Package Outline Drawing (POD)

Plastic Packages for Integrated Circuits
Package Outline Drawing
L32.6x4B
32 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE
Rev 0, 09/08
2X 4.70
14X 0.25
4
0.10 M C A B
6.00
PIN 1
INDEX AREA
A
11X 0.50
2X 1.12
PIN #1 IDENTIFICATION
CHAMFER 0.300 X45×
B
1
10
32
11
4.00
2X 2.50
1.80
2.64
16
27
0.10
17
26
2X
TOP VIEW
18X 0.25
18X 0.35
11X 0.25
3X 0.75
4
0.10 M C A B
14X 0.50
BOTTOM VIEW
6.40
(11X 0.50)
SEE DETAIL "X"
MAX. 1.00
(14X 0.25)
0.10 C
Package Boundary
C
SEATING PLANE
0.08 C
(18X 0.25)
SIDE VIEW
(4.40)
(2.5)
(2.64)
(1.80)
(2.50)
16
(14X 0.50)
3X 0.95
5
C
18X 0.55
(11X 0.45)
0 . 2 REF
(2X 1.12)
(2X 4.7)
0-0.05
DETAIL "X"
TYPICAL RECOMMENDED LAND PATTERN
NOTES:
1. Dimensions are in millimeters.
Dimensions in ( ) for Reference Only.
2. Dimensioning and tolerancing conform to AMSE Y14.5m-1994.
3. Unless otherwise specified, tolerance : Decimal ± 0.05
4. Dimension applies to the metallized terminal and is measured
between 0.15mm and 0.30mm from the terminal tip.
5. Tiebar shown (if present) is a non-functional feature.
6. The configuration of the pin #1 identifier is optional, but must be
located within the zone indicated. The pin #1 identifier may be
either a mold or mark feature.
1