ISL6423B ® Data Sheet April 10, 2007 Single Output LNB Supply and Control Voltage Regulator with I2C Interface for Advanced Satellite Set-Top Box Designs The ISL6423B is a highly integrated voltage regulator and interface IC, specifically designed for supplying power and control signals from advanced satellite set-top box (STB) modules to the low noise blocks (LNBs) of singe antenna ports. The device consists of a current-mode boost PWM and a low-noise linear regulator along with the circuitry required for 22kHz tone generation, modulation and I2C device interface. The device makes the total LNB supply design simple, efficient and compact with low external component count. The current-mode boost converters provides the linear regulator with input voltage that is set to the final output voltages, plus typically 0.8V to insure minimum power dissipation across each linear regulator. This maintains constant voltage drop across the linear pass element while permitting adequate voltage range for tone injection. The final regulated output voltage is available at output terminals to support the operation of an antenna port for single tuners. The outputs for each PWM can be controlled in two ways, full control from I2C using the VTOP and VBOT bits or set the I2C to the lower range i.e., 13V/14V, and switch to higher range i.e., 18V/19V, with the SELVTOP pin. All the functions on this IC are controlled via the I2C bus by writing 8 bits words onto the System Registers (SR). The same register can be read back, and five I2C bits will report the diagnostic status. Separate enable command sent on the I2C bus provides for standby mode control for the PWM and linear combination, disabling the output and forcing a shutdown mode. The output channel is capable of providing 750mA of continuous current. The overcurrent limit can be digitally programmed to four levels. The External modulation input EXTM can accept a modulated Diseqc command and transfer it symmetrically to the output. Alternatively the EXTM pin can be used to modulate the continuos internal tone. The FLT pin serves as an interrupt for the processor when any condition turns OFF the LNB controller (Over Temperature, Overcurrent, Disabled). The nature of the Disable can be read of the I2C registers. FN6412.1 Features • Single Chip Power solution - Operation for 1-Tuner/1-Dish Applications - Integrated DC/DC Converter and I2C Interface • Switch-Mode Power Converter for Lowest Dissipation - Boost PWMs with >92% Efficiency - Selectable 13.3V or 18.3V Outputs - Digital Cable Length Compensation (1V) - I2C and Pin Controllable Output • Output Back Bias Capability of 28V • I2C Compatible Interface for Remote Device Control • Registered Slave Address 0001 00XX • 2.5V, 3.3V, 5V Logic Compatible • External Pin to Toggle Between V and H Polarization • Built-In Tone Oscillator Factory Trimmed to 22kHz - Facilitates DiSEqC (EUTELSAT) Encoding - External Modulation Input • Internal Over-Temperature Protection and Diagnostics • Internal OV, UV, Overload and Overtemp Flags (Visible on I2C) • FLT signal • LNB Short-Circuit Protection and Diagnostics • QFN, EPTSSOP Packages • Pb-Free Available (RoHS Compliant) Applications • LNB Power Supply and Control for Satellite Set-Top Box Ordering Information PART NUMBER* ISL6423BERZ (Note) PART MARKING 6423BERZ TEMP. (°C) PACKAGE -20 to +85 24 Ld 4x4 QFN (Pb-free) PKG. DWG. # L24.4x4D ISL6423BEVEZ ISL6423BEVEZ -20 to +85 28 Ld EPTSSOP M28.173B (Pb-free) (Note) NOTE: Intersil Pb-free plus anneal products employ special Pb-free material sets; molding compounds/die attach materials and 100% matte tin plate termination finish, which are RoHS compliant and compatible with both SnPb and Pb-free soldering operations. Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020. Add “-T” suffix for tape and reel. 1 CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. 