Plastic Packages for Integrated Circuits Thin Plastic Quad Flatpack Packages (TQFP) Q32.7x7 (JEDEC MS-026ABA ISSUE B) 32 LEAD THIN PLASTIC QUAD FLATPACK PACKAGE INCHES D D1 -D- -B- -A- E E1 e PIN 1 SEATING A PLANE -H- 0.08 0.003 -C- MILLIMETERS SYMBOL MIN MAX MIN MAX NOTES A - 0.047 - 1.20 - A1 0.002 0.005 0.05 0.15 - A2 0.038 0.041 0.95 1.05 - b 0.012 0.018 0.30 0.45 6 b1 0.012 0.016 0.30 0.40 - D 0.350 0.358 8.90 9.10 3 D1 0.272 0.280 6.90 7.10 4, 5 E 0.350 0.358 8.90 9.10 3 E1 0.272 0.280 6.90 7.10 4, 5 L 0.018 0.029 0.45 0.75 N 32 32 e 0.031 BSC 0.80 BSC 7 Rev. 0 10/06 NOTES: 1. Controlling dimension: MILLIMETER. Converted inch dimensions are not necessarily exact. 2. All dimensions and tolerances per ANSI Y14.5M-1982. 3. Dimensions D and E to be determined at seating plane -C- . 0.08 0.003 M D S C A-B S b 11o-13o 0.020 0.008 MIN b1 0o MIN A2 A1 GAGE PLANE 0o-7o 0.25 0.010 11o-13o 1 5. Dimensions D1 and E1 do not include mold protrusion. Allowable protrusion is 0.25mm (0.010 inch) per side. 6. Dimension b does not include dambar protrusion. Allowable dambar protrusion shall not cause the lead width to exceed the maximum b dimension by more than 0.08mm (0.003 inch). 0.09/0.16 0.004/0.006 BASE METAL WITH PLATING L 4. Dimensions D1 and E1 to be determined at datum plane -H- . 0.09/0.20 0.004/0.008 7. “N” is the number of terminal positions.