Plastic Packages for Integrated Circuits Package Outline Drawing L12.4x4C 12 LEAD THIN DUAL FLAT NO-LEAD PLASTIC PACKAGE (TDFN) Rev 1, 3/15 4.00 2.5 REF A PIN #1 INDEX AREA B 6 10x 0.50 1 6 12x 0.45 6 PIN #1 INDEX AREA 4.00 1.58 0.15 (4X) 12 7 0.10 M C A B 0.05 M C 4 12x 0.25 2.80 TOP VIEW BOTTOM VIEW SEE DETAIL "X" (2.80) 12x 0.65 0.10 C C SEATING PLANE 0.08 C 0.80 MAX SIDE VIEW (3.75) (1.58) 5 0.2 REF C (10x 0.5) 0.00 MIN. 0.05 MAX. (12x 0.25) DETAIL "X" TYPICAL RECOMMENDED LAND PATTERN NOTES: 1. Dimensions are in millimeters. Dimensions in ( ) for Reference Only. 2. Dimensioning and tolerancing conform to ASME Y14.5m-1994. 3. Unless otherwise specified, tolerance : Decimal ± 0.05 4. Lead width applies to the metallized terminal and is measured between 0.15mm and 0.30mm from the terminal tip. 5. Tiebar shown (if present) is a non-functional feature and maybe located on any of the 4 sides (or ends). 6. The configuration of the pin #1 identifier is optional, but must be located within the zone indicated. The pin #1 identifier may be either a mold or mark feature. 1