1-888-INTERSIL or 1-888-468-3774 | Intersil (and design) is a registered trademark of Intersil Americas Inc. Copyright Intersil Americas Inc. 2006, 2007. All Rights Reserved All other trademarks mentioned are the property of their respective owners. Pinouts ISL6423B (28 LD EPTSSOP) TOP VIEW 28 CPSWIN VCC 1 27 CPSWOUT NC 2 FLT 3 26 CPVOUT SGND 4 25 EXTM SGND 5 24 SDA TCAP 6 23 SCL ADDR0 7 22 TDOUT ADDR1 8 21 TDIN BYPASS 9 20 VO PGND 10 19 NC GATE 11 18 NC 17 AGND VSW 12 NC 13 16 SELVTOP CS 14 15 TXT 2 SGND FLT VCC CPSWIN CPSWOUT CPVOUT ISL6423B (24 LD QFN) TOP VIEW 24 23 22 21 20 19 17 SDA ADDR0 3 16 SCL ADDR1 4 15 TDOUT BYPASS 5 14 TDIN PGND 6 13 VO 7 8 9 10 11 12 AGND 2 SELVTOP TCAP TXT EXTM CS 18 VSW 1 GATE SGND FN6412.1 April 10, 2007 Block Diagram 11 17 16 23 4 3 7 Q OC1 3 OUVF ADDR0 ADDR1 SDA SCL ISELL&H PGND I2 C INTERFACE ENT - CS + ILIM1 CS AMP CLK1 13 12 + DIV & WAVE SHAPING REF VOLTAGE ADJ1 VREF1 INT TONE TONE INJ CKT VSW MSEL1 8 TTH TDIN - 14 OSC. BAND GAP REF VOLTAGE BGV TONE DECODER TTH VTOP VBOT TDOUT TXT THERMAL SHUTDOWN DCL ∑ SLOPE COMPENSATION 15 OTF OLF/BCF EN 9 FLT CLK1 S 6 ADDR1 ADDR0 SCL OUVF PWM LOGIC GATE SELVTOP DCL SDA OLF/BCF OVERCURRENT PROTECTION LOGIC SCHEME 1 COUNTER VO + - AGND EXT TONE CKT UVLO POR SOFT-START FN6412.1 April 10, 2007 NOTE: 5 1. Pinouts shown are for the QFN package. EN1/EN2 10 2 18 20 CPSWIN INT 5V SOFT-START CPSWOUT ENT1 EXTM BYPASS 24 SGND ON CHIP LINEAR TCAP 1 SGND TXT 22 VCC CHARGE PUMP CPVOUT 21 19 Typical Application Schematic QFN VIN RTN 0 FLT BAR EXTM 4 C24 1µF C29 1n C25 47n 0 R11 100 R12 100 SDA SCL L4 220µH C23 56µF C26 0 0.22µF 1µF R10 18 0 24 23 22 21 20 19 SGND EXTM TCAP SDA ADDR0 U2 SCL ADDR1 ISL6423ER TDOUT BYPASS TDIN PGND VO TPC6002 Q2 R7 0.22µF 15 VLNB R23 10k M6 NDS356AP D8 1.5KE24 R24 4.7k R13 4.7k 7 8 9 10 11 12 2 C28 0.1µF 18 17 16 15 14 13 C16 10n 1 2 3 0 2 C15 D6 CMS06 GATE VSW CS TXT SELVTOP AGND C27 1 2 3 4 5 6 1 SGND FLT VCC CPSWIN CPSWOUT CPVOUT 0 Q4 2N2222A RTN R22 47k R9 470 L5 15µH TXT R8 0.1 6 5 4 1 TDOUT C21 100pF SELVTOP D7 0 D5 0 L6 4.7µH 1 CMS06 CMS06 C22 56µF 0 C18 10µF 0 NOTE : SDA and SCL require pull up to the required logic level. 2 C19 10µF 0 C20 10µF 0 FN6412.1 April 10, 2007 Absolute Maximum Ratings Thermal Information Supply Voltage, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . 8.0V to 18.0V Logic Input Voltage Range (SDA, SCL, ENT, DSQIN 1 and 2, SEL18V 1 and 2) . -0.5V to 7V Thermal Resistance (Typical, Notes 2, 3) θJA (°C/W) θJC (°C/W) QFN Package (Notes 2, 3) . . . . . . . . . . 38 4.5 EPTSSOP Package (Notes 2, 3) . . . . . 35 2.5 Maximum Junction Temperature (Note 4) . . . . . . . . . . . . . . . +150°C Maximum Storage Temperature Range . . . . . . . . . . -40°C to +150°C Operating Temperature Range . . . . . . . . . . . . . . . . . -20°C to +85°C CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. NOTES: 2. θJA is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features. See Tech Brief TB379. 3. For θJC, the "case temp" location is the center of the exposed metal pad on the package underside. 4. +150°C max junction temperature is intended for short periods of time to prevent shortening the lifetime. Operation close to +150°C junction may trigger the shutdown of the device even before +150°C, since this number is specified as typical. Electrical Specifications VCC = 12V, TA = -20°C to +85°C, unless otherwise noted. Typical values are at TA = +25°C. EN = H, VTOP VBOT = L, ENT = L, DCL = L, IOUT = 12mA, unless otherwise noted. See software description section for I2C access to the system. PARAMETER SYMBOL TEST CONDITIONS MIN TYP MAX UNITS 8 12 14 V EN = L - 1.5 3.0 mA EN = VTOP = VBOT = ENT = H, No Load - 4.0 8.0 mA Start Threshold 7.5 - 7.95 V Stop Threshold 7.0 - 7.55 V Start to Stop Hysteresis 350 400 500 mV - 8196 - Cycles Operating Supply Voltage Range Standby Supply Current Supply Current IIN UNDERVOLTAGE LOCKOUT SOFT-START COMP Rise Time (Note 5) (Note 5) Output Voltage (Note 5) Line Regulation Load Regulation Dynamic Output Current Limiting VO1 (Refer to Table 1) 13.04 13.3 13.56 V VO1 (Refer to Table 1) 14.02 14.3 14.58 V VO1 (Refer to Table 1) 17.94 18.3 18.66 V VO1 (Refer to Table 1) 19.00 19.3 19.68 V DVO1, DVO2 VIN = 8V to 14V; VO = 13.3V - 4.0 40.0 mV VIN = 8V to 14V; VO = 18.3V - 4.0 60.0 mV DVO1, DVO2 IO = 0mA to 350mA - 50 80 mV IO = 0mA to 750mA - 100 200 mV DCL = 0, ISEL H = 0, ISEL L = 0 (Note 8) 275 305 345 mA DCL = 0, ISEL H = 0, ISEL L = 1 (Note 8) 515 570 630 mA DCL = 0, ISEL H = 1, ISEL L = 0 (Note 8) 635 705 775 mA DCL = 0, ISEL H = 1, ISEL L = 1 (Note 8) 800 890 980 mA - 900 - ms - 51 - ms IMAX Dynamic Overload Protection Off Time TOFF Dynamic Overload Protection On Time TON Static Output Current Limiting IMAX DCL = 1 (Note 8) - 1000 - mA Cable Fault CABF Threshold ICAB EN = 1, VO = 19V, No Tone. 2 10 20 mA 5 DCL = 0, Output Shorted (Note 8) FN6412.1 April 10, 2007 Electrical Specifications VCC = 12V, TA = -20°C to +85°C, unless otherwise noted. Typical values are at TA = +25°C. EN = H, VTOP VBOT = L, ENT = L, DCL = L, IOUT = 12mA, unless otherwise noted. See software description section for I2C access to the