Package Outline Drawing (POD)

Plastic Packages for Integrated Circuits
Package Outline Drawing
L16.3x3C
16 LEAD THIN QUAD FLAT NO-LEAD PLASTIC PACKAGE
Rev 0, 2/09
4X 1.5
3.00
12X 0.50
A
B
6
PIN 1
INDEX AREA
6
PIN #1 INDEX AREA
16
13
12
3.00
1
1 .70
4
9
(4X)
+ 0.10
- 0.15
0.15
5
8
0.10 M C A B
+ 0.07
4 16X 0.23 - 0.05
TOP VIEW
16X 0.40 ± 0.10
BOTTOM VIEW
SEE DETAIL "X"
0.10 C
0 . 75 ± 0.05
C
BASE PLANE
SEATING PLANE
0.08 C
( 2. 80 TYP )
SIDE VIEW
(
1. 70 )
( 12X 0 . 5 )
( 16X 0 . 23 )
C
0 . 2 REF
5
0 . 00 MIN.
0 . 05 MAX.
( 16X 0 . 60)
TYPICAL RECOMMENDED LAND PATTERN
DETAIL "X"
NOTES:
1. Dimensions are in millimeters.
Dimensions in ( ) for Reference Only.
2. Dimensioning and tolerancing conform to AMSE Y14.5m-1994.
3. Unless otherwise specified, tolerance : Decimal ± 0.05
4. Dimension b applies to the metallized terminal and is measured
between 0.15mm and 0.30mm from the terminal tip.
5. Tiebar shown (if present) is a non-functional feature.
6. The configuration of the pin #1 identifier is optional, but must be
located within the zone indicated. The pin #1 indentifier may be
either a mold or mark feature.
1