Package Outline Drawing (POD)

Plastic Packages for Integrated Circuits
Package Outline Drawing
L16.3x3A
16 LEAD THIN QUAD FLAT NO-LEAD PLASTIC PACKAGE
Rev 1, 7/11
4X 1.5
3.00
16X 0.50
A
B
13
6
PIN 1
INDEX AREA
16
6
PIN #1
INDEX AREA
1
3.00
12
1 .50 ± 0 . 15
9
(4X)
4
0.15
8
5
TOP VIEW
16X 0.40 ± 0.10
0.10 M C A B
+ 0.07
4 16X 0.23 - 0.05
BOTTOM VIEW
SEE DETAIL "X"
(
C
0.10 C
BASE PLANE
SEATING PLANE
0.08 C
0 . 75 ± 0.05
( 2. 80 TYP )
1. 50 )
SIDE VIEW
( 12X 0 . 5 )
( 16X 0 . 23 )
C
0 . 2 REF
5
0 . 00 MIN.
0 . 05 MAX.
( 16X 0 . 60)
TYPICAL RECOMMENDED LAND PATTERN
DETAIL "X"
NOTES:
1.
Dimensions are in millimeters.
Dimensions in ( ) for Reference Only.
2.
Dimensioning and tolerancing conform to AMSE Y14.5m-1994.
3.
Unless otherwise specified, tolerance: Decimal ± 0.05
4.
Dimension applies to the metallized terminal and is measured
between 0.15mm and 0.30mm from the terminal tip.
5.
Tiebar shown (if present) is a non-functional feature.
6.
The configuration of the pin #1 identifier is optional, but must be
located within the zone indicated. The pin #1 identifier may be
either a mold or mark feature.
1