system. (Continued) PARAMETER SYMBOL TEST CONDITIONS MIN TYP MAX UNITS TONE OSCILLATOR Tone Frequency ftone ENT = H 20.0 22.0 24.0 kHz Tone Amplitude Vtone ENT = H, IO = 5mA 500 680 800 mV Tone Duty Cycle dctone ENT = H, 40 50 60 % Tone Rise or Fall Time Tr, Tf ENT = H, 5 10 14 μs TONE DECODER Input Amplitude Vtdin 200 - 1000 mV Frequency Capture Range Ftdin 17.5 - 26.5 kHz Input Impedance Zdet - 8.6 - kΩ Detector Output Voltage Vtdout_L Tone Present, ILOAD = 3mA - - 0.4 V Detector Output Leakage Itdout_H Tone absent, VO = 6V - - 10 μA Tone Decoder Rx Threshold VRXth TXT = L and TTH = 0 (Note 9) 100 150 200 mV Tone Decoder Tx Threshold VTXth TXT = H and TTH = 0 (Note 9) 400 450 500 mV IOUT = 750mA - 0.8 1.05 V LINEAR REGULATOR Drop-out Voltage Output Backward Leakage Current IBKLK EN = 0; VOBK = 27V - 2.0 3.0 mA Output Backward Leakage Current IBKLK EN = 0; VOBK = 28V - 3.0 17 mA Output Backward Current Threshold IBKTH EN = 1; VOFAULT = 19V (Note 7) - 140 - mA Output Backward Current Limit IBKLM EN = 1; VOFAULT = 19V (Note 7) - 350 - mA Output Backward Voltage VOBK EN = 0 - - 27 V Output Under Voltage (Asserted high during soft-start) OUVF bit is asserted high, Measured from the typ. output set value -6 - -2 % Output Over Voltage (Asserted high during soft-start) OUVF bit is asserted high, Measured from the typ. output set value +2 - +6 % Asserted LOW - - 0.8 V Asserted HIGH 1.7 - - V - 25 - μA - 700 - nA 325 450 500 mV TXT, EXTM, SELVTOP AND ADDR 0/1 INPUT PINs (Note 8) Input Current CURRENT SENSE (CS pin) Input Bias Current IBIAS Overcurrent Threshold VCS Static current mode, DCL = H ERROR AMPLIFIER Open Loop Voltage Gain AOL - 93 - dB Gain Bandwidth Product GBP - 14 - MHz Maximum Duty Cycle 90 93 - % Minimum Pulse Width - 20 - ns PWM 6 FN6412.1 April 10, 2007 Electrical Specifications VCC = 12V, TA = -20°C to +85°C, unless otherwise noted. Typical values are at TA = +25°C. EN = H, VTOP VBOT = L, ENT = L, DCL = L, IOUT = 12mA, unless otherwise noted. See software description section for I2C access to the system. (Continued) PARAMETER SYMBOL TEST CONDITIONS MIN TYP MAX UNITS 396 440 484 kHz Temperature Shutdown Threshold - 150 - °C Temperature Shutdown Hysteresis - 20 - °C OSCILLATOR Oscillator Frequency fo Fixed at (20)(ftone) Thermal Shutdown OTFI FLT (released) VO = 6V - - 10 μA FLT (asserted) ISINK = 3.2mA - - 0.4 V NOTES: 5. Internal digital soft-start 6. EXTM, TXT and SELVTOP and addr 0/1 pins have 200k internal pulldown resistors. 7. On exceeding this backward current limit threshold for a period of 2ms, the device enters the Backward dynamic current limit mode (350mA typ) and the BCF I2C bit is set. The dynamic current limit duty ratio during a back current fault is ON = 2ms/OFF = 50ms. The output will remain clamped to the fault output voltage till released. On removal of the fault condition the device returns to normal operation 8. In the Dynamic current limit mode the output is ON for 51ms and OFF for 900ms. But remains continuously ON in the Static mode. When tone is ON the minimum current limit is 50mA lower the values indicated in the table. Tone Waveform ENT I2C MSEL I2C EXTM PIN VOUT PIN 22kHz 22kHz 22kHz 22kHz 22kHz 22kHz INTERNAL TONE INTERNAL TONE Tr = 10µs TYP EXTERNAL TONE Tr = 10µs TYP RETURNS TO NOMINAL VOUT ~1 PERIOD AFTER THE LAST EXTM RISING EDGE T > 55µs; NOTES: 9. The signal pin TXT changes the decoder threshold during tone transmit and receive. TTH allows threshold control through I2C. 10. The tone rise and fall times are not shown due to resolution of graphics. It is 10µs typ for 22kHz. 11. The EXTM pins have input thresholds of Vil(max) = 0.8V and Vih(min) = 1.7V FIGURE 1. TONE WAVEFORM 7 FN6412.1 April 10, 2007 Typical Performance Curves 0.80 0.80 0.70 0.70 0.60 IOUT_max 0.50 IOUT (A) IOUT (A) 0.60 0.40 0.30 IOUT_max 0.50 0.40 0.30 0.20 0.20 0.10 0.10 0.00 0 20 40 60 80 0.00 0 20 TEMPERATURE (°C) FIGURE 2. OUTPUT CURRENT DERATING (EPTSSOP) 40 60 80 TEMPERATURE (°C) FIGURE 3. OUTPUT CURRENT DERATING (4x4 QFN) Functional Pin Description SYMBOL FUNCTION SDA Bidirectional data from/to I2C bus. SCL Clock from I2C bus. VSW Input of the linear post-regulator. PGND CS Dedicated ground for the output gate driver of respective PWM. Current sense input; connect the sense resistor Rsc at this pin for desired peak overcurrent value for the boost FET. The set peak limit is effective in the static mode current limit only i.e., DCL = HIGH. SGND Small signal ground for the IC. TCAP Capacitor for setting rise and fall