Plastic Packages for Integrated Circuits Thin Plastic Quad Flatpack Packages (TQFP) Q32.5x5 (JEDEC MS-026AAA ISSUE B) 32 LEAD THIN PLASTIC QUAD FLATPACK PACKAGE MILLIMETERS D D1 -D- -B- -A- E E1 e PIN 1 SEATING A PLANE -H- 0.08 0.003 -C- SYMBOL MIN MAX NOTES A - 1.20 - A1 0.05 0.15 - A2 0.95 1.05 - b 0.17 0.27 6 b1 0.17 0.23 - D 6.90 7.10 3 D1 4.90 5.10 4, 5 E 6.90 7.10 3 E1 4.90 5.10 4, 5 L 0.45 0.75 N 32 e 0.50 BSC 7 Rev. 0 2/07 NOTES: 1. Controlling dimension: MILLIMETER. Converted inch dimensions are not necessarily exact. 2. All dimensions and tolerances per ANSI Y14.5M-1982. 3. Dimensions D and E to be determined at seating plane -C- . 0.08 0.003 M C A-B S 11o-13o 0.020 0.008 MIN b 5. Dimensions D1 and E1 do not include mold protrusion. Allowable protrusion is 0.25mm (0.010 inch) per side. 0.09/0.16 A2 A1 0.004/0.006 GAGE PLANE 11o-13o 1 6. Dimension b does not include dambar protrusion. Allowable dambar protrusion shall not cause the lead width to exceed the maximum b dimension by more than 0.08mm (0.003 inch). 7. “N” is the number of terminal positions. BASE METAL WITH PLATING L 0.25 0.010 4. Dimensions D1 and E1 to be determined at datum plane -H- . b1 0o MIN 0o-7o D S 0.09/0.20 0.004/0.008