Package Outline Drawing (POD)

Plastic Packages for Integrated Circuits
Package Outline Drawing
L16.4x4C
16 LEAD THIN QUAD FLAT NO-LEAD PLASTIC PACKAGE
Rev 0, 12/07
4X 1.95
4.00
12X 0.65
A
B
6
PIN 1
INDEX AREA
6
PIN #1 INDEX AREA
16
13
1
4.00
12
2 .1 0 ± 0 . 15
9
4
0.15
(4X)
5
8
0.10 M C A B
+ 0.07
4 0.3 - 0.05
TOP VIEW
16X 0.60 ± 0.10
BOTTOM VIEW
SEE DETAIL "X"
0.10 C
0 . 75 MAX
C
BASE PLANE
( 3. 60 TYP )
(
SEATING PLANE
0.08 C
2. 10 )
SIDE VIEW
( 12X 0 . 65 )
( 16X 0 . 30 )
C
( 16X 0 . 80 )
0 . 2 REF
5
0 . 00 MIN.
0 . 05 MAX.
TYPICAL RECOMMENDED LAND PATTERN
DETAIL "X"
NOTES:
1. Dimensions are in millimeters.
Dimensions in ( ) for Reference Only.
2. Dimensioning and tolerancing conform to AMSE Y14.5m-1994.
3. Unless otherwise specified, tolerance : Decimal ± 0.05
4. Dimension b applies to the metallized terminal and is measured
between 0.15mm and 0.30mm from the terminal tip.
5. Tiebar shown (if present) is a non-functional feature.
6. The configuration of the pin #1 identifier is optional, but must be
located within the zone indicated. The pin #1 identifier may be
either a mold or mark feature.
1