time of the output voltage. Typical value is 0.1µF. BYPASS Bypass capacitor for internal 5V. TXT TXT is the Tone Transmit signal input used to change the Tone Decoder Threshold from TXT = 0, 200mV max during Receive to TXT = 1, 400mV min during Transmit. VCC Main power supply to the chip. GATE This output drives the boost FET gate. The output is held low when VCC is below the UVLO threshold. VO ADDR0 & ADDR1 Output voltage for the LNB is available at VO pin. Logic combination at the ADDR0 & 1 can select four different chip select addresses. EXTM This pin can be used in two ways: 1) As an input for externally modulated Diseqc tone signal which is transferred to the symmetrically onto VOUT 2) Alternatively apply a Diseqc modulation envelope which modulates an internal tone and then transfers it symmetrically onto VOUT FLT This is an Open Drain output from the controller. When the FLT goes low it indicates that an Over Temperature, Over load fault, UVLO, or an I2C reset condition has occurred. The processor should then look at the I2C register to get the actual cause of the error. A high on the FLT indicates that the device is functioning normally. CPVOUT, CPSWIN CPSWOUT A 47n charge pump decoupling capacitor is to be connected to CPVOUT. Connect a 1.5n capacitor between CPSWIN and CPSWOUT SELVTOP When this pin is low the VOUT is in the 13V, 14V range selected by the I2C bit VBOT. When this pin is high the 18V, 19V range selected by the I2C bit VTOP. The Voltage select pin enable VSPEN I2C bit must be set low for the SELVTOP pins to be active. Setting VSPEN high disables this pins and voltage selection will be done using the I2C bits VBOT and VTOP only. TDIN, TDOUT TDIN is the tone decoder input and TDOUT is the tone detector output. TDOUT is an open drain output 8 FN6412.1 April 10, 2007 Functional Description Linear Regulator The ISL6423B single output voltage regulator makes an ideal choice for advanced satellite set-top box and personal video recorder applications. The device utilizes built-in DC/DC step up converters that, operates from a single supply source ranging from 8V to 14V, and generates the voltage needed to enable the linear post-regulator to work with a minimum of dissipated power. An undervoltage lockout circuit disables the device when VCC drops below a fixed threshold (7.5V typ). The output linear regulator will sink and source current. This feature allows full modulation capability into capacitive loads as high as 0.75μF. In order to minimize the power dissipation, the output voltage of the internal step-up converter is adjusted to allow the linear regulator to work at minimum dropout. DiSEqC Encoding The internal oscillator is factory-trimmed to provide a tone of 22kHz in accordance with DiSEqC (EUTELSAT) standards. No further adjustment is required. The tone oscillator can be controlled either by the I2C interface (ENT bit) or by a dedicated pin (EXTM) that allows immediate DiSEqC data encoding separately for each LNB. All the functions of this IC are controlled via the I2C bus by writing to the system registers. The same registers can be read back, and four bits will report the diagnostic status. The internal oscillator operates the converters at twenty times the 22k tone frequency. The device offers full I2C compatibility, and supports 2.5V, 3.3V or 5V logic, up to an operational speed of 400kHz. If the Tone Enable (ENT) bit is set LOW and the MSEL bits set LOW through I2C, then the EXTM terminal activates the internal tone signal, modulating the DC output with a 680mVPP typical symmetrical tone waveform. The presence of this signal usually provides the LNB with information about the band to be received. Burst coding of the tone can be accomplished due to the fast response of the EXTM input and rapid tone response. This allows implementation of the DiSEqC (EUTELSAT) protocols. When the ENT bit is set HIGH, a continuous 22kHz tone is generated regardless of the EXTM pin logic status for the regulator channel LNB-A. The ENT bit must be set LOW when the EXTM pin is used for DiSEqC encoding. The EXTM accepts an externally modulated tone command when the MSEL I2C bit is set HIGH and ENT is set LOW. DiSEqC Decoder TDIN is the input to the tone decoder. It accepts and the tone signal derived from the VOUT thru the 10nF decoupling capacitor. The detector threshold can be set to 200mV max in the Receive mode and to 400mV min in the Transmit mode by means of the logic presented to the TXT pin. If tone is detected the open drain pin TDOUT is asserted low. This enables the tone diagnostics to be performed, apart from the normal tone detection function. 