Plastic Packages for Integrated Circuits Package Outline Drawing L40.5x5 40 LEAD THIN QUAD FLAT NO-LEAD PLASTIC PACKAGE Rev 2, 7/14 4x3.60 5.00 ± 0.05 A B 36x0.40 6 PIN #1 INDEX AREA 3.50 5.00 ± 0.05 6 PIN 1 INDEX AREA 0.15 (4X) 40x0.4 ± 0.1 BOTTOM VIEW TOP VIEW 0.20 b 4 0.10 M C A B PACKAGE OUTLINE 0.40 0.750 ± 0.10 SEE DETAIL “X” SIDE VIEW 3.50 5.00 0.050 // 0.10 C C BASE PLANE SEATING PLANE 0.08 C (36x0.40) 0.2 REF (40x0.20) C (40x0.60) 5 0.00 MIN 0.05 MAX TYPICAL RECOMMENDED LAND PATTERN DETAIL "X" NOTES: 1. Dimensions are in millimeters. Dimensions in ( ) for Reference Only. 2. Dimensioning and tolerancing conform to AMSE Y14.5m-1994. 3. Unless otherwise specified, tolerance: Decimal ± 0.05 4. Dimension b applies to the metallized terminal and is measured between 0.15mm and 0.27mm from the terminal tip. 5. Tiebar shown (if present) is a non-functional feature. 6. The configuration of the pin #1 identifier is optional, but must be located within the zone indicated. The pin #1 identifier may be 7. JEDEC reference drawing: MO-220WHHE-1 either a mold or mark feature. 1