Plastic Packages for Integrated Circuits Thin Plastic Quad Flatpack Packages (TQFP) Q64.10x10 (JEDEC MS-026ACD ISSUE B) D 64 LEAD THIN PLASTIC QUAD FLATPACK PACKAGE D1 -D- INCHES -B- -AE E1 e PIN 1 SEATING A PLANE -H- 0.08 0.003 -C- MILLIMETERS SYMBOL MIN MAX MIN MAX NOTES A - 0.047 - 1.20 - A1 0.002 0.005 0.05 0.15 - A2 0.038 0.041 0.95 1.05 - b 0.007 0.010 0.17 0.27 6 b1 0.007 0.009 0.17 0.23 - D 0.468 0.476 11.90 12.10 3 D1 0.390 0.397 9.9 10.10 4, 5 E 0.468 0.476 11.9 12.10 3 E1 0.390 0.397 9.9 10.10 4, 5 L 0.018 0.029 0.45 0.75 N 64 64 e 0.020 BSC 0.50 BSC 7 Rev. 0 7/98 NOTES: 1. Controlling dimension: MILLIMETER. Converted inch dimensions are not necessarily exact. 2. All dimensions and tolerances per ANSI Y14.5M-1982. 3. Dimensions D and E to be determined at seating plane -C- . 0.08 M C A-B S 0.003 D S b 11o-13o 0.020 0.008 MIN b1 0o MIN A2 A1 GAGE PLANE L 0o-7o 11o-13o 0.25 0.010 77 0.09/0.16 0.004/0.006 BASE METAL WITH PLATING 0.09/0.20 0.004/0.008 4. Dimensions D1 and E1 to be determined at datum plane -H- . 5. Dimensions D1 and E1 do not include mold protrusion. Allowable protrusion is 0.25mm (0.010 inch) per side. 6. Dimension b does not include dambar protrusion. Allowable dambar protrusion shall not cause the lead width to exceed the maximum b dimension by more than 0.08mm (0.003 inch). 7. “N” is the number of terminal positions.