9 When the device is put in the shutdown mode (EN = LOW), the PWM power block is disabled. When the regulator blocks are active (EN = HIGH and VSPEN = LOW), the output can be controlled via I2C logic to be 13V/14V or 18V/19V (typical) by means of the VTOP and VBOT bits (Voltage Select) for remote controlling of non-DiSEqC LNBs. When the regulator blocks are active (EN = HIGH and VSPEN = HIGH), the VBOT and SELVTOP pin will control the output between 13V and 14V and the VTOP and SELVTOP pin will control the output between 18V and 19V. Output Timing The output voltage rise and fall times can be set by an the external capacitor on the TCAP pin. The output rise and fall times is given by the equation: 327.6T C = ------------------ΔV (EQ. 1) Where C is the TCAP value in nF, T is the required transition time in ms and ΔV is the differential transition voltage from low output voltage range to the high output range in Volts. The maximum recommended value for TCAP is 0.15µF. Too large a value of TCAP prevents the output from rising to the nominal value, within the soft-start time when the error amplifier is released. Too small a value of the TCAP can cause high peak currents in the boost circuit. For example, a 10V/ms slew on a 80µF VSW capacitor with an inductor of 15µH can cause a peak inductor current of approximately 2.3A. Current Limiting Dynamic current limiting block has four thresholds that can be selected by the ISEL H and ISEL L bits of the SR. Refer to Table 8 and Table 9 for threshold selection using these bits. The DCL bit has to be set to low for this mode of operation. In the dynamic overcurrent mode a fault exceeding the selected overcurrent threshold for a period greater than 51ms, will shutdown the output for 900ms, during which the I2C bit OLF is set high. At the end of 900ms the OLF bit is returned to the low state, a soft-start cycle (~20ms long) is initiated to ramp VSW and VOUT back up. If the fault is still present the overcurrent will be reached early in the soft-start cycle and the 51ms shutdown timer will be started again. If the fault is still present at the end of the 51ms, the OLF bit is again set high and the device once again enters the 900ms OFF time. This dynamic operation greatly reduces the power dissipation in a short circuit condition, while still ensuring excellent power-on start-up in most conditions. FN6412.1 April 10, 2007 However, there could be some cases in which a highly capacitive load on the output may cause a difficult start-up when the dynamic protection is selected. This can be solved by initiating any power start-up in static mode (DCL = HIGH) and then switching to the dynamic mode (DCL = LOW) after a predetermined interval. When in static mode, the OLF bit goes HIGH when the current clamp limit is reached and returns LOW at the end of initial power-on soft-start. In the Static mode the output current through the linears is limited to a 990mA typ. When a 19.3V line is connected onto a VOUT1 or 2 that has been set to 13.3V the linear will then enter a back current limited state. When a back current of greater than 140mA typical is sensed at the lower FET of the linear for a period greater that 2ms the output is disabled for a period of 50ms and the BCF bit is set. If the 19.3V remains connected, the output will cycle through the ON = 2ms/OFF = 50ms. The output will return to the setpoint when the fault is removed. BCF bit is set high during the 50ms OFF period. Thermal Protection This IC is protected against overheating. When the junction temperature exceeds +150°C (typical), the step-up converter and the linear regulator are shut off and the OTF bit of the SR is set HIGH. When the junction is cooled down to +130°C (typical), normal operation is resumed and the OTF bit is reset LOW. If a part is repeatedly driven to the overtemp shutdown temperature the chip is latched off after the fourth occurrence and the I2C OTF bit is latched high and FLT_bar low. This OTF counter and FLT_bar can be reset and the chip restarted by either a power down/up and reload the I2C or power can be left on and the reset accomplished by toggling the I2C bit EN low then back high. I2C Bus Interface for ISL6423B (Refer to Philips I2C Specification, Rev. 2.1) Data transmission from main microprocessor to the ISL6423B and vice versa takes place through the two wire I2C bus interface, consisting of