Plastic Packages for Integrated Circuits Package Outline Drawing L32.4x6A 32 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE Rev 0, 06/08 0.40 2.75 4 4.00 2.50 A B 27 PIN #1 INDEX AREA Chamfer 0.400x45× 32 PIN 1 INDEX AREA 26 1 6.00 (2X 1.75) 4 5.20 4.50 10 17 0.40 0.10 11 16 2X SIDE VIEW TOP VIEW 0.50 0.10 M C A B 18X 0.25 4.40 2.50 2.75 3.20 REF 2.50 4 BOTTOM VIEW (11X 0.50) (3X 0.30) (3X 0.60) SEE DETAIL "X" MAX. 1.00 0.10 C C SEATING PLANE 0.08 C (14X 0.25) (2X 1.75) SIDE VIEW (18X 0.25) (4.50) (2X 0.50) (6.40) 0.2 REF C 5 (15X 0.50) 0 . 00 MIN. 0 . 05 MAX. DETAIL "X" 18X 0.60 Package Boundary (2X 2.50) TYPICAL RECOMMENDED LAND PATTERN NOTES: 1. Dimensions are in millimeters. Dimensions in ( ) for Reference Only. 2. Dimensioning and tolerancing conform to AMSE Y14.5m-1994. 3. Unless otherwise specified, tolerance : Decimal ± 0.05 Angular ±2° 4. Dimension b applies to the metallized terminal and is measured between 0.15mm and 0.30mm from the terminal tip. 5. Tiebar shown (if present) is a non-functional feature. 6. The configuration of the pin #1 identifier is optional, but must be located within the zone indicated. The pin #1 indentifier may be either a mold or mark feature. 1