Package Outline Drawing (POD)

Plastic Packages for Integrated Circuits
Package Outline Drawing
L12.4x4B
12 LEAD DUAL FLAT NO-LEAD PLASTIC PACKAGE
Rev 1, 03/15
3.20
4.00
2X 2.50
A
6
PIN 1
INDEX AREA
10X 0.50
PIN #1 INDEX AREA
B
6
1
12 X 0.55
6
4.00
(4X)
2.40
0.15
7
12
0.10 M C A B
TOP VIEW
4 12 x 0.25
BOTTOM VIEW
SEE DETAIL "X"
( 3.20)
0.10 C
C
0.90 MAX
SEATING PLANE
0.08 C
SIDE VIEW
3.65
( 2.40 )
C
12 X 0.75
0.2 REF
5
0 . 00 MIN.
0 . 05 MAX.
( 12X 0.25 )
( 10X 0 . 5 )
DETAIL "X"
TYPICAL RECOMMENDED LAND PATTERN
1
NOTES:
1.
Dimensions are in millimeters.
Dimensions in ( ) for Reference Only.
2.
Dimensioning and tolerancing conform to AMSE Y14.5m-1994.
3.
Unless otherwise specified, tolerance : Decimal ± 0.05
4.
Dimension b applies to the metallized terminal and is measured
between 0.15mm and 0.30mm from the terminal tip.
5.
Tiebar shown (if present) is a non-functional feature and may
be located on any of the 4 sides (or ends).
6.
The configuration of the pin #1 identifier is optional, but must be
located within the zone indicated. The pin #1 identifier may be
either a mold or mark feature.