the two lines SDA and SCL. Both SDA and SCL are bidirectional lines, connected to a positive supply voltage via a pull up resistor. (Pull up resistors to positive supply voltage must be externally connected). When the bus is free, both lines are HIGH. The output stages of ISL6423B will have an open drain/open collector in order to perform the wired-AND function. Data on the I2C bus can be transferred up to 100Kbps in the standard-mode or up to 400Kbps in the fast-mode. The level of logic “0” and logic “1” is dependent of associated value of VDD as per electrical specification table. One clock pulse is generated for each data bit transferred. Data Validity The data on the SDA line must be stable during the HIGH period of the clock. The HIGH or LOW state of the data line can only change when the clock signal on the SCL line is LOW. Refer to Figure 4. SDA SCL DATA LINE CHANGE STABLE OF DATA DATA VALID ALLOWED FIGURE 4. DATA VALIDITY START and STOP Conditions External Output Voltage Selection When the I2C bit VSPEN is set high the output voltage can be selected by the I2C bus. Additionally, the package offers the pin SELVTOP for independent 13 thru 19V output voltage selection., when the VSPEN bit is set low. A summary of the voltage control is given in Table 1. For further details refer to the individual registers SR1 and SR3 As shown in Figure 5, START condition is a HIGH to LOW transition of the SDA line while SCL is HIGH. The STOP condition is a LOW to HIGH transition on the SDA line while SCL is HIGH. A STOP condition must be sent before each START condition. TABLE 1. VSPEN VTOP VBOT SELVTOP VOUT 0 x 0 0 13.3V 0 x 1 0 14.3V 0 0 x 1 18.3V 0 1 x 1 19.3V 1 0 0 x 13.3V 1 0 1 x 14.3V 1 1 0 x 18.3V 1 1 1 x 19.3V 10 SDA SCL S P START CONDITION STOP CONDITION FIGURE 5. START AND STOP WAVEFORMS FN6412.1 April 10, 2007 ISL6423B Software Description Byte Format Every byte put on the SDA line must be eight bits long. The number of bytes that can be transmitted per transfer is unrestricted. Each byte has to be followed by an acknowledge bit. Data is transferred with the most significant bit first (MSB). Acknowledge The master (microprocessor) puts a resistive HIGH level on the SDA line during the acknowledge clock pulse (Figure 6). The peripheral that acknowledges has to pull down (LOW) the SDA line during the acknowledge clock pulse, so that the SDA line is stable LOW during this clock pulse. (Of course, set-up and hold times must also be taken into account.) The peripheral which has been addressed has to generate an acknowledge after the reception of each byte, otherwise the SDA line remains at the HIGH level during the ninth clock pulse time. In this case, the master transmitter can generate the STOP information in order to abort the transfer. The ISL6423B will not generate the acknowledge if the POWER OK signal from the UVLO is LOW. Interface Protocol The interface protocol is comprised of the following, as shown below in Table 2: • A start condition (S) • A chip address byte (MSB on left; the LSB bit determines read (1) or write (0) transmission) (the assigned I2C slave address for the ISL6423B is 0001 0XXX) • A sequence of data (1 byte + Acknowledge) • A stop condition (P) TABLE 2. INTERFACE PROTOCOL S 0 0 0 1 0 A1 A0 R/W ACK Data (8 bits) ACK P System Register Format • R, W = Read and Write bit • R = Read-only bit All bits reset to 0 at Power-On TABLE 3. STATUS REGISTER (SR1) SCL 1 8 2 9 R, W R, W R, W R R R R R SR1H SR1M SR1L OTF CABF OUVF OLF BCF SDA TABLE 4. TONE REGISTER (SR2) MSB START ACKNOWLEDGE FROM SLAVE R, W R, W R, W R, W R, W R, W R, W R, W SR2H SR2M SR2L ENT MSEL TTH X X FIGURE 6. ACKNOWLEDGE ON THE I2C BUS TABLE 5. COMMAND REGISTER (SR3) Transmission Without Acknowledge R, W R, W R, W R, W R, W R, W Avoiding detection of the acknowledgement, the microprocessor can use a simpler transmission; it waits one clock without checking the slave acknowledging, and sends the new data. SR3H SR3M SR3L DCL VSPEN X This approach, though, is less protected from error and decreases the noise immunity. SR4H SR4M SR4L R, W R, W ISELH ISELL TABLE 6. CONTROL REGISTER (SR4) R, W R, W R, W R, W EN R, W R, W R, W R, W VTOP VBOT Transmitted Data (I2C bus WRITE mode) When the R/W bit in the chip is set to 0, the main microprocessor can write on the system registers (SR2 thru SR4) of the ISL6423B via I2C bus. These will be written by the microprocessor as shown below. The spare bits of registers can be used for other functions. 