOMMENDED LAND PATTERN
NOTES:
1. Dimensions are in millimeters.
Dimensions in ( ) for Reference Only.
2. Dimensioning and tolerancing conform to AMSE Y14.5m-1994.
3. Unless otherwise specified, tolerance : Decimal ± 0.05
Angular ±2°
4. Dimension b applies to the metallized terminal and is measured
between 0.15mm and 0.30mm from the terminal tip.
5. Tiebar shown (if present) is a non-functional feature.
6. The configuration of the pin #1 identifier is optional, but must be
located within the zone indicated. The pin #1 indentifier may be
either a mold or mark feature.
1