11 FN6412.1 April 10, 2007 TABLE 7. STATUS REGISTER SR1 CONFIGURATION SR1H SR1M SR1L OTF CABF OUVF OLF BCF FUNCTION 0 0 0 X X X X X SR1 is selected 0 0 0 X X X 0 X IOUT ≤ set limit, Normal Operation 0 0 0 X X X 1 X IOUT > Static/Dynamic Limiting Mode/Power blocks disabled 0 0 0 X X X X 0 Iobck ≤ set limit, Normal Operation 0 0 0 X X X X 1 Iobck > Dynamic Limiting Mode / Power blocks disabled 0 0 0 X X 0 X X VIN/VOUT within specified range 0 0 0 X X 1 X X VIN/VOUT is not within specified range 0 0 0 X 0 X X X Cable is connected, Io is >20mA 0 0 0 X 1 X X X Cable is open, Io <2mA 0 0 0 0 X X X X TJ ≤130°C, Normal operation 0 0 0 1 X X X X TJ >150°C, Power blocks disabled TABLE 8. TONE REGISTER SR2 CONFIGURATION SR2H SR2M SR2L ENT MSEL TTH X X FUNCTION 0 0 1 X X X X X SR2 is selected 0 0 1 0 0 X X X Int Tone = 22kHz, modulated by EXTM, Tr, Tf = 10µs typ 0 0 1 0 1 X X X Ext 22k modulated input, Tr, Tf = 10µs typ 0 0 1 1 0 X X X Int Tone = 22kHz, modulated by ENT bit, Tr, Tf = 10µs typ 0 0 1 X X 0 X X TXT = 0; Decoder Rx threshold is set at 200mV max 0 0 1 X X 1 X X TXT = 0; Decoder Tx threshold is set at 400mV min NOTE: X indicates “Read Only” and is a “Don’t Care” for the Write mode. TABLE 9. COMMAND REGISTER SR3 CONFIGURATION SR3H SR3M SR3L DCL VSPEN X ISELH ISELL FUNCTION 0 1 0 X X X X X SR3 is selected 0 1 0 0 X X 0 0 IOUT limit threshold = 305mA typ. 0 1 0 0 X X 0 1 IOUT limit threshold = 570mA typ. 0 1 0 0 X X 1 0 IOUT limit threshold = 705mA typ. 0 1 0 0 X X 1 1 IOUT limit threshold = 890mA typ. 0 1 0 1 X X X X Dynamic current limit NOT selected 0 1 0 0 X X X 0 1 0 X 0 X X X SELVTOP H/W pin Enabled 0 1 0 X 1 X X X SELVTOP H/W pin Disabled Dynamic current limit selected NOTE: X indicates “Read Only” and is a “Don’t Care” for the Write mode. 12 FN6412.1 April 10, 2007 TABLE 10. CONTROL REGISTER SR4 CONFIGURATION SR4H SR4M SR4L EN X X VTOP VBOT FUNCTION 0 1 1 1 X X 0 0 SR4 is selected 0 1 1 1 X X 0 0 VSPEN = SELVTOP = 0, VOUT = 13V, VBOOST = 13V + VDROP 0 1 1 1 X X 0 1 VSPEN = SELVTOP = 0, VOUT = 14V, VBOOST = 14V + VDROP 0 1 1 1 X X 1 0 VSPEN = SELVTOP = 0, VOUT = 13V, VBOOST = 13V + VDROP 0 1 1 1 X X 1 1 VSPEN = SELVTOP = 0, VOUT = 14V, VBOOST = 14V + VDROP 0 1 1 1 X X 0 0 VSPEN = 0,SELVTOP = 1, VOUT = 18V, VBOOST = 18V + VDROP 0 1 1 1 X X 0 1 VSPEN = 0,SELVTOP = 1, VOUT = 18V, VBOOST = 18V + VDROP 0 1 1 1 X X 1 0 VSPEN = 0,SELVTOP = 1, VOUT = 19V, VBOOST = 19V + VDROP 0 1 1 1 X X 1 1 VSPEN = 0,SELVTOP = 1, VOUT = 19V, VBOOST = 19V + VDROP 0 1 1 1 X X 0 0 VSPEN = 1,SELVTOP = X VOUT = 13V, VBOOST = 13V + VDROP 0 1 1 1 X X 0 1 VSPEN = 1,SELVTOP = X VOUT = 14V, VBOOST = 14V + VDROP 0 1 1 1 X X 1 0 VSPEN = 1,SELVTOP = X VOUT = 18V, VBOOST = 18V + VDROP 0 1 1 1 X X 1 1 VSPEN = 1,SELVTOP = X VOUT = 19V, VBOOST = 19V + VDROP 0 1 1 0 X X X X PWM and Linear for channel 1 disabled NOTE: X indicates “Read Only” and is a “Don’t Care” for the Write mode. Received Data (I2C bus READ MODE) ADDR0 and ADDR1 Pins The ISL6423B can provide to the master a copy of the system register information via the I2C bus in read mode. The read mode is Master activated by sending the chip address with R/W bit set to 1. At the following Master generated clock bits, the ISL6423B issues a byte on the SDA data bus line (MSB transmitted first). Connecting these pin to GND the chip I2C interface address is 0001000, but, it is possible to choose between four different addresses by setting these pins to the logic levels indicated in Table 11. At the ninth clock bit the MCU master can: • Acknowledge the reception, starting in this way the transmission of another byte from the ISL6423B. • Not acknowledge, stopping the read mode communication. The read only bits of the register SR1 convey diagnostic information about the ISL6423B, as indicated in the Table 7. TABLE 11. ADDRESS PIN CHARACTERISTICS VADDR ADDR1 ADDR0 VADDR-1 “0001000” 0 0 VADDR-2 “0001001” 0 1 VADDR-3 “0001010” 1 0 VADDR-4 “0001011” 1 1 Power–On I2C Interface Reset The I2C interface built into the ISL6423B is automatically reset at power-on. The I2C interface block will receive a Power OK logic signal from the UVLO circuit. This signal will go HIGH when chip power is OK. As long as this signal is LOW, the interface will not respond to any I2C commands and the system register SR1 thru SR4 are all initialized to all zero, thus keeping the power blocks disabled. Once the VCC rises above UVLO, the POWER OK signal to the I2C is asserted high, and the I2C interface becomes operative and the SR’s can be configured by the main microprocessor. About 400mV of hysteresis is provided in the UVLO threshold to avoid false triggering of the Power-On reset circuit. (I2C comes up with EN = 0; EN goes HIGH at the same time as (or later than) all other I2C data for that PWM becomes valid). 13 FN6412.1 April 10, 2007 I2C Bit Description I2C Electrical Characteristics TABLE 12. BIT NAME DESCRIPTION EN ENable Output for channels 1 and 2 VTOP Voltage TOP select i.e. 18V, 19V for channels 1 and 2 VBOT Voltage BOTtom select i.e. 13V, 14V for channels 1 and 2 ENT ENable Tone MSEL Modulation SELect DCL Dynamic Current Limit select VSPEN Voltage Select Pin ENable PARAMETER TEST CONDITION MIN TYP MAX Input Logic High, VIH SDA, SCL Input Logic Low, VIL SDA, SCL 0.8V Input Logic Current, IIL SDA, SCL; 0.4V < VDD< 3.3V 10μA Input Logic Current IOL VOL = 0.4V ISELH Current limit “I” SELect High and Low bit and ISELL Input Hysteresis SDA, SCL OTF Over Temperature Fault bit CABF CABle Fault or open status bit SCL Clock Frequency OUVF Over and Under Voltage Fault status bit OLF Over Load Fault status bit BCF Backward Current Fault bit TTH Tone THreshold is the OR of the signal pin TXT 14 Input Filter Spike reject 2.0V 3mA 165mV 200mV 235mV 0 100kHz 400kHz 50ns FN6412.1 April 10, 2007 Package Outline Drawing L24.4x4D 24 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE Rev 2, 10/06 4X 2.5 4.00 A 20X 0.50 B PIN 1 INDEX AREA PIN #1 CORNER (C 0 . 25) 24 19 1 4.00 18 2 . 50 ± 0 . 15 13 0.15 (4X) 12 7 0.10 M C A B 0 . 07 24X 0 . 23 +- 0 . 05 4 24X 0 . 4 ± 0 . 1 TOP VIEW BOTTOM VIEW SEE DETAIL "X" 0.10 C C 0 . 90 ± 0 . 1 BASE PLANE ( 3 . 8 TYP ) SEATING PLANE 0.08 C SIDE VIEW ( 2 . 50 ) ( 20X 0 . 5 ) C 0 . 2 REF 5 ( 24X 0 . 25 ) 0 . 00 MIN. 0 . 05 MAX. ( 24X 0 . 6 ) DETAIL "X" TYPICAL RECOMMENDED LAND PATTERN NOTES: 1. Dimensions are in millimeters. Dimensions in ( ) for Reference Only. 2. Dimensioning and tolerancing conform to AMSE Y14.5m-1994. 3. Unless otherwise specified, tolerance : Decimal ± 0.05 4. Dimension b applies to the metallized terminal and is measured between 0.15mm and 0.30mm from the terminal tip. 5. Tiebar shown (if present) is a non-functional feature. 6. The configuration of the pin #1 identifier is optional, but must be located within the zone indicated. The pin #1 indentifier may be either a mold or mark feature. 15 FN6412.1 April 10, 2007 Thin Shrink Small Outline Exposed Pad Plastic Packages (EPTSSOP) M28.173B N INDEX AREA E 0.25(0.010) M 28 LEAD THIN SHRINK SMALL OUTLINE PLASTIC PACKAGE B M INCHES E1 GAUGE PLANE -B- SYMBOL A 1 2 3 L TOP VIEW 0.05(0.002) -A- SEATING PLANE A D α -C- c A1 b 0.10(0.004) 0.10(0.004) M 2 C A M B S 3 MILLIMETERS MAX - MIN MAX NOTES 0.047 - 1.20 - A1 0.002 0.006 0.05 0.15 - A2 0.031 0.051 0.80 1.05 - b 0.0075 0.0118 0.19 0.30 9 c 0.0035 0.0079 0.09 0.20 - D 0.378 0.386 9.60 9.80 3 E1 0.169 0.177 4.30 4.50 4 e A2 e 1 0.25 0.010 MIN 0.026 BSC 0.65 BSC - E 0.246 0.256 6.25 6.50 - L 0.0177 0.0295 0.45 0.75 6 N 28 28 7 α 0° 8° 0° 8° - P - 0.138 - 5.50 11 P1 - 0.118 - 3.0 11 Rev. 0 6/05 NOTES: P1 1. These package dimensions are within allowable dimensions of JEDEC MO-153-AET, Issue E. 2. Dimensioning and tolerancing per ANSI Y14.5M-1982. 3. Dimension “D” does not include mold flash, protrusions or gate burrs. Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006 inch) per side. 4. Dimension “E1” does not include interlead flash or protrusions. Interlead flash and protrusions shall not exceed 0.15mm (0.006 inch) per side. 5. The chamfer on the body is optional. If it is not present, a visual index feature must be located within the crosshatched area. 6. “L” is the length of terminal for soldering to a substrate. 7. “N” is the number of terminal positions. 8. Terminal numbers are shown for reference only. 9. Dimension “b” does not include dambar protrusion. Allowable dambar protrusion shall be 0.08mm (0.003 inch) total in excess of “b” dimension at maximum material condition. Minimum space between protrusion and adjacent lead is 0.07mm (0.0027 inch). 10. Controlling dimension: MILLIMETER. Converted inch dimensions are not necessarily exact. (Angles in degrees) 11. Dimensions “P” and “P1” are thermal and/or electrical enhanced variations. Values shown are maximum size of exposed pad within lead count and body size. N P BOTTOM VIEW All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems. Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries. For information regarding Intersil Corporation and its products, see www.intersil.com 16 FN6412.1 April